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PCIM 2009 – For those who could not be there
 To my mind, the most comprehensive Power show in Europe, PCIM Nuremberg May 12-14, was this year just as appealing as in previous years. Although the perceived attendance was down a little, the show was still busy with good reports of business enquiries from most of the companies I saw there. This has got to be the ultimate measurement criterion.
From what I saw, there is still plenty of innovation in our industry and despite the downturn, or whatever the current ‘proper’ terminology is, I found the show bristling with enthusiasm and confidence for the mid and longer term. Almost everyone is suffering at the moment, people are facing and experiencing real hardships, but the positive attitude and relentless drive to succeed I found inspiring.
What other sector of the electronics industry has such a ‘share-of-mind’ in consumers, companies and government administrations? Power has got to be the one industry that will not only keep our mobile phones and gadgets running smarter and longer, but that can also make our lives and those of our children less hazardous by the improvement of our environment and the over-dependence of fuel from politically unstable geographies.
For those who could not attend this year, I have compiled (in alphabetical order by company name) a selection of the products and services from the companies I met at the show. It was, as ever, a great show and one that should be supported, even (or perhaps, especially) in these tough times.
All the best!
Editor-in-Chief, PSDE
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Avago Technologies New Ultra-Low Power Optocoupler Technology Avago Technologies announced that it has developed a new ultra-low power optocoupler technology that will pave the way for a new generation of optical isolators that can operate as much as 90 percent less power than standard optocouplers available today. The total power consumption of this new innovative optocoupler design is below 2mA compared to 15mA for a standard optocoupler and 4 to 5 mA for magnetic isolators. These new ultra-low power optocouplers target designers of communication interfaces (RS485, CANBus, and I2C), microprocessor system interfaces, and digital isolation for A/D, D/A conversion applications. Avago is a leading supplier of analog interface components for communications, industrial and consumer applications.
 Avago’s innovative ultra-low power optocoupler design features an optically coupled gate that combines a high efficiency light emitting diode (LED) and an integrated high gain photo detector enabling designers to interface the optocoupler input directly from a microcontroller output – avoiding the use of buffers to drive the LED. Moreover, these next-generation optocouplers support both 3.3V and 5V supply voltages and provides reliable system performance in industrial temperatures ranging from –40 to +105 degrees C.
The unique design of Avago’s next-generation optocouplers offers a significant reduction in power requirements without compromising on isolation and insulation performance.
In particular the use of thick insulation materials facilitates good high voltage lifetime and meets the requirements of safe insulation for reinforced applications.
The use of a LED input together with a faraday shielded photodetector circuit enables best in class application level common mode noise immunity.
Engineering samples are now available for customer evaluation. More information on Avago’s optocouplers can be found at www.avagotech.com/optocouplers
First Extended Temperature 2.5Amp Gate Drive Optocouplers for Industrial Apps Avago announced the industry’s first extended temperature 2.5 Amp gate drive optocouplers, for use in a wide range of industrial applications. Avago’s ACPL-312U, which is a member of the R2CouplerTM family, incorporates an alloy lead frame to offer superior heat dissipation, which allows it to operate over an extended industrial temperature range from -40 to 125 degrees C. These new extended temperature optocouplers from Avago targets designers of isolated IGBT/power MOSFET gate drives, industrial inverters, AC and brushless DC motor drives, and uninterruptable power supplies. Avago is a leading supplier of analog interface components for communications, industrial and consumer applications.
Avago’s ACPL-312U provides reinforced insulation and reliability that delivers safe signal isolation critical in automotive and high temperature industrial applications. The low-power ACPL-312U optocoupler series has been designed with under voltage lock-out protection (UVLO), high common mode rejection (CMR) performance and high speed response to improve efficiency. Moreover, it is developed with a double wire bonding process to provide added redundancy and reduce wire breakage during high temperature operation. Additionally, the low 5mA maximum supply current of this series of optocouplers allows bootstrap operation and reduces IC power consumption. As a result, costly isolated power supplies or DC-to-DC converter can be reduced when these gate drive optocouplers are used.
Avago’s series of 2.5A gate drive optocouplers contain an AIGaAs LED, which is optically coupled to an integrated circuit with a power output stage. The high operating voltage range of the output stage provides the drive voltages required by gate controlled devices. Moreover, the voltage and current supplied by these optocouplers are ideal for directly driving IGBTs with ratings up to 1200 V/100 Amps. For IGBTs with higher ratings, this series of optocouplers can be used to drive a discrete power stage which drives the IGBT gate.
The ACPL-312U series of optocouplers come in a standard DIP-8 package with a creepage of 7.4mm and clearance of 7.1mm. These DIP-8 packages are compliant to most industrial safety standards such as IEC/EN/DIN EN 60747-5-5, UL 1577 and CSA.
Avago’s ACPL-312U extended temperature 2.5A gate drive optocouplers are available now through Avago’s direct sales channel and worldwide distribution partners. More information on Avago’s isolation amplifiers can be found at www.avagotech.com/optocouplers.
www.avagotech.com AVX Corporation
LED Lighting Connector Family to Include Board-to-Board Versions AVX, a leading manufacturer of advanced passive components and interconnect solutions, has expanded its wire-to-board connector product offering to include board-to-board connectors specifically designed for the LED lighting industry. Designated the 9159 Series, the cost-effective connectors provide design flexibility by providing both card edge (one-piece) and plug and socket (two-piece) interconnect options. The connectors feature a small footprint, making them ideal for applications where multiple printed circuit boards need to be plugged together, such as LED lighting strips.
The double-ended card edge version provides a simple and direct connection to both ends of a standard PCB with tin plated pads in 2, 3, 4 and 5 positions. These 2.0mm pitch connectors support 3 amp current and 250 voltage ratings. The connectors are 5.0mm high and come in both black and white options.
The two-piece connector version is surface mounted on one side of the PCB, which allows the LED’s to be placed on the other side to maintain consistent spacing. These 3.0mm pitch and 3.0mm high connectors are only 5.50mm wide when mated together, thus maximizing board space for other components. Tooled in 2, 3, 4 and 5 position, these connectors are also available in black and white options.
“The application value of AVX’s original Insulation Displacement Connectors (IDC), which provides simple and reliable wire-to-board interconnection for the LED market, is now being carried over into the board-to-board arena. AVX is committed to developing new connectors specifically for the LED lighting market as it evolves and matures.” said Tom Anderson, Product Marketing Manager at AVX. “These new connectors provide simple and cost effective packaging options to help our customers achieve their product goals and application requirements.”
The new 9159 Series connectors provide simple, yet reliable termination of PCB’s. The 9159 Series is tested to Industrial levels of shock, vibration and temperature cycling per IEC specifications to assure they can withstand the harsh environments they were designed for. The connectors are ideal for use in LED lighting strips for sports arena signs, display cases, lighted cabinets, fluorescent tube replacement and architectural lights used for building feature enhancement or internal feature lighting. The connectors also suited for rugged industrial and automotive applications.
Both versions of the 9159 Series connectors are rated in current at 3A and have operating temperature ranges of -55°C to +125°C. These connectors are supplied in tape and reel packing and are RoHS-compliant.
Rugged SMD Tantalum Capacitors Target Harsh Environments Up to 200°C
A pioneering technology from AVX, the THJ 200C SMD tantalum capacitor delivers 1000 hours continuous operation at 200°C with derating. Based on a unique design, distinct manufacturing processes and special ageing techniques, these capacitors guarantee high temperature performance for a variety of harsh applications such as oil drilling, aerospace/defense and automotive.
The capacitors are initially available in two E-case sizes: E 220?F rated at 10V for 3V rail application at 200°C and E 100?F rated at 16V for 5V rail application at 200°C. Key features of the THJ 200C SMD tantalum capacitors include a small surface mount package that lends itself to fast pick and place assembly techniques and a negative temperature coefficient that ensures no localized heating occurs in the capacitor, thus avoiding thermal runaway and ultimately destruction or operational degradation of the device.
Gold plated termination for hybrid assembly is provided as conventional tin/tin-lead finished terminations have melting points that are too low for reliable operation at 200degC. Long life is also a key attribute with leakage current after 1000 hours operation at 200degC still less than 1mA. All THJ 200C capacitors are designed to withstand a 3x reflow soldering process at 260degC and are RoHS compatible.
In oil and gas applications the THJ 200C SMD tantalum capacitors are ideal for use in dc/dc converters found in drilling heads that are subjected to rising ambient temperature with depth. Enabling companies to enhance their usage of electronics up to higher temperatures leads to higher profit as deeper situated commodities are more easily and cheaply accessed. In these applications the 16V capacitor is suitable for ?5V analogue circuits, while the 10V capacitor is used for 2.5V and 3.3V digital circuits.
Typical aerospace and defense applications include high temperature engine and turbo fan control as well as control and sensing electronics placed near the outer shells of rockets and space shuttles. A key requirement here is reliability under harsh conditions.
Automotive applications require reliability and long life at elevated temperature levels. High capacitance devices rated at 16V are ideal for use in a variety of mechanisms such as in the latest generation of smaller gearboxes and embedded alternators.
According to Technical Marketing Manager, Tomas Zednicek: “These 200°C capacitors currently have no direct surface-mount competition and their small size has the advantage of enabling oil drilling heads to be either miniaturized or equipped with advanced features. Further, by eliminating the need for through-hole technology in the end product, with the benefits of full automation manufacturers are able to reduce manufacturing costs and increase reliability.”
AVX’s Tantalum City – ‘Where Passives Never Sleep’ AVX Corporation, a leading manufacturer of advanced passive components and leaded solutions, has just released ‘Tantalum City’, a new CD from its Tantalum and Niobium Oxide division which is much more than a standard catalogue of parts and specs.
The interactive CD, while containing full technical specifications of AVX’s broad and widening tantalum and OxiCap product families, also contains full details of the company’s manufacturing capabilities, approvals and certifications, applications notes, white papers and a huge amount of other information. Presented in an entertaining, inviting style where users access information by ‘visiting’ buildings in AVX’s Tantalum City, the CD also includes interesting artwork, games and screen-savers.
Comments Thomas Zednicek, Worldwide Technical Marketing Manager, Tantalum products: “We have tried to make this CD informative and fun. The electronics community is innovative and creative and with this CD we have tried to present our technology to reflect this.”
The Tantalum City CD is freely available from AVX or the application can be downloaded at www.avxta.com. A preview can also be seen on YouTube – search under ‘AVX, Tantalum City’.
www.avx.com
CeramTec AG CeramCool® Liquid Cooling for Almost Any Cooling Capacity Air cooling reaches its limits at very high power densities. This is where liquid cooling is best suited. CeramCool, the ceramic heatsink for high power applications, profits from the electrically insulating characteristic and inertness of ceramics. 
CeramCool Liquid cooling allows almost any needed cooling capacity. Here the power density of 290W is managed with only 120mm lengths
No corrosion can cause trouble. The concept follows the same goal as for air cooled heatsinks: Shortest (thermal) distance between heat source and heat drain. With CeramCool Liquid Cooling it is feasible that for example cooling water is only 2mm away from the LED heat slug. No other concept can do this in combination with the durable nature of ceramics. Almost any needed cooling capacity is feasible! Additionally multilateral electrical circuits can be printed directly on CeramCool without creating thermal barriers.
CeramTec AG is a global manufacturer of high-performance ceramics. With a comprehensive materials portfolio it serves areas such as medical technology, automobile construction and electronics.
www.ceramtec.com
CT-Concept
Dual Channel Ultra-compact Low-cost SCALE-2 Driver Core The new low-cost SCALE-2 dual-driver core 2SC0108T combines unrivalled compactness with broad applicability. The driver was designed for universal applications requiring high reliability. The 2SC0108T drives all usual IGBT modules up to 600A/1200V or 450A/1700V. The embedded paralleling capability allows easy inverter design covering higher power ratings. Multi-level topologies are also supported. 
CONCEPT’s 2SC0108T combines unrivalled compactness with broad applicability
The 2SC0108T is the most compact driver core available for industrial applications, with a footprint of only 45 x 34.3mm and an insertion height of 16mm. It allows even the most restricted insertion spaces to be efficiently used. Compared with conventional drivers, the highly integrated SCALE-2 chipset allows about 85% of components to be dispensed with. This advantage is impressively reflected in increased reliability at simultaneously minimized cost.
The 2SC0108T combines a complete two-channel driver core with all components required for driving, such as an isolated DC/DC converter, short-circuit protection as well as supply voltage monitoring. Each of the two output channels is electrically isolated from the primary side and the other secondary channel.
An output current of 8A and 1W drive power is available per channel, making the 2SC0108T an ideal driver platform for universal usage in small and medium power applications. The driver provides a gate voltage swing of +15V/–8V. The turn-on voltage is regulated to maintain a stable 15V regardless of the output power level. Its outstanding EMC allows safe and reliable operation in even hard industrial applications.
Dual Channel High-Power High-Frequency SCALE-2 Driver Core The new SCALE-2 dual driver core 2SC0650P combines highest power density with broad applicability. The driver is designed for both high-power and high-frequency applications requiring maximum reliability. It is suitable for IGBTs with reverse voltages up to 1700V and also features a dedicated MOSFET mode. The embedded paralleling capability allows easy inverter design covering higher power ratings. Multi-level topologies are also supported. 
CONCEPT’s 2SC0650P combines highest power density with broad applicability
CONCEPT’s patented planar-transformer technology assures efficient and high-voltage isolation with long-term reliability and sets new milestones in compactness, interference immunity and performance. Its outstanding EMC with a dv/dt strength of more than 100V/ns allows safe and reliable operation in even the toughest industrial applications. Thanks to its ultra-flat design with an insertion height of only 7mm and a footprint of 57 x 62mm, the 2SC0650P can efficiently utilize even the most constrained insertion spaces. Compared with conventional drivers, the highly integrated SCALE-2 chipset allows about 85% of components to be dispensed with. This advantage is impressively reflected in increased reliability at simultaneously minimized cost.
Equipped with the latest SCALE-2 technology, the driver core opens up the possibility of working with clock frequencies of up to 150kHz – at best-in-class efficiency. The 2SC0650P combines a complete two-channel driver core with all components required for driving, such as an isolated DC/DC converter, short-circuit protection, improved active clamping as well as supply voltage monitoring. Each of the two output channels is electrically isolated from the primary side and the other secondary channel.
IGBT Mode An output current of 50A and 6W drive power is available per channel, making the 2SC0650P an ideal driver platform both for high-power modules and parallel circuits. In the dedicated IGBT mode, the driver provides a gate voltage swing of +15V/–10V. The turn-on voltage is regulated to maintain a stable 15V regardless of the output power level. Superior EMC with dv/dt > 100V/ns allows reliable operation even in the industry’s harshest environments. The 2SC0650P is suited for high-power IGBTs with blocking voltages up to 1700V.
MOSFET Mode A dedicated MOSFET mode is implemented in the 2SC0650P. It allows any gate voltage swing of +10V…+20V/0V to make the most of the driver’s 150kHz switching speed. With the high output power, very short delay, and extremely small jitter, the 2SC0650P driver core has been specifically designed for high-power and ultra-fast switching to fully exploit the capabilities of state-of-the-art MOS power devices.
Benefits in Fast-Switching Applications Fast switching not only requires high drive power and maximum frequency but also relies on tight control over crucial parameters such as the driver’s delay time and the associated jitter. A fast driver with a short delay introduces significantly less phase lag into the power system’s control loop. Less phase lag is of great importance for maintaining the stability of the control loop, thus allowing the benefits of fast switching to be fully exploited.
The 2SC0650P shares the SCALE-2 performance figures of fast signal transmission with less than 80ns delay time and extremely low jitter of less than ±1ns. It is this unique combination of high output power and stable precision that makes the 2SC0650P the first choice for highly optimized systems, where tight control over timing margins is mandatory.
The Company CT-Concept Technologie AG is a privately owned Swiss company founded in 1986. It is worldwide technology and market leader in the sector of IGBT drivers for mid to high-power applications and winner of several technology and innovation prizes.
Products CONCEPT offers the largest selection of IGBT drivers for practically every conceivable application. All CONCEPT products are characterized by top technology, first-class functionality, ultra-high quality, unrivalled reliability and an optimum price-performance ratio.
www.IGBT-Driver.com
Danfoss Substrate Free Molded Power Module
Danfoss presented an impressive transfer molded package for low voltage semiconductor power modules. It consists of a leadframe with power MOSFETs and other components soldered to it, housed using the transfer molding process. The great advantage of this new package is that the leadframe is handled as a single part, even though different electrically isolated leadframe areas are provided in the package.
This is an alternative solution for molded low voltage power modules. Based on leadframes instead of DBC substrates, the power modules become even more compact and simple. The thermal property of copper provides excellent heat spreading; heat transfer and electrical resistance of leads can be tailored by the copper thickness.
The mold compound can be an off-the-shelf material, since the same material combination is used in discrete components. Cost savings for a Substrate Free Mold Module (SFM) can be tremendous, since DBC’s as well as CTE-matched mold compounds contribute considerably to the packaging cost. A major challenge for the substitution of the DBC by a leadframe is its design, requiring electrically isolated areas in the center of the module.
Normally, a design solution would lead to two, three or even more parts of the leadframe, which will have to be individually handled in the manufacturing processes, adding manufacturing complexity and cost to the modules.
With the Danfoss solution, the leadframe consists of a single part, providing excellent manufacturability, since the individual leadframe areas will be punched open after the molding process. As a consequence, there is no limitation in the design of electrically isolated areas, although the leadframe is handled in one piece.
The leadframe requires no additional metallization layers, as terminals or pins of bondable frame modules do. The SFM simply consists of the absolute minimum of ingredients to ensure performance fulfilling all application specific requirements.
Fig 1. View on the back-side of the SFM
Layout and Design
The layout of the SFM consists of a structured single part leadframe. Since the leadframe will have to be transfer molded afterwards, the outline of the housing is defined by a so called dam bar. The dam bar serves multiple functions: - Simplifies the handling of the un-molded leadframe; the dam bar holds together the different copper parts.
- In the transfer molding process it serves as a gasket (dam) between the upper and lower mold tool, ensuring that the mold compound is not squeezed out of the mold tool.
After the transfer molding process, the dam bar is removed by a punching step. It is no longer a part of the layout. Instead, individual copper parts are left, mainly serving electrical and thermal functions.
Creating a leadframe layout for say, a six pack power module requires electrically isolated copper areas in the center of the leadframe. Obviously, it is not possible to connect those areas to the dam bar in order to open these connections later by cutting them off from the dam bar. Even if there were no layout constraints, this would be very space consuming.
The alternative (for the SFM) is to connect the electrically isolated areas with each other in a way that every single part is connected with its neighbors. To obtain electrical isolation, these connectors will have to be removed after molding in the same way as the dam bar has to be removed (see fig. 2).
Fig 2. Leadframe layout, dam bar and handling connector points
These “handling connector points” are an innovative and very elegant layout specialty to overcome the necessity of having diverse individual metal parts, which would lead to comparably high manual handling cost during volume manufacturing. The other leadframe elements would be designed according to the application specific requirements.
The top view of an SFM shows the two openings in the mold body that provide access to the handling connector points (see fig. 3). The module on the left side still contains the dam bar and the handling connector points. The module on the right side is shown after removing the dam bar and the handling connector points. The leadframe terminals are already formed according to the design requirements (trim & form). 
Fig 3. Top view of an SFM before and after trim & form
Process The manufacturing process flow is shown in fig. 4. 
Fig 4. Manufacturing process flow of SFM
The manufacturing process of an SFM can be summarized as follows:
• Based on a single part leadframe.
• Solder paste is applied to the die bonding and SMD positions by screen printing or dispensing.
• Die bonding is performed. Optionally, SMD pick & place might be added.
• Soldering, in a vacuum soldering process.
• The fully equipped leadframe is cleaned from flux.
• Wire bonding, using Al large wire.
• Transfer molding process.
• Trim & form process is combined with the opening of the handling connector points.
• After final electrical test, the module may be marked.
The result is a module with as few as possible ingredients, which can be manufactured applying well known processes and materials.
Fig 5. Top view of a fully processed SFM
Thermal Stack Comparing the thermal stacks of a module with DBC and an SFM has shown significant advantages of the SFM. The principle of “reduce to the max” leads to a powerful thermal stack which directly spreads the heat under the chips and onto the heatsink via thermal interface material (TIM). The excellent heat spreading properties of the copper leadframe reduce the thermal resistance of the TIM layer due to the wide area of heat transfer. Thus the temperature of the power semiconductors is kept as low as possible. The thickness and the layout of the copper leadframes can be modified in order to tailor the thermal properties of the SFM.
www.danfoss.com
Diotec Semiconductor
Half Bridge Device Saves Space and Costs in Power Supplies and Drives Diotec introduced a new device called the S16 series. It is a half bridge or so-called voltage doubler – meaning two diodes in series come in one TO-263/D²PAK outline. Two or three of such devices can easily form a single or three-phase input rectifier circuit. It improves automation and eliminates the bridge/heatsink manual assembly process in power supplies and drives up to several 100 Watts. Transistors for such applications are widely available in SMD packages; the new device allows now to build the complete power stage in SMD, using automated soldering processes. It saves space, costs and optimizes thermal resistance.
The S16 series contains of two nominal 8 Amp diodes, which can be used to build up a maximum 16 Amp single phase or 24 Amp three phase bridge. The reverse voltage is available up to 1000 Volts, and forward surge rating is maximum 135 Amp at 50 Hz half sine wave pulse.
Diotec Semiconductor AG of Germany is a manufacturer of discrete semiconductor diodes and rectifiers with more than 30 years of experience in this field. The company specializes in high volume manufacturing as well as customized solutions in 4 factories around the world and offers short cycle times / great flexibility and detailed technical support.
www.diotec.com
Electronic Concepts
Proven Replacements for Electrolytic Capacitor Banks Electronic Concepts, an Irish capacitor manufacturer, launched two new series of filter capacitors whose high energy density makes them a suitable substitute for electrolytic capacitors. The UP3 and UL9 series are self-healing, metallized polypropylene capacitors. The key advantages over electrolytic capacitors are; a life of at least 100,000 hours at a maximum temperature of 70°C, low ESL and ESR values, a high current capability of triple the peak current, and a surge voltage capability of 1.5 times the rated voltage.
The rated voltage of the UP3 series extends from 700 to 3,000V, the maximum current to 100Arms and the standard capacitance from 65 to 2,100 microfarads with a tolerance of 10%. Series resistance is in the range of 0.6 to 6.5mOhm, while the permitted peak currents are between 1,350 and 13,000A. The dielectric loss factor is 2x10-4 and the capacitors have an operating temperature range of -40°C to +85°C. The dielectric strength between the case and the terminals is tested for 3kV at 50Hz for 10s. Other routine tests are for capacitance, dissipation factor, series resistance, dielectric strength between the terminals and an external inspection, all in accordance with IEC61071.
The UL9 series has essentially the same characteristics as the UP3 series, as it is manufactured using the same technology. The parallel wiring of discrete individual components allows greater capacitances and consequently larger case designs. While the 40 members of the UP3 series are accommodated in an aluminum cylinder case with a diameter of 85 to 136mm and a height of 130 to 230mm, the 28 members of the UL9 series are housed in cuboid aluminum cases with lengths of 320 to 470mm, widths of 95 to 145mm and a height of 330mm. The UL9 series is available with capacitances of 380 to 17,100 microfarads. The terminals are available in screw type and also available with solid bus terminals which are suitable for IGBT direct mounting. Additional capacitance values, voltages and mechanics are available on request.
The film capacitors are destined for power conversion applications as developers can replace electrolytic capacitor banks with these components.
www.electronicconcepts.ie Fairchild Semiconductor
Highlights Energy-Efficient Solutions Fairchild Semiconductor, winners of PSDE’s Green Power Leadership Awards, demonstrated its innovative and highly efficient solutions for power supplies, lighting, motor control, automotive and industrial applications at PCIM.
The company unveiled its broad range of integrated motor drive solutions that drive highly efficient inverter-based motors and its comprehensive solutions for linear fluorescent lamps (LFLs), compact fluorescent lamps (CFLs), HID and high brightness (HB) LEDs. Fairchild will demonstrate cutting-edge products that enable precision and fuel efficiency in automotive applications and the many ways it reduces design complexity; and its suite of robust and high-performance solutions for the industrial market. With a global focus on alternative energy, Fairchild also showed its highly efficient and cost-effective solutions for photovoltaic inverters.
Primary Side Regulation PWM Controllers Simplify Design in High Brightness LEDs
Fairchild addressed a critical need in the high brightness (HB) light emitting diodes (LED) market with its primary side regulation (PSR) pulse-width modulation (PWM) controllers that simplify design, reduce board space and provide important performance advantages.
The FSEZ1016A is an EZSWITCH™ that integrates a PSR PWM controller with a power MOSFET and the FAN100 is a PSR PWM controller. Through this integration, these controllers achieve the most accurate constant current (CC) through their built-in proprietary TRUECURRENT™ technology and tight constant voltage (CV) without using secondary-side feedback circuitry. By tightening the constant current over a wide voltage range, the same circuit can accommodate different numbers of LED units in a string, increasing design flexibility, accelerating time-to-market and stretching the lifetime of HB LEDs. With this high level of integration, these PSR PWM controllers conserve board space, accommodating the form factor of lamp cases that continue to diminish in size.
The FSEZ1016A and FAN100 feature a proprietary green-mode function that provides off-time modulation to linearly decrease the PWM frequency under light-load conditions. They also minimize power consumption (standby power at no load condition <0.15W) by reducing the secondary-side feedback circuitry and components. All of these power-saving features are integral in enabling power supplies to meet stringent energy efficiency specifications. In addition, these PSR PWM controllers offer robust protection features such as under-voltage lockout (UVLO), over voltage protection (OVP) and over temperature protection (OTP).
These PSR PWM controllers enhance Fairchild’s extensive power offerings to enable energy-efficient electronics. These products maximize energy savings in power-sensitive applications such as power adapters, power supplies, lighting applications, computers, industrial controls and home appliances.
Samples are available now with delivery 12 weeks ARO
www.fairchildsemi.com
Ferraz Shawmut
Surge Trap® Fail-Safe Surge Protective Devices
These important devices prevent damage caused by transient over-voltages in industrial electrical equipment and installations which can be disruptive, dissipative or destructive whatever their origin. Frequent examples of this are found in power or equipment disturbances, on and off switching transients, lightning strikes and utility grid switching transients.
The core of Surge Trap is a Thermally Protected Metal Oxide Varistor (TPMOV®), a patented technology developed by Ferraz Shawmut. It leads to fail-safe surge protective devices needing no fuse for overcurrent protection. 
 Ferraz Shawmut comprehensive Surge Trap® Fail-safe Surge Protective Devices
The Ferraz Shawmut Thermally Protected MOV has been developed to assist in eliminating the failure characteristics of Metal-Oxide-Varistors. The TPMOV is a fail-safe device. It is composed of a voltage clamping device and a disconnecting apparatus that monitors the status of the metal oxide disk. In the event that the disk is approaching breakdown it is effectively disconnected from system power. The TPMOV is rated for 40ka of 8/20us surge current. The TPMOV ratings are available from 150V to 550V. The TPMOV has been designed with two built in isolated indicating features. The first is a visual indicator. When the unit has disconnected from system power, two isolated pins can be seen at the top of the TPMOV enclosure. The second feature is a remote indicator composed of a N/O micro switch. In the event that the TPMOV has disconnected system power, the switch will change status. These features lower costly engineering time that would be required for traditional MOV products.
Surge Trap devices are easy to install and are DIN-rail mountable. They are easy to retrofit by using the company’s Pluggable model. Here, the user has only to replace the plug unit without removing the base. Pluggable is the premium offering in the Surge Trap line, while Modular is an economic alternative. The UL and IEC models are also suitable for photovoltaic applications. There is also an option with a front visual indicator which communicates the status of the TPMOV. Remote signaling is a further option via an auxiliary micro switch.
Surge Trap® is a cost-effective solution against overvoltage transients requiring no fuse holder and no additional wiring. It provides significant cost savings and reduced installation time. With the range of Pluggable and Modular models Surge Trap forms the core of a flexible high-tech protection solution.
www.ferrazshawmut.com
Fuji Electric
Fuji Electric and Semikron Team up Fuji Electric Device Technology Co., Ltd. , Japan, leading global manufacturer of power semiconductor components in the third-highest ranking of worldwide IGBT module supplier market share and Semikron International GmbH, Germany, market leader for diodes and thyristor modules with a 37% market share and expert in packaging technology for power semiconductor modules, signed a supply and licence agreement at Semikron in Nuremberg. Fuji Electric will supply IGBT semiconductor chips to SEMIKRON; in return Semikron will supply Fuji Electric with freewheeling and rectifier diode chips, and module cases in spring contact technology. Power modules with spring contacts will be manufactured by Fuji Electric under licence.
Since the first announcement of their collaboration Fuji is now supplying MiniSKiiP-PIM-Modules from 8 to 100A and a blocking voltage of 1200V.
At the same time Fuji has started the mass-production of the newest IGBT-generation (V-series) applying FS-Trench-Technologies and providing lower total-losses and improved EMI-characteristics at the same time. V-series IGBTs will be used for the complete range of Fuji Mini-SKiiP-Modules. 
Dual-Spring
Dual-Spring & Dual-Pin
Fuji-High-Power Modules with Low Internal Inductance The internal inductance (only 7nH or less) of Fuji’s new High Power Module is the lowest in the world in comparable High-Power IGBT-Modules.
By an improved internal configuration Fuji design engineers realized this low inductance 190mm x 140mm package which represents the best-in-class value.
Besides this large HPM Fuji has the following line-up: 140x130mm 2x 600, 800, 1200A 1200 or 1700V
140x130mm 1x 1200, 1600A 1200 or 1700V
140x 190mm 1x 2400, 3600A 1200 or 1700V 
High Power Dual Module
Fuji Re-Structures Power-Modules Production Capacities From Beginning of April 2009 Fuji Electric Device Technology started its activities to re-structure its production facilities for power-semiconductor modules (such as IGBT, IPM, and HPM). These activities are scheduled to be completed during the Fiscal Year 2009 (Mar’09~April`10).
From April 2009 Fuji will manufacture these products in its new factory in Malaysia or in its mother-factory in Matsumoto.
In parallel to the scheduled production-transfer the Power-Module-Assembly in Omachi (Japan/Nagano) will be closed down.
Furthermore the production of Fuji’s latest IGBT-Chip-Generations is planned to be started in the new Wafer-fab at the Malaysia-plant.
www.fujielectric.de
Hitachi Europe Ltd
New E2 Series IGBT technology
Hitachi Power Devices Division (PDD) demonstrated its leading-edge IGBT technology and the latest power semiconductor modules. The company offers a comprehensive range of power semiconductors including IGBTs, high voltage ICs and power diodes.
The new E2 series IGBTs implement a new fine pattern silicon process which enables the active cell area to be increased. The benefits provided by the new E2 series process enable a more cost effective production process, increased current capability, improved short circuit durability and similar switching characteristics as existing E series products. Time to market for existing users of E series IGBTs migrating to E2 series IGBTs can therefore be significantly reduced.
Hitachi IGBTs, HVICs and Diodes encompass advanced technology and durable build quality to meet the highest quality standards. Hitachi PDD supports customers in a wide range of industry sectors including renewable energy, medical, transportation, automotive and industrial.
www.hitachi.eu/pdd
Infineon
SmartPIM and SmartPACK Modules with PressFIT Assembly Infineon Technologies offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security.
Infineon introduced its new Smart family of IGBT modules. The housing design of the Smart modules allows the deployment of self-acting PressFIT technology to assemble a Smart module to the printed circuit board and to the heat sink in a single-step mounting process using one screw only. By offering a high-quality alternative of strong reliability to today’s solder connections, Infineon fulfils the needs of inverter designs in the range of up to 55 kW. Smart modules enable power converter system solutions optimized for various general-purpose and variable drives, Uninterruptible Power Supply (UPS), inductive heating and welding equipment, solar inverters and air conditioning systems.  Innovative and time saving PressFIT technology with self-acting assembly mounts to the heat sink in a single step
Safe and Simple Self-acting PressFIT Assembly The innovative combination of the renowned PressFIT technology with the self-acting assembly and mounting to the heat sink in one single step succeeds to simplify the manufacturing process and significantly reduces manufacturing time to a few seconds. By tightening the screw, the counter holder presses the PressFIT pins into the holes on the PCB. A cold-welded and reliable gas-tight connection is generated. The module is mechanically fixed to the heat sink and the PCB onto the module. Due to the innovative housing concept with an inner module core and an outer frame the sensitive components, such as IGBT chips, diodes and the ceramic, are secured during mounting and over lifetime, so DCB (Direct Copper Bonding) cracks are almost impossible.
The Smart family The IGBT modules SmartPACK1 (six pack configuration) and SmartPIM1 (six pack configuration with input rectifier and brake chopper) are the first members of the Smart family of power modules covering an inverter power range from approximately 2.2 kW to 11 kW. With SmartPIM2, SmartPACK2, SmartPIM3 and SmartPACK3, which will follow later, the whole family will cover a current range of up to 200 A distributed over the different housing sizes. Therefore, SmartPIM and SmartPACK modules are available for inverters ranging up to 55 kW.
Availability Samples of the Smart modules are available in Q3 2009 with start of production scheduled for Q4 2009.
Further information on Infineon’s new Smart module family of SmartPIM and SmartPACK modules is available at www.infineon.com/highpower. For Infineon’s product portfolio of power semiconductors and modules please go to www.infineon.com/power
www.infineon.com
Intersil
10A Highly Integrated Power Module Features PWM, Drivers, MOSFETs and Inductor in Tiny QFN Package Intersil introduced the ISL8201M, a highly integrated Power Conversion Module that saves space, reduces cost, and simplifies design.
The ISL8201M is a high-efficiency, low-noise, highly integrated DC/DC power solution in a thermally enhanced QFN package. Included in the package is a high performance PWM controller capable of switching at 600kHz, power MOSFETs, an inductor, and all the passive components required for a complete DC/DC power solution. The ISL8201M simplifies power supply design as only minimal external components are needed to implement a complete power solution.
This small form factor saves considerable board space while the high integration reduces procurement and placement costs in various applications such as telecommunication, data communication, electronic data processing, wireless network systems, medical and instrumentation, and point-of-load applications based on a distributed-bus architecture. Also, an onboard input filter supports ultra-low noise operation thus reducing EMI.
The ISL8201M is capable of delivering 10A (17A peak) output current with up to 95% efficiency, without the need for heat sinks or airflow to meet power specifications. Other features include internal compensation, internal soft-start, auto-recovery overcurrent protection, an enable option, and pre-biased output start-up capability. The high integration and performance of the ISL8201M is housed in a tiny 15x15x3.5mm QFN package that is designed to offer optimum heat transfer through the PCB for excellent thermal performance. A large copper plate under the package allows the ISL8201M to achieve a power density of approximately 200W/in3, roughly four times that of conventional open-frame modules, thereby eliminating the need for heat sinks. The QFN package improves adherence to the PCB and improves overall reliability of end products. Additionally, all functional pins are brought out on the sides to make probing and debugging easier. The ISL8201M is available in a 15-lead QFN package.
Digital Power Management IC Features Zilker Labs’ Patented Digital-DC™ Technology Intersil introduced the ZL2008, a high-performance synchronous step-down DC-DC converter with pin-strap compensation and current sharing. Taking advantage of Zilker’s patented Digital-DC™ technology, the ZL2008 is designed for digital power supply module and system designers who demand easy-to-use board-level power supply configuration to keep ahead of rapidly changing market requirements.
Key Features and Benefits - Easy-to-use pin-strap compensation and current sharing. The compensation and transient response of the ZL2008 can be optimized for load current and output capacitance by adjusting resistor pin-straps. Current sharing of up to eight devices in parallel with individual phase enable/disable pins is easily configurable.
- Pin-strap power management configuration. Advanced power management features such as digital soft-start delay and ramp, sequencing, tracking and margining are fast and easy to implement. Power supply reliability and availability can be improved through real-time monitoring using the I2C/SMBus interface with the PMBus protocol.
- Interoperability with Zilker’s Digital-DC device family. The ZL2008 includes the Digital-DC bus for seamless interoperability between Zilker Labs devices to simplify power and fault management. Customers can take advantage of the entire family of Digital-DC devices for all DC power conversion and management needs.
The ZL2008 is a synchronous buck converter with integrated 3A MOSFET drivers that operate on single supply from 3V to 14V. Output voltages range from 0.54V to 5.5V with ±1% output voltage accuracy and 200kHz to 1.4MHz operation. In addition, there is current sharing with individual phase enable/disable pins, optional I²C/SMBus configuration, and external clock synchronization. Power management features include coincidental/ratiometric tracking, power up/down sequencing, voltage margining, and voltage and current monitoring as well as internal temperature monitoring. There is extensive fault handling for all parameters thanks to the on-board Snapshot™ parameter capture. The product also has on-chip non-volatile memory (NVM) for storing custom configurations. The ZL2008 is available in 6x6mm 36-lead QFN package.
www.intersil.com
International Rectifier 200V IC for Automotive Powertrain and Battery Management IR introduced the AUIRS2003S 200V IC for low- mid- and high-voltage automotive applications including automotive pre-charge switch and stepper drives and DC-DC converters.
Qualified to AEC-Q100 standards, the AUIRS2003S is a rugged, flexible high speed power MOSFET driver with dependent high- and low-side referenced output channels tailored for use in harsh automotive environments and under-the-hood applications. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction while the floating channel can be used to drive an N-channel power MOSFET in the high-side configuration operating up to 200V. The new device also offers low quiescent current that enables a low-cost bootstrap power supply for the high-side circuitry.
“With its host of protection features, the AUIRS2003S is designed to provide a rugged and flexible driver IC solution specifically designed to meet the challenge of automotive powertrain and battery management applications,” said Henning Hauenstein, vice president of IR’s Automotive Products.
The AUIRS2003S features high-side output in phase with the input signal and low-side output out of phase with the input signal. The new device accepts input logic levels of 3.3V, 5V and 15V with standard CMOS or LSTTL outputs and offers a comprehensive set of protection features including under-voltage lockout (UVLO), deadtime protection, and negative voltage spike (Vs) immunity to protect against catastrophic events during high-current switching and short circuit conditions.
The new device utilizes IR’s advanced high-voltage IC process which incorporates next-generation high-voltage level-shifting and termination technology to deliver superior electrical over-stress protection and higher field reliability.
Availability Offered in an 8-pin SOIC package, the automotive-qualified device is lead-free and RoHS compliant.
SmartRectifier™ IC Increases System Efficiency 1.5%; Reduces Rectifier Device Temperature by 25°; Shrinks PCB Size by 66%
IR has expanded its family of SmartRectifier™ ICs with the introduction of the IR1168 for AC-DC power converters for high-end applications such as LCD TVs. The 200V dual smart secondary-side rectifier driver IC is designed to drive two N-Channel power MOSFETs used as synchronous rectifiers (SR) in resonant half-bridge topologies. In contrast to traditional current transformer SR methods, the IR1168 accurately determines turn-on and turn-off based on MOSFET drain sensing voltage in close proximity to zero current transition, eliminating the need for additional components to simplify design.
While synchronous rectification provides significant energy savings compared to diode-based designs, traditional SR methods are complex and require a high component count. Using only two gate resistors and a supply capacitor, the IR1168 delivers a lower system temperature and increased power density for even greater efficiency and reliability than existing SR methods while simplifying design and drastically reducing component count to shrink PCB size.
Co-designed with IR’s DirectFET® MOSFETs, which feature IR’s latest Trench silicon and packaging technology, the IR1168-based solution delivers an efficiency improvement of 1.5% for a standard 240W LCD TV SMPS and a reduction of rectifier device temperature of 25°C while shrinking board size by two thirds.
The IR1168, featuring IR’s proprietary high-voltage IC technology, supports burst mode operation to deliver efficiency benefits even at light loads. Ruggedness and noise immunity are accomplished using an advanced blanking scheme and double-pulse suppression that allows reliable operation in fixed and variable frequency applications. Other key features include maximum 500kHz switching frequency, anti-bounce logic and UVLO protection, 4A peak turn-off gate drive current, micropower start-up and ultra low quiescent current, 10.7V gate drive clamp, 70ns turn-off propagation delay and a wide Vcc operating range from 8.6V to 18V.
Production quantities are available immediately and the devices are lead free and RoHS compliant. More information is available on the International Rectifier website at
www.irf.com/whats-new/nr090416.html IRS2093 Integrates 4 Channels in Single Compact IC IR introduced the IRS2093 driver IC for high performance Class D Audio applications from 50W to 150W including home theater systems and car audio amplifiers. Based upon a half bridge topology, the IRS2093 integrates four channels of high-voltage, high performance Class D audio amplifier drivers with PWM modulators in a single IC. Housed in a compact MLPQ48 package, the new IC shrinks board size by a further 50 percent compared to previous offerings.
With the addition of an external MOSFET and passive components, a complete four channel Class D audio amplifier can be realized in a 50 percent smaller footprint, delivering the efficiency and size advantages of Class D while providing the high audio performance traditionally associated with Class AB solutions.
The IRS2093 offers error amplifier, PWM comparator, gate driver, and robust protection circuitry. In addition the new 200V device features an analog PWM modulator with frequency up to 800 kHz, programmable bidirectional over-current protection (OCP) with self-reset control, under-voltage lockout protection (UVLO), and programmable preset deadtime for a scalable power design.
The IC may be co-designed with IR’s extensive range of digital audio MOSFETs addressing output power from 50W to 150W. These MOSFETs have been optimized around parameters critical to audio performance such as efficiency, THD, and EMI. The devices are RoHS compliant and industrial qualified.
The IRAUDAMP8 reference design, featuring the IRS2093 is also available. More information is available on the International Rectifier website at
www.irf.com/whats-new/nr090423.html Automotive-Qualified Dual Low-Side Driver IC
International Rectifier has introduced the AUIRS4427S dual low-side driver IC for low- mid- and high-voltage automotive applications including general purpose motor drives, automotive DC-DC converters and hybrid powertrain drives.
The AUIRS4427S is a low-voltage, high speed power MOSFET and IGBT driver qualified to AEC-Q100 standards. The output drivers feature a high pulse current buffer stage for minimum driver cross-conduction and matched propagation delay for both channels. Negative voltage spike (Vs) immunity is provided to protect against catastrophic events during high-current switching and short circuit conditions. With its benchmark negative voltage spike immunity and matched propagation delay, the AUIRS4427S is an extremely rugged dual low-side driver that enables fast switching speeds making the device ideally suited to high power DC-DC converters and powertrain applications. The AUIRS4427S, which is 3.3V and 5V logic compatible with standard CMOS or LSTTL output, features gate voltage (VOUT) up to 20V, CMOS Schmitt-triggered inputs, two independent gate drivers, and outputs in phase with inputs.
Datasheets and qualification standards are available on the International Rectifier website at www.irf.com
New Logic Level Trench MOSFETs IR’s new range of logic level gate drive trench HEXFET® power MOSFETs feature benchmark on-state resistance (RDS(on)) and high package current rating for high power DC motors and power tools, industrial batteries and power supply applications.
Utilizing IR’s latest trench technology, the new family of benchmark MOSFETs offers a very low RDS(on) at 4.5V Vgs to significantly improve thermal efficiency. Additionally, the devices’ higher current rating provides more guard band from unwanted transients and reduces part count in parallel-type topologies where several MOSFETs share high current. With a package current rating of up to 195A, the TO-220, D2PAK and TO-262 packages deliver more than 60 percent improvement over typical package ratings, while the 7-lead D2PAK further reduces RDS(on) by as much as 16 percent compared to the standard D2PAK to provide an even more robust option.
Featuring benchmark RDS(on) , the new logic level gate drive trench MOSFETs can be driven from a microcontroller or weak battery to deliver improved efficiency at light load conditions, making them ideally suited for high current DC-DC switching and DC motor drive applications. The new family of logic level trench MOSFETs provides a voltage range of 40V to 100V. Qualified to industrial grade and moisture sensitivity level 1 (MSL1) the devices are available in all standard power packages including TO-220, D2PAK, TO-262, as well as a 7-lead D2PAK. The devices are offered lead free and are RoHS compliant.
www.irf.com
LEM
Current Transducer Accurately Measures Up to 4000A
LEM is a market leader in providing innovative and high quality solutions for measuring electrical parameters. Its core products – current and voltage transducers – are used in a broad range of applications in industrial, traction, energy, automation and automotive markets. LEM’s strategy is to exploit the intrinsic strengths of its core business, and develop opportunities in new markets with new applications.
LEM introduced the ITL 4000-S current transducer for non-invasive measurement of currents up to 4000ARMS in conductors of up to 268mm diameter. The new transducer allows the isolated measurement of AC, DC and pulsed currents, up to three times the nominal value for peak measurement at frequencies up to 50kHz (+/-1dB).
Using closed-loop Fluxgate technology, highly accurate measurements of +/-0.1% of IPN are achieved over the operating temperature range from -40°C to +70°C. This high level of accuracy also allows the measurement of small DC currents in the presence of large AC components, which is particularly useful in applications such as transformer protection. For example, it is possible to monitor +/-10A DC over a 4000ARMS AC current with an uncertainty of +/-1A over an operating temperature range from -25°C to +50°C. The technology also offers very good offset and gain thermal drift performance.
The large aperture of the ITL 4000-S makes it particularly suitable for measurements on high-voltage DC systems, which use large-diameter cables. It features high insulation for working voltages up to 1.5kVRMS in accordance with the EN 50178 standard.
The mechanical design of the transducer offers simplified access to the electronics for easy maintenance. This often avoids the need to disconnect the conductors in the final application.
The ITL 4000-S operates from a bipolar +/-24V supply, provides an analogue current output and is suitable for all industrial applications as qualified against the EN 50178 industrial standard. It is particularly suitable for DC current control in transformers, or in offshore wind turbines for DC power transmission, or for leakage current measurement in any application with high primary currents. www.lem.com
Mitsubishi Electric
New Mini DIPPFCTM Novel Transfer Molding PFC Mitsubishi Electric introduced a new version Dual In-line Package Power Factor Correction (DIPPFCTM) developed for high power air conditioner and general inverter use.
In the new DIPPFCTM series (PS5178x) low thermal resistance was realized by using an insulation sheet structure with high heat dissipation transfer capability. As a result, the thermal resistance was improved by about 35% compared with the present large DIPPFCTM packaging technology. Because of low thermal resistance, package size of the new Mini DIPPFCTM is reduced to approximately 70% compared with the conventional Large DIPPFCTM and the input amperage rating is expanded up to 30Arms under its standard application conditions.
Further extension of the current capability to above 30Arms will be possible in future by the development and continuous improvement of thermal interface material properties and lower power device loss.
The internal circuitry of Mini DIPPFCTM comprises two IGBT chips which are designed for high speed switching with a trench gate structure CSTBTTM and four diode chips in which high-side diodes are designed as fast recovery type and the low-side diodes are designed as low forward voltage drop types. Moreover, a LVIC is designed and implemented with necessary functions such as IGBT drive, control power supply under voltage (UV) lockout circuit. In contrast to the conventional PFC circuit topology using a classical boost structure, in the new Mini DIPPFCTM, rectifier function and boost operation have merged: The high-side diode of the diode bridge hold the function of boost diode concurrently, and IGBT is added in parallel with the low-side diode of the diode bridge.
The result is the new Mini DIPPFCTM series developed by optimized power chips together with the innovative dissipation insulation sheet.
This development highly contributes to the extension of the application's efficiency and miniaturization of inverter system. It is also a harvest of Mitsubishi low loss product development conception which is providing benefits to both home appliance use and general motor drive. Mitsubishi Electric will continuously make effort to develop devices which realize power loss reduction and save natural resources.
To control the new DIPPFCTM, a dedicated PFC control IC M63914FP has been developed which contains the complete control functions to realize a PFC operation.
In detail the M63914FP contains several functions like PWM control of DIPPFCTM, a soft start function, the essential over voltage and over current protection and the control power supply under-voltage lockout circuit. About 99% power factor can be achieved by using the Mini DIPPFCTM in conjunction with the M63914FP.
New Family of Mega Power Dual IGBT Modules To tie up with the success of the first line-up of Mega Power Dual (MPD) IGBT Modules, Mitsubishi Electric started the development of a new MPD family (1200V and 1700V) for industrial use with higher rated currents to meet the market request for higher power industrial equipments. Especially the fast growing renewable energy market like wind power generation needs larger system power. The new modules will be available for up to 2500A/1200V and 1800A/1700V avoiding paralleling and thus reducing the complexity of converter design as well as overall system cost.
The new MPD modules will use Mitsubishi Electric's latest 6th generation IGBT chips with CSTBTTM (Carrier Stored Trench Gate Bipolar Transistor) technology and newly developed diode chips for optimized loss performance. For 1200V modules, a VCE(Sat) value of 1.7V (typ.) at Tj = 125°C and a wide SOA at Vcc = 900V are achieved. For 1700V modules: VCE(Sat) = 2.2V (typ) at Tj = 125°C, SOA at Vcc = 1200V. A 25% total loss reduction in the inverter operation compared to 5th generation IGBT modules was achieved under the same dv/dt conditions. A maximum junction temperature of Tj(max) = 175°C is obtained with the new module generation.
In such high power applications usually liquid cooling is required. The chip layout of the new Mitsubishi MPD IGBT modules is especially designed for liquid cooling. A new solderless Al baseplate with direct-bonded insulation substrates was developed to improve the thermal impe-dance and to increase the temperature cycling capability. To achieve a better thermal contact between the large baseplate area and the cooling fin, the baseplate is divided into several sections.
Mitsubishi Electric was able to reduce the internal package inductance (Lint) to about 5nH from P to N for the package (size B) by using an internal four layer main terminal bus.
AC and DC main terminals are well separated for an easy DC-bus design. The signal terminals are located centrally on the package allowing easy mounting of the gate driver board directly on top of the module. Auxiliary C-terminals for SC-protection are available both for P- and N-side IGBTs. For thermal protection an isolated NTC is integrated.
All modules are entirely RoHS compliant.
The new Mega Power Dual IGBT family will be officially introduced by Mitsubishi Electric at PCIM 2009 (12 - 14 May 2009) in Nuremberg. First samples of the 1800A/1700V and the 2500A/1200V modules will be available in the fourth quarter of 2009. At a later stage Mitsubishi Electric also will offer versions rated 1100A/1700V and 1500A/1200V
6th Generation IGBT Modules (NX-Series) Mitsubishi Electric’s novel flexible NX package concept for a new IGBT line-up is well established. Based on a unified package footprint (122 x 62mm) several terminal and circuit configurations can be produced. By using the same NX-package concept Mitsubishi Electric are now launching a completely new IGBT family using the latest 6th generation IGBT chips with advanced CSTBTTM (Carrier Stored Trench Gate Bipolar Transistor) technology and newly developed diode chips for an optimized loss performance. 
For 1200V modules a VCE(sat) value of 1.7V (typ.) at Tj = 125°C and a wide SOA at Vcc = 900V are achieved. For 1700V modules: VCE(sat) = 2.2V (typ.) at Tj = 125°C, SOA at Vcc = 1200V. The newly developed fast recovery Free-Wheel Diode (FWDi) improves the trade-off between forward voltage (VF) and recovery switching loss Erec.
With the new IGBT chip generation, more than 10µs short circuit capability and excellent paralleling characteristics can be obtained. A maximum junction temperature Tj(max) = 175°C is achieved. The total power loss in sine-wave PWM inverter application is reduced by approx. 20% compared to 5th generation. Thus – compared to conventional products – the new 6th Generation NX-Series follows the demand for a higher efficiency in power conversion to save resources and energy.
Mitsubishi NX-Series IGBT modules feature a high power cycling capability (wire bond fatigue) and more than a tenfold better thermal cycling capability (solder fatigue) in comparison with the previous module technology. For thermal protection an isolated NTC thermistor is included in all standard NX-modules.
Multiple configuration options such as duals, six- and seven-packs and CIB (converter-inverter-brake) circuit configurations, ranging from 35A to 1000A at 1200V and 50A to 600A at 1700V are realized with two package footprints only: 122 x 62mm and 122 x 122mm. The new 6th Generation NX-Series IGBTs are ideally suited for general purpose inverters, servo control as well as photo-voltaic and fuel cell inverters with improved manufacturability, reduced development time, and lower cost.
All modules are entirely RoHS compliant and UL certified.
First samples of 1200V modules will be available in summer 2009. A 600V line-up is under preparation.
www.mitsubishichips.com
Power Integrations
Energy-Efficiency Calculator Navigates the Maze of External Power Supply Standards
Power Integrations the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced a new online tool that enables designers of external chargers and adapters to instantly determine whether their product complies with worldwide energy-efficiency regulations.
The new External Power Supply Efficiency Compliance Calculator quickly and easily compares power supply performance measurements against the maze of specifications that now apply to external chargers and adapters, significantly simplifying the design engineer’s task of verifying compliance. The calculator currently checks compliance to the following standards: - ENERGY STAR EPS (version 2.0): Sponsored by the U.S. Department of Energy and the Environmental Protection Agency, ENERGY STAR is one of the most visible efficiency certifications worldwide.
- EISA 2007: The first mandatory U.S. federal EPS efficiency standard, the EPS limits in EISA 2007 were adopted from the California Energy Commission’s Appliance Efficiency Regulations.
- European Commission Code of Conduct (version 4): The European Commission Code of Conduct (CoC) issued version 4 of its EPS specification in April 2009.
- EC Eco-design Directive: The European Commission’s Eco-design Directive for external power supplies, scheduled to take effect in April 2010, will align with the EISA 2007 standard for Tier 1 and ENERGY STAR (version 2) for Tier 2.
- China USB Charger Specification (YD/T 1591-2006): China’s Communication Industrial Standard mandates a USB connector and power output with a no-load consumption of =300 mW for mobile telecommunication terminal equipment power supplies.
- EC Integrated Product Policy (IPP): In 2008, a group of leading mobile-phone manufacturers developed a “Five-Star” rating system for mobile phone adapters/chargers, specifying no-load power consumption down to =30 mW -- well below any current or proposed government standards.
Comments Rich Fassler, Manager of Energy-Efficiency Programs at Power Integrations: “Energy-efficiency specifications and standards have become increasingly complicated, and the landscape is constantly changing. For example, in April 2009 alone, two important updates occurred -- the EC Code of Conduct issued version 4 of its specification, and the upcoming EC Eco-design standard was approved by European Parliament. More than ever, power supply designers and those sourcing external power supplies for use with their end products need an easily accessible, up-to-date database of worldwide current and proposed regulations.”
Continues Fassler: “Power Integrations’ new External Power Supply Efficiency Compliance Calculator means that designers no longer have to consult multiple sources when checking the efficiency compliance of their EPS designs – they can simply enter their data and achieve an immediate, comprehensive, and accurate analysis.”
For more information about energy-efficiency standards and standby energy waste, please visit Power Integrations’ Green Room website at www.powerint.com/greenroom.
www.powerint.com
Powerex
High Power Solutions
A pioneer in high power semiconductor applications, Powerex offers a broad line of products, including IGBT; MOSFET Modules; Intelligent Power Modules (IPM); DIP-IPM; Module Accessories (including gate drivers and DC-DC Converters); Discrete Thyristors/SCR (Silicon Controlled Rectifier); Discrete Rectifiers; Thyristor and Diode Modules; Fast Recovery and Three-Phase Diode Modules; Assemblies; IGBT Assemblies and Custom Modules.
The company supports many markets, including transportation, AC and DC servo drives, AC and DC motor controls, UPS, alternative energy, medical power supplies, welding, induction heating, electric vehicles, aircraft and white goods.
The range of integrated heatsink technologies from Powerex can decrease semiconductor thermal resistance by 4X
Powerex has developed several innovative technologies which reduce heat flow paths by integrating liquid or air cooled heatsinks inside the module.
Powerex has the expertise and experience to develop innovative ideas into real-world, cost-effective products and is a leading supplier of discrete, modular and integrated high power semiconductor solutions.
For more information, go to www.pwrx.com
POWERSYS
PSIM software: Ultimate Simulation Environment for Power Conversion and Control
POWERSYS is a consulting and software company providing global solutions of engineering software and services for industry in the field of Electrical & Electromechanical Power Systems. With the combination of the best relevant software on the market and highly skilled engineering staff, the company offers its local and global clients the most flexible solutions for studies applicable to: - Electrical Power Systems and Networks (transmission, distribution, generation, industrial plants)
- Power Electronics and Drives
- Electromagnetic and Electromechanical equipment (motor, generator, transformer, actuator...)
POWERSYS is the exclusive European distributor of PSIM, a simulation package specifically designed for power electronics and motor drives. By using PSIM, companies can considerably improve competitiveness; this powerful simulation environment from Powersys helps designers to work more effectively and productively, reducing development costs and time-to-market.
With an extremely user-friendly interface, high simulation speed, and capability of simulating any type of power converters and control circuits, PSIM is ideal for system-level simulation, control loop design, and motor drive system studies.
• AC Analysis
• Automatic Code Generation
• Harmonic Analysis
• Support Custom C Code & DLL
• Magnetics Modelling
• Motor Drive Analysis
• Parametric Simulation
• Loss calculation & Thermal Analysis
The benefits of PSIM cover a wide variety of applications in electrical engineering:
• Power conversion equipment
• Solar and wind energy
• Transportation
• Aircraft industry
• Defence
• Automotive industry
• Nuclear
• Telecoms
• Lighting
• IC components
The PSIM Basic package consists of the Circuit Schematic Program (PSIM Schematics), the PSIM Simulator and the Waveform Display Program (Simview). In addition, there are eight add-on modules:
- Motor Drive Module for adjustable speed drives and motion control
- Digital Control Module for discrete systems
- New in PSIM8.0, Simcoder Module for automatic code generation
- Thermal Module to estimate semiconductor device losses
- SimCoupler Module for co-simulation with Matlab/Simulink
- MagCoupler Module for co-simulation with JMAG
- MagCoupler-RT Module for co-simulation with JMAG-RT
- PSIMbook for interactive exercises in different fields of Power Electronics  POWERSYS is the exclusive distributor of PSIM in Europe
www.psim-europe.com
www.powersys-solutions.com Rogers Corporation Thermal Management Solutions I stopped by the Rogers Corporation booth where they were exhibiting products for power applications from two divisions. On display were Rogers custom designed and produced RO-LINX® Laminated Busbars produced by Rogers BVBA Gent, Belgium and from Rogers’ newest business unit, Thermal Management Solutions their wide range of HEATWAVE™ AlSiC materials and recently introduced HEATWAVE™ AlSiC D3 technology in partnership with Element Six.
Rogers Corporation is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut, and Illinois), Europe (Ghent, Belgium) and Asia (Suzhou, China). In Asia the company maintains sales offices in Japan, China, Taiwan, Korea and Singapore.
Tom Sleasman, Rogers TMS Business Manager explained that the company’s strategy is to offer its customers the widest range of AlSiC metal matrix material choices based on CTE, product configuration and thermal requirements and then design and produce an AlSiC component that achieves the required specifications at the appropriate cost. "Since nearly every design involves tradeoffs between performance and cost, the emerging use of AlSiC in areas where traditionally copper and copper alloys have been used requires that we have multiple options to solve our customers’ thermal issues." With the introduction of HEATWAVE™ AlSiC D3, Rogers further widens its portfolio. "Aluminum encapsulated Silicon Cemented Diamond provides the high thermal conductivity and low thermal expansion needed in advanced power semiconductor packaging while providing flexible product design options for cost effective application into standard footprints and next level products" said Tom.
www.rogerscorp.com
Semikron Power Pack Delivers 33% Increase in Power Density Semikron’s SKiiP4, new generation of intelligent IGBT power modules are 100% solder-free and utilize sintered chips for higher operating temperature capability and extended service life. The SKiiP power pack is the most powerful intelligent power module on the market and is 33% more powerful than its predecessor SKiiP 3. The IPM is used predominantly in wind and solar power applications, traction applications, elevator systems and industrial drives with high outputs of between 400 kW and 1.8 MW.
Up to 33% more power in Semikron’s new SKiiP 4 IPM
For comparable conditions and module sizes, the SKiiP4 provides 33% more power than the current version of this module family, SKiiP3. On the one hand, this allows for the development of more powerful or more compact frequency converters, thus reducing costs. This increase in power is down to the use of an innovative pressure contact system, an improved heat sink and IGBT4, CAL4 chip technology. In addition, six parallel half bridges have been used for the first time at the upper power end instead of four, as was the case up till now. In SKiiP4 modules, the semiconductor chips are not soldered to the ceramic substrate but are joined using sinter technology, meaning that higher operating temperatures are possible with no compromise to – or in some cases even increased - reliability. The sinter bond is a thin silver layer which has a lower thermal resistance than a bond with solders. Thanks to the high melting point of silver, premature material fatigue can be prevented.
Like its predecessors, SKiiP 4 is based on well matched components: heat sink, power module, driver and protective sensors/functions. Here, the mounting and connecting technology, which is based on a pressure system, plays a crucial role. Customers can also opt to have unique burn-in tests where the IPMs are run under real operating conditions performed. These tests enable premature silicon failure to be identified and the defective chips removed. In the tests the modules are exposed to the maximum possible junction temperature.
The solder-free pressure contact system and the integrated laminated power rails ensure homogenous current distribution. Every IGBT and diode chip is connected to the main terminal separately, keeping the module resistance very low. The chips are not soldered to the ceramic substrate but are joined in a sinter process. As these modules have no base plate, the solder-free connection between DCB and heat sink is quasi-flexible, which is why the thermal cycling capability has no upper limits. SKiiP4 will be available with blocking voltages of 1200V and 1700V in dual-pack topologies with three, four or six parallel half bridges per IPM.
Digital signal transmission for the switching signals is the key to ensuring both a very high degree of reliability and interference immunity for switching signals. In addition to various technical advantages, this ensures high signal integrity and, consequently, interference immunity. Transmission depends on component parameters, is highly robust and not sensitive to temperature fluctuations or ageing effects. The switching and sensor signal transmission channels feature galvanic isolation, meaning the user does not have to provide additional isolation. To round off, the new SKiiP4 IPM also features a multi-stage output stage which ensures the reduction of overvoltage and includes various other protective functions. Finally, a diagnosis channel is available for optimum evaluation on the customer side.
The term “Semikron inside” has become a trademark for young developing markets such as electric drives, wind power generators, solar power, electric vehicles, welding machines, lifts, power supplies, conveyor belts and trams. As a significant innovator in the power electronics sector, many of Semikron’s progressive developments have been accepted as industrial standards.
www.semikron.com
STMicroelectronics
High-Voltage Transistor Technology for Reliable High-Efficiency Systems STMicroelectronics introduced a new family of power MOSFETs combining higher voltage capability, greater ruggedness, and lower losses than previous devices, which are well suited for use in high-efficiency power supplies for products such as LCD monitors, televisions and energy-saving lamp ballasts.
The STx7N95K3 family introduces a new 950V breakdown-voltage class for power MOSFETs. This new class benefits systems that minimize energy losses by operating at high voltages such as 400V or more. Compared to competing 900V devices, ST’s new 950V power MOSFETs have a larger safe-operating area delivering greater reliability. Designers can also use a single 950V MOSFET to replace two-transistor circuits sometimes used to build high-voltage supplies, simplifying design, reducing size and lowering component count.
In addition, the STx7N95K3 family has a higher avalanche current rating than competing devices, which ensures greater resilience to surges above the breakdown voltage which cause the device to avalanche. The avalanche-current rating of 9A compares with around 1A for the nearest competing 900V devices.
As well as withstanding higher applied voltages, the STx7N95K3 family also minimizes conduction losses by achieving RDS(ON) of less than 1.35 Ohm. This represents a 30 percent reduction in RDS(ON) per device size compared to previous-generation MOSFETs, and allows designers to increase power density as well as improve efficiency.
At the same time, these new MOSFETs also deliver high switching performance by achieving low gate charge (QG) and low intrinsic capacitance, which allow designers to use higher switching frequencies, enabling the use of smaller components to further enhance efficiency and power density.
STx7N95K3 MOSFETs achieve these performance advantages by using ST’s latest-generation SuperMESH3™ technology. The devices introduced are offered in industry-standard packages including the STF7N95K3 in the TO-220FP package, the STP7N95K3 in standard TO-220, and the STW7N95K3 in TO-247.
The next available devices will be the 950V BVDSS STW25N95K3, STP13N95K3, STD5N95K3 and 1200V BVDSS STP6N120K3. ST will follow these devices with further new product introductions in 2009, including 850V, 950V, 1050V and 1200V ranges. Further information is available at www.st.com/pmos
VIPerPlus for Intelligent and Rugged Energy-Saving PSUs STMicroelectronics introduced the VIPerPlus family of off-line SMPS (switched-mode power supply) converters. Following the successful introduction of the first device, VIPer17, in 2008, ST has added the VIPer15/16/25/27/28 devices to form a broad family of AC-DC converters that minimize both standby power consumption and the number of external components required, while enabling easy compliance with Blue Angel, Energy Star and other low-power norms and directives.
The family is ideal for energy-saving power supplies operating from all mains voltages worldwide in home appliances from coffee makers to washing machines and dishwashers, consumer equipment such as LCD TVs, DVD players and set-top boxes, domestic and architectural lighting, auxiliary supplies for desktop PCs and servers, and chargers for mobile phones, digital cameras, portable audio players, toys and cordless appliances such as shavers.
“With its outstanding combination of ruggedness, cost-effectiveness, low standby power and operating efficiency, the expanded VIPerPlus family reinforces our leading position in the power conversion market and demonstrates again ST’s commitment to helping its customers minimize the energy consumption of their products,” said Pietro Menniti, General Manager of the Industrial and Power Conversion Division, STMicroelectronics.
All VIPerPlus devices include the controller, the start-up circuitry and an 800V avalanche-rugged power MOSFET in the package. New integrated functions and high break-down voltage help to improve the robustness and the reliability of the power supplies, reduce the external component count, and provide both higher efficiency in operating mode and an ultra-low standby power consumption that is less than 50mW at 265V and can be reduced to 30mW with optimized transformer design.
The 800V avalanche-rugged power MOSFET is specifically optimized for the VIPerPlus. The fixed-frequency PWM controller with jittering, and the quasi-resonant innovative topology, maximize the efficiency in operating mode while reducing the EMI filter costs. Best-in-class in standby power allows customers to meet the most demanding energy-saving regulations (Energy Star; 80+ Bronze, Silver, Gold), while protection features include accurate, adjustable over-voltage and overload protection, hysteretic over-temperature protection, two levels of over-current protection and open loop failure disconnection.
By integrating a high-voltage startup-current generator as well as essential drain-current control during the converter start-up phase, VIPerPlus eliminates the need for a startup resistor, reduces stress on the secondary diode and helps to prevent transformer saturation. The embedded SenseFET eliminates external sensing components, allowing a precise drain-current limit. Detection of a fault initiates the devices’ auto-restart function, which prevents damage to the power supply or the load.
All members of the VIPerPlus family are available in volume quantities in DIP-7 or SO16N packages.
www.st.com
Texas Instruments
High-Power PoE Controller Delivers Over 90% Efficiency Texas Instruments introduced a high-efficiency, high-power Power-over-Ethernet (PoE) controller for 13-watt or 26-watt powered device (PD) applications, such as IP phones, wireless access points or security cameras. Fully compliant to the IEEE 802.3at draft 4.0 standard, the integrated TPS23754 supports DC/DC converter topologies that can achieve higher than 90 percent power conversion efficiency, which reduces heat and increases reliability of the system. The single-chip PoE solution leverages a 100-V manufacturing process to provide a robust solution in a 13-watt or 26-watt design. For product details and to request samples see: www.ti.com/tps23754-pr.
Along with the TPS23754, TI is sampling the TPS23756 to support auxiliary input voltages as low as
12V, allowing a PoE designer to use popular and inexpensive 12V wall adapters. Additionally, the TPS23757 will support 13-W and below applications requiring the higher efficiency DC/DC topologies. Both the TPS23756 and TPS23757 will be available in the third quarter.
Key features
• Complementary auxiliary driver with programmable dead-time
• PD controller supports up to 825-mA continuous current
• Power source selection priority
• Current and inrush limit
• 100-V monolithic SOI process
Key benefits
• Supports high-efficiency isolated flyback and forward DC-DC converter topologies
• Implements IEEE 802.3at (draft 4.0) for PD applications requiring greater than 13 W
• Natively supports external, local power sources with or without PoE power present
• PD front end protects against current inrush and short circuits
• Robust manufacturing process withstands voltage surges up to 100 V at the IC
Availability The TPS23754 is available now in a HTSSOP-20 package. The TPS23756 and TPS23757 will be available in third quarter.
More info about PoE by visiting the links below:
• See TI PoE portfolio, tools and resources: www.ti.com/poe-pr
• Get PoE design support on TI E2E Community: www.ti.com/poecommunity-pr
• Find TI power management products and tools: www.ti.com/power-pr
• TI's IP phone solutions: www.ti.com/voip-pr
New Products in PicoStar™ Package Portable consumer electronics designers can save board space with integrated circuits (ICs) in the PicoStar™ package. The ultra-thin package, about as thin as a human hair, is the first to give system designers the option to embed silicon components inside the printed circuit board (PCB) to maximize board space. Devices in this form factor are 50 percent thinner than similar chips in traditional packages and enable smaller, thinner end equipment. The TPD2E007, a two-channel, robust electrostatic discharge (ESD) solution, is the first device available in the ultra-thin PicoStar package. For product details and to order samples see: www.ti.com/tpd2e007-pr. 
The TPD2E007 is a back-to-back diode array that allows AC-coupled data transmission without compromising signal integrity. Typically, ESD protection is mounted close to the connector on the PCB, but designers have the option to surface mount or embed the TPD2E007 into the board/connector. The ability to embed this ultra-thin device in the board allows designers to save 80 percent board space compared to typical ESD solutions.
Key features
• Robust ESD protection
o ±8-kV IEC 61000-4-2 contact discharge
o ±15-kV IEC 61000-4-2 air-gap discharge
• Back-to-back diode configuration for negative signal swing
• 15-pF line to ground capacitance
• Low 50-nA leakage current
• PicoStar package: 0.15 mm package height
Key benefits
• Reduces board space, which gives end equipment designers the option to add more components on the board
• Thin form factor allows the device to be inserted into a board layer stack-up with minimal effort
• Board-level cost can be reduced by embedding the device in the PCB
Availability
The TPD2E007 is available today in a 4-pin YFM package. Additional TI devices will be developed in PicoStar packaging, such as the TPS62620 low-power DC/DC converter, which is sampling now and will be available in volume production in 3Q09.
More info on TI’s ESD protection portfolio by visiting the links below:
• Order TPD2E007 samples: www.ti.com/tpd2e007-pr
• See TI’s complete ESD portfolio: www.ti.com/esd-pr
• Get questions answered on TI’s E2E online community: http://community.ti.com
• Follow TI on Twitter: www.twitter.com/txinstruments
www.ti.com
Toshiba Electronics Europe
High Current, Low RDS(ON) Automotive Power MOSFETs Toshiba launched a new range of power MOSFETs that is optimized for motors used in fans, pumps and other automotive motion control applications. The new MOSFETs combine industry-leading on-resistance and input capacitance ratings with a package design that offers better thermal dissipation and power cycling capabilities than previous automotive MOSFETs.
Available with maximum voltage (VDSS) and current (ID) ratings of 60V and 150A, Toshiba’s new MOSFETs are based on the company’s latest U-MOS trench semiconductor technology. This technology contributes to typical RDS(ON) specifications as low as 1.7m? and typical input capacitances (Ciss) down to just 4500pF. As a result, the devices offer the industry’s smallest RDS(ON)* gate charge (Qg) ‘figure of merit’, which ensures optimum switching speed and efficiency.
All the new MOSFETs are supplied in Toshiba’s TO220SM(W) package. This uses copper connectors and a wide source terminal to drive down RDS(ON) and package inductance, reduce thermal resistance, and ensure high current carrying capacity. The package is qualified to AEC-Q101 at a channel temperature of 175ºC. A thickness of just 3.7mm means that it is 21% thinner than existing TO-220SM package technology.
Toshiba’s current line-up of TO220SM(W) automotive MOSFETs comprises five devices with respective current/voltage ratings of -60V/-120A (TJ120F06J3); 40V/100A (TK100F04K3); 40V/150A (TK150F04K3); 60V/100A (TK100F06K3); and 60V/130A (TK130F06K3). Typical RDS(ON) ratings range from 1.7m? to 5.5 m?, while typical Ciss and Qg ratings range from 4500pF and 98nC to 11500pF and 258nC.
As well as the MOSFETs themselves, Toshiba can also offer driver ICs, evaluation boards and a range of technologies and support that will simplify and speed the development of complete automotive motor control designs.
www.toshiba-components.com Vacuumschmelze (VAC) Advanced Materials for Innovative Technologies Vacuumschmelze develops produces and markets advanced magnetic materials and related products. The company was founded in Hanau, Germany in 1923 operating the vacuum melting of alloys on an industrial scale. Today VAC has grown into a global operation.
VAC presented its new range of Common Mode Chokes, compliant to UL 1446 and now available for operating currents of up to 100A, operating voltages of 300Veff / 600Veff and DC voltages up to 1000 V. The nanocrystalline chokes deliver superior broadband attenuation plus outstanding temperature resistance; they are thus ideal for use in switch mode power supplies, uninterrupted power supplies, solar inverters and frequency converters.
In addition, VAC premiered its new family of AC-DC differential current sensors ("DI sensors"), used primarily in solar inverters and linking photovoltaic modules and power networks. Devices of this type must deliver outstanding efficiency, years of reliable functioning and maximum electrical safety. VAC's new sensors feature metal shielding against magnetic fields such as the earth's magnetic field or from the inverter generated electromagnetic fields. The sensors operate with a unipolar 5V power supply.
VAC also presented new cut cores of nanocrystalline VITROPERM® - an alloy featuring low strip thickness of 18 µm. The core losses of VITROPERM® cores are 70% lower compared to nickel-based cores; VITROPERM® also offers a very high permeability of 100,000 and high saturation induction of 1.2 Tesla. Since the alloy is nearly free of magnetostriction, intrinsic vibration and mechanic noise are negligible. VITROPERM® is resistant to operating temperatures of 130° Celsius and shows overall stable magnetic properties throughout a broad temperature range.
New Material DURACON® 45M
VAC introduced a new member of its DURACON® family of iron/cobalt/nickel alloys. New DURACON® 45M, now supplied as solid material, offers features including ultra-hardness plus outstanding heat conduction properties; because of this it is ideal for tool mould making, where high hardness has a favourable effect on the wear behaviour of the moulded parts. In addition, the thermal expansion behaviour of DURACON® 45M is identical to tool steels, significantly reducing the risk of stress cracking in tools.
In mould making, short cycle times and optimum tool lifespans are essential to ensure efficient manufacturing processes, particularly for plastic injection-moulded parts. In order to accelerate cooling and thus shorten cycle time, the materials used for the moulds must have high thermal conductivity. Beryllium copper (BeCu) has generally been added to moulds, usually produced of tool steel, to significantly increase conductivity at specific points. However, steel and BeCu exhibit widely varying thermal expansion behaviour, which causes thermal stresses within the mould and may often shorten its useful life.
In addition to considerably higher hardness than BeCu (tensile strength of DURACON® 45M: 1500 MPa, compared to approx. 1200 MPa for BeCu2), DURACON® 45M has a thermal expansion coefficient which is identical to tool steel. A composite tool of DURACON® 45M and steel is thus free from thermal stresses, resulting in moulds with an optimum useful life. In addition, DURACON® 45M is free from toxic alloy elements such as beryllium, which generate carcinogenic particles and vapours during both processing and use and are also viewed critically as scrap components. In mould making, DURACON® 45M thus not only increases productivity and extends the useful life of moulds, but also contributes to environmental protection.
New Alloy VACOFLUX® 18HR
VAC presented its new alloy VACOFLUX 18HR, a further demonstration of the company’s expertise in developing customer- and application-oriented materials. VACOFLUX 18HR is the successor to VACOFLUX 17, originally designed for diesel injection applications, and has been significantly improved to comply with the requirements of increasingly high-performance magnetic actuators. The new VACOFLUX 18HR alloy offers 60% higher resistance, significantly reducing eddy currents and thus enhancing the dynamic behaviour of magnetic actuators. These features, coupled with the alloy’s ultra-high saturation induction, open up new possibilities in the optimization and design of highly dynamic actuator systems and electromagnets.  VACOFLUX 18HR
VACOFLUX 18HR is a cobalt-iron alloy with high saturation induction (2.1 T) plus high electrical resistance (0.65 µ?m). It is primarily designed for use in turned and machined components of magnetic actuators, including diesel injection systems for the automotive industry. In simulations of typical magnetic valves, VACOFLUX 18HR delivered 6% greater terminal force in 25% less time than silicon iron. VAC offers VACOFLUX 18HR in a variety of delivery forms including solid material, rods, wire, shaped and solid parts.
The combination of enhanced dynamic performance plus increasingly compact form is increasingly in demand by both the automotive industry and many other sectors such as automation technology, aviation and many hydraulic and pneumatic valve solutions. Electromagnetic actuators are growing in popularity for these applications. VAC’s new alloy is the company’s response to increasingly advanced requirements in this field.
Find out more about the new VACOFLUX 18HR at http://www.vacuumschmelze.de/dynamic/docroot/medialib/documents/produkte/
ht/vacoflux/VACOFLUX_18_HR.pdf
www.vacuumschmelze.de
Vincotech
Latest Three¬-Level Power Modules for Solar and UPS Vincotech, a provider of power, GPS and hybrid modules used in industrial, solar and automotive applications, announced the release of two new product families featuring 3-level topologies dedicated to solar inverter and UPS applications. Designed for maximum efficiency and using state of the art chip technologies, the flowBOOST 0 Dual and flowNPC 0 families address a power range of up to 15kW.
The newly released families respectively offer the dual Boost and Neutral Point Inverter topologies used in 3-level solar and UPS systems. Advantages of the 3-level approach include lower cost and higher efficiency, due to the use of 600V components. Featuring the latest chip technologies, such as SiC diodes and CoolMOS™, these modules achieve a maximum European Efficiency (EE) of 99% per module.
The highest efficiency is achieved by the flowNPC 0 family members featuring the parallel switching of a CoolMOS™ and an IGBT. The optimal conduction performance of the IGBT coupled with the low switching losses of the CoolMOS™ lead to lowest overall losses and thereby an extremely high efficiency. flowNPC 0 further features regenerative power capability, an emerging requirement in solar inverter applications.
The modules are housed in Vincotech’s proven flow0 package. At 33x66x12mm and featuring its unique clip-in mechanism, the flow 0 is one of the most compact and easy-to-handle packages in the power module market.
Vincotech also announced the extension of its 3-level inverter portfolio to the high power flow 2 housing. The flowNPC 2 family reaches a maximum continuous electrical power of 70kW per module.
The Neutral Point Clamped topology in the flowNPC 2 family is commonly used in 3-level solar and UPS systems. Advantages of the 3-level approach include lower cost and higher efficiency due to the use of 600V components. The modules feature fast switching technologies, such as ultrafast diodes and CoolMOS™, and reach 300A at 1200V.
The highest efficiency is achieved by the flowNPC 2 family members featuring the parallel switching of a CoolMOS™ and an IGBT. The optimal conduction performance of the IGBT coupled with the low switching losses of the CoolMOS™ lead to lowest overall losses and thereby an extremely high efficiency.
The modules are housed in Vincotech’s high power flow 2 package. At 108x47x12mm and featuring a Copper baseplate, the flow 2 is a robust and easy-to-handle package optimised for applications in the higher power range.
High Efficiency Power Modules for Solar Inverters
Vincotech announced the release of two new product families dedicated to solar inverter applications. Designed for maximum efficiency and using state of the art chip technologies, the flowSOL 0 BI and flowSOL 0 RI families cover solar inverter systems of up to 10kW.
These families meet the needs of both isolated and non-isolated solar system topologies. Non-isolated systems are catered for by a single module solution from flowSOL 0 BI (Boost + Inverter). A two-module solution combining members with optimized chipsets from flowSOL 0 BI and flowSOL 0 RI (Rectifier + Inverter), address the non-isolated solar inverter market. Vincotech’s solar modules reach a maximum European Efficiency (EE) of 99.3%; achieved via the optimized module design and the combination of the latest chip technologies, such as SiC diodes and CoolMOS™. Low-cost versions featuring fast Si diodes instead of SiC are also offered. The modules are housed in Vincotech’s proven flow 0 package. At 33x66x12mm and featuring its unique clip-in mechanism, the flow 0 is one of the most compact and easy-to-handle packages in the power module market.
Latest PFC Modules for High Power & High Efficiency
Vincotech announce the release of 16 new modules with a rectifier & PFC topology in a single housing. The new products feature state of the art chip technologies and cover a power range of up to 8kW, rounding-off Vincotech’s extended PFC portfolio.
The flowPFC 0 family now consists of 26 different modules catering for every need in PFC functionality of applications such as power supplies or welding/cutting. The modules are suited for interleaved switching supporting collector or emitter current sensing and were designed to work with the UCC28070™ Texas Instruments™ PFC controller. Maximum power and efficiency is achieved via the use of the latest chip technologies, such as SiC diodes and CoolMOS™. The highest efficiency is reached by the family members featuring the parallel switching of a CoolMOS™ and an IGBT, due to the optimal conduction performance of the IGBT coupled with the low switching losses of the CoolMOS™.
Further options include a standard or half-controlled rectifier stage and a low-cost chipset with fast Si diodes instead of SiC.
The modules are housed in Vincotech’s proven flow 0 package. At 33x66x12mm and featuring its unique clip-in mechanism, the flow 0 is one of the most compact and easy-to-handle packages in the power module market.
High Efficiency Inverter Module
Vincotech announced the release of a new member of the flowPIM 1 product family. The P589-A31, consisting of an input rectifier and an inverter circuit, perfectly matches the requirements of fast switching motor drives. These are often seen in audible noise sensitive environments, such as air conditioning, fans, and pumps. A common feature of all these application areas is a switching frequency of >16kHz, above the audible range. Further application areas include high dynamic motor drives, e.g. servo drives.
The disadvantages of fast switching are the increased switching losses and therefore lower energy efficiency. In times of increasing energy costs and the growing importance of environmentally conscious behaviour, energy efficiency is becoming increasingly important. The new power module P589-A31 is the perfect solution. It uses special semiconductors, which have significantly lower switching losses compared to the standard components.
The new module features the “phantom speed” IGBTs. These components have much lower switching losses at higher frequencies than standard IGBTs. For switching frequencies >8kHz, the 25A phantom speed chips are more efficient than 35A IGBT4 chips. At 20 kHz, the power loss is lower by 24%, making an output power of 10kW possible, which could only be achieved using 50A to 75A standard IGBT4 components. Because the power losses are much lower, the heat sink can also be sized down. By choosing the P589-A31, the application will not only have much higher energy efficiency, but can also save component costs.
The P589-A31 is part of the flowPIM 1 product family and is mechanically fully compatible to all other family members. This means the module can be used in existing applications, designed with other flowPIM 1 products, without the need for a mechanical redesign.
Mass production of the P589-A31 has just started, samples are available. For further information, please go to: http://www.vincotech.com/Power_Modules.0.html
New Press Fit Technology
Vincotech introduced its new press fit technology. The modules featuring this new pin technology are simply pressed rather than soldered into the PCB, thus reducing PCB assembly time and costs.
The Vincotech press fit pin design is well established in the automotive industry and provides a reliable and gas-tight connection to the PCB. By eliminating the necessity of a solder process for the module, the customer reduces the PCB assembly time and thereby the production costs. A higher production output capacity is the direct consequence.
Further advantages of Vincotech’s press fit technology include reuse of the PCB and design flexibility. The module can be removed without damaging the PCB, thus allowing for the reuse of the PCB with a new module. Design flexibility is guaranteed by the elimination of the need for soldering; the module can easily be mounted on either side of the PCB at no extra cost or effort.
Vincotech’s Press Fit Technology is DIN and IEC compliant and available upon request for all Vincotech proprietary module designs in pin-compatible versions to the current portfolio.
For more information on Vincotech’s products visit:
www.vincotech.com
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