In the past, high voltage (HV) discrete device and product development consisted of a long, serial approach where technologies were developed in TCAD*, physical parts fabricated and packaged, measurements performed and an iterative calibration cycle launched.
As designers simulate application circuits with SPICE and not TCAD, application simulations are often performed and calibrated very late in the technology development process when the silicon-based SPICE model is finally available. Any new sized part in the technology or technology adjustment required another round of TCAD simulations, device fabrication, and measurements before a corresponding discrete SPICE model became
available for application simulation.
Now, newly developed physically-based, scalable SPICE models that encapsulate the process technology are at the forefront of the design cycle. Designers, through the SPICE model, can simulate product performance prior to device fabrication, reducing design and fabrication cycles, leading to lower costs and faster time to market.
Fairchild has launched scalable, physical SPICE-level models for high voltage discrete technologies including:
-IGBTs (FS Trench 650 V)
-Super Junction FETs (600 V & 800 V SuperFET® MOSFETs)
-HV Diodes (STEALTHTM I, II diodes, and HyperFast series)
Fairchild’s HV SPICE models are one physical model that applies to the entire technology platform, instead of a library of independent discrete models for each device size and process variation. It has the ability to track layout and process technology changes.
“At Fairchild, we are focused on providing excellent high-voltage design enablement
platforms,” Chris Allexandre, Senior Vice President of Worldwide Sales and Applications at Fairchild, said. “These new SPICE models enable virtual prototyping, helping our customers
solve problems faster and develop new products with the shortest time to market, and are part
of our commitment to provide amazing service that delivers measureable value for our