Advanced packaging for car systems address evolving requirements

Date
01/05/2015

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Visit TE Connectivity at the Autosport International Engineering Show

Visit the TE Connectivity (TE) booth E440, Hall 9, at Autosport International Engineering Show in Birmingham, U.K., January 8-9, to see TE’s latest innovations in high-performance connector technology that withstand the harsh autosport environment.

TE’s packaging for electronic control units (ECUs) and car systems encompasses the latest in the double-density range. The new DEUTSCH 118-way Autosport Double Density (ASDD) connector features the same tried and tested AWG 24 contacts in a size 18 autosport shell. This level of packaging is another step to meet the constantly evolving requirements modern race teams require from their connector options. This solution enables one of the most compact packaging options on today’s race vehicle and will be on display at the show.

In addition, TE has brought fiber optic solutions to the cutting edge of autosport connectivity by understanding how 2014 engines run higher current to the battery pack and by reducing the impact of electromagnetic interference (EMI) on engine systems.

Along with TE’s latest fiber optics, the company will also feature other end-to-end solutions for high-performance connectivity, including the full range of DEUTSCH autosport products that offer design engineers modularity for easy integration, as well as advanced components for weight and space savings.

SHOW: Autosport International Engineering Show

DATE: January 8-9, 2015

WHERE: TE Connectivity - Booth #E440, Hall 9
NEC
Birmingham, UK

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