Lighting & Illumination

November 2015

Infineon’s rugged TRENCHSTOP 5 S5 IGBTs extends operational lifetime and efficiency in PV & UPS apps

Infineon Technologies continues to improve IGBT performance with the release of their S5 (S for soft) family. It is based on the ultra-thin wafer TRENCHSTOP 5 IGBT. This family has been developed specifically for AC-DC energy conversion in industrial applications switching up to 40 kHz, typically to be found in

. . . Learn More

Date:

11/12/2015

Using point-of-load modules

Alan Elbanhawy, Exar

Despite the development of ultralow power integrated devices, the overall demand for power at a system level is only increasing. At the same time, OEMs remain under pressure to make their end-applications physically smaller, which continues to drive demand for smaller and more efficient power supplies. While improveme

. . . Learn More

Date:

11/05/2015

Assessing next-generation discretes

Dr. Thomas Barbieri, Wolfspeed, A Cree Company

When the first generation of silicon carbide (SiC) Schottky diodes was introduced more than 10 years ago, their widespread adoption was somewhat challenged by unforeseen dV/dt limitations within certain manufacturers’ devices. In particular, devices with lower dV/dt capability were susceptible to failure from larg

. . . Learn More

Date:

11/05/2015

SFH 7060 consists of three green LEDs, one red LED, one infrared LED, and one large-format photodiode

Osram Opto's latest low-power optimated optical sensor now at Rutronik

Osram Opto Semiconductors’ new sensor SFH 7060, a further development of optical sensor SFH 7050, is designed to measure pulse rates and the oxygen saturation level of blood. It offers excellent signal quality as well as low energy consumption and is ideal for wearables such as smartwatches and fitness armbands. Th

. . . Learn More

Date:

11/04/2015

Guillaume Chansin, IDTechEx

Flexible sensors: an expanding market

Guillaume Chansin, IDTechEx

Large investments have been made to enable flexible, thin sensors rather than rigid sensors. $75 million was recently awarded by the US Department of Defense to establish a new Manufacturing Innovation Institute (MII) for flexible hybrid electronics in San Jose, California. Under the acronym FHE MII, this new en

. . . Learn More

Date:

11/01/2015

Core loss modeling part II

Dr. Ray Ridley, Ridley Engineering

As modern power converters move towards higher efficiency, it is essential to have better models for all of the loss mechanisms in your components. In the first part of this article, we talked about the need for a single continuous equation to match the empirically measured losses. In this second part, the effect of

. . . Learn More

Date:

11/01/2015