Embedded Systems, Optoelectronics, Thermal Management
#optoelectronics #cooling #embedded
Rogers Corporation’s Power Electronics Solutions (PES) group will once again contribute to one of the world’s largest events for photonic products and technologies: the upcoming SPIE Photonics West Conference and Exhibition. The conference and exhibition is scheduled for January 28 through February 2, 2017 in San Francisco’s Moscone Center.
Photonics West is the world’s largest multidisciplinary gathering for lasers, photonics, and biomedical optics products and technologies, with more than 20,000 visitors expected to attend the week-long 2017 event.
Photonics West includes a scientific conference with more than 4500 technical presentations in three topic areas (biomedical optics and biophotonics, laser sources and lasers, and optoelectronic materials and devices). It also features two exhibitions: the BiOS Expo, with 200 companies showing products and services on biomedical optics, and the SPIE Photonics West 2017 Exhibition, where attendees can visit representatives from more than 1300 global suppliers of lasers and photonics. Among those, Rogers Power Electronics Solutions (PES) will be showing their innovative material solutions for enhancing the performance of lasers and photonics components and systems.
Rogers at Booth 409
Representatives from Rogers Power Electronics Solutions (PES) group (Rogers Germany GmbH) will be part of the SPIE Photonics West 2017 Exhibition, available at Booth 409 to show samples of their latest material-based products and to offer invaluable advice on how to apply those products to lasers and photonics designs for effective thermal management and extended operating lifetimes.
Among the Rogers PES products on display at Booth 409 will be its curamik® families of cooling products, such as curamik® CoolPerformance Plus. This active water-cooled laser diode cooler effectively removes the heat from high-power laser diodes in the tightest spaces, helping to enhance power efficiency and extend operating lifetimes. These curamik® CoolPerformance Plus coolers are formed of OFHC copper for excellent thermal conductivity and an integrated ceramic substrate for electrical isolation, combining for a tightly controlled coefficient of thermal expansion (CTE) of 5.0 to 6.5 ppm/K from +25 to +300°C.
In addition to curamik® CoolPerformance Plus, Rogers PES will show examples of its curamik® CoolPower and curamik® CoolEasy material-based laser and photonics cooling solutions. curamik® CoolPower and CoolPower Plus coolers are fabricated with multiple layers of pure copper for effective thermal dissipation in the smallest volumes possible. The coolers benefit from the unique curamik® bonding process to achieve hermetic multilayer structures without solder or additional adhesive layers. curamik CoolEasy and CoolEasy Plus coolers are especially designed for conductive cooling of high-power laser diodes and laser diode bars. These copper coolers can be precisely machined and milled to meet the flatness requirements for mounting to laser diodes and avoiding potential “hotspots” in laser diode circuits.