Cabinets, Enclosures & Packaging, Connection/Mounting, Electronic Materials, ESD Protection, Manufacturing & Assembly
Rogers will be exhibiting at the upcoming Del Mar show May 4th and 5th at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers will be exhibiting at Booth #622, with information and insight on the use of their circuit materials, including 92ML laminates & prepregs, ULTRALAM 3850HT, CLTE-XT, and RO3003 laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.
92ML thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high power applications. These thermally conductive epoxy based prepregs and laminates are halogen-free and flame retardant. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. 92ML materials are ideal for multilayer applications requiring thermal management throughout the entire board. The laminates are available with up to 4oz copper cladding; thick enough to meet today’s most demanding power distribution requirements. The high thermal conductivity of up to 3.5 W/mK (in-plane) in combination with the relative ease and familiarity of epoxy based systems makes this material an ideal candidate for applications such as motor controllers, power supplies, converters, automotive electronics, etc.
Additionally, 92ML StaCool laminate is a combination of a 92ML copper clad laminate with an aluminum plate to form an insulated metal substrate (IMS). In this configuration, the product has an integrated heat sink that can be machined and formed to serve as a mechanical chassis in the final application. This laminate is characterized as having a high level of thermally stable adhesion to the aluminum substrate. 92ML StaCool laminate is useful in high power and operating temperature applications such as LED modules, automotive lighting, power devices, etc.
ULTRALAM 3850HT high-temperature (HT) liquid-crystal-polymer (LCP) circuit material delivers high yields in multilayer circuits. Its high melt temperature of 330°C improves multilayer layer-to-layer registration and offers improved thermal stability, while its low effective dielectric constant (3.14 @10GHz), low loss (0.002), and thin core offerings make it an ideal circuit material for millimeter frequencies, including 77 GHz used in long range automotive collision-avoidance radar systems. Being highly impermeable, it is an attractive alternative to ceramic for MMIC (monolithic microwave integrated circuit) packaging.
CLTE-XT laminates are formulated for use in some of the most demanding phase-sensitive applications in communications, radar and electronic-warfare (EW) circuits and systems. These composite materials are ceramic-filled PTFE based circuit materials with woven fiberglass reinforcement. With eXtended Technology, CLTE-XT laminates maintain a low Dk of 2.94 across wide temperature ranges. CLTE-XT laminates provide excellent dimensional stability, with lower loss than the original CLTE circuit materials. The CLTE-XT materials are available with ED, RT, Rolled and Resistor Foils as well as heavy metal backing (aluminum, brass and copper). Tried and tested performance continue to make CLTE-XT laminates a top choice for a wide range of ground-based and airborne communications and radar systems.
Also featured will be RO3003 laminates clad with rolled copper. Smooth rolled copper, paired with the very low dielectric loss of the RO3000 PTFE-ceramic resin system, result in high frequency circuit materials with best-in-class insertion loss. These laminates are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant laminates are also available with rolled copper foils from ½ ounce up to 0.040” thick rolled copper plate.