Automotive

February 2019
Gen III GaN Platform Earns Automotive Qualification
GOLETA, Calif.— Transphorm Inc. announced that its third generation, JEDEC-qualified high voltage GaN platform has passed the Automotive Electronics Council’s AEC-Q101 stress tests for automotive-grade discrete semiconductors. This achievement marks the company’s second automotive-qualified
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Date:
02/27/2019
Automotive USB 3.1 SmartHub Enables 10x Faster Data Rates
CHANDLER, Ariz. — As firmware updates and larger media files become more prevalent in automotive entertainment consoles, faster data rates are required to reduce upload and download times. Microchip Technology Inc. announced an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to
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Date:
02/26/2019
PSD Celebrating 15 Years of Publishing

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Jim & Julia Graham

2019 has arrived and it marks a Big Anniversary for the PSD team!  PSD is celebrating our 15th year in publishing for the global power electronic engineering community.  Back in 2004, when the "big publishers" decided that they would close magazines like PCIM Europe
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Date:
02/25/2019

Slightly more than forty years ago, the silicon power MOSFET was a disruptive technology that displaced the bipolar transistor as the power conversion device of choice for the semiconductor industry – and a $12B market emerged.
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Date:
02/24/2019
Porous Carbon Fiber Research Closer for Automotive Industry

This figure shows the synthesis of porous carbon fibers and loading of MnO2. (a) A diblock copolymer of polyacrylonitrile-block-polymethyl methacrylate (PAN-b-PMMA) is spun into a polymer fiber mat. In the magnified view, the block copolymer microphase separates into a bicontinuous network structure. (b) After pyrolysis, the block copolymer fibers are converted to porous carbon fibers (black) with continuous and uniform mesopores (white channels), which afford high loadings of transition metal oxides. (c) The porous carbon fibers are loaded with manganese oxide (magenta). In the magnified view, the continuous carbon fiber matrix and partially filled mesopores provide effective expressways for electron conduction and ion diffusion, respectively.

An update on recently reported research on porous carbon fibers shows how this material can be used in an industrial setting, marking an important step from the theoretical to application. Guoliang
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Date:
02/19/2019
Integrated Embedded Motor Controller With Extended Memory
TDK Corporation expands its Micronas embedded motor controller portfolio with the HVC 4420F, featuring extended flash memory for the drive of small brush-type, stepper, or brushless motors. It is designed to satisfy the latest needs of the automotive industry to provide diagnostics capability
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Date:
02/19/2019
AVX Supports GEOX DRAGON All-Electric Formula-E Racing Team
FOUNTAIN INN, S.C. – AVX Corporation is sponsoring the GEOX DRAGON Formula-E racing team in partnership with Mouser Electronics, TTI, Inc., and Molex. The world’s first and only racing series with all-electric vehicles, the ABB FIA Formula-E Championship is a fusion of engineering, technology, sport, science,
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Date:
02/14/2019
Ethernet Bridges Save Power in Automotive Platforms
CHANDLER, Ariz. — Embedded and automotive platform designers who are seeking Peripheral Component Interconnect Express (PCIe) 3.1 Low-Power Sub-State (LPSS) L1.1 and L1.2 for power savings now have new options available from Microchip Technology Inc. The LAN7430 Ethernet bridge provides integrated
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Date:
02/12/2019
SiC Schottky Diodes Offer Improved Efficiency
CHICAGO — Littelfuse, Inc. introduced two second-generation series of 650V, AEC-Q101-qualified silicon carbide (SiC) Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are available with a choice of current ratings (6A, 8A, 10A, 16A or 20A). They offer power
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Date:
02/12/2019
Miniaturized Thin-Film Inductors for ADAS Applications
TDK Corporation announces the TFM252012ALVA thin-film metal power inductors that can be connected directly to a 12 V car battery while maintaining small dimensions with a footprint of just 2.5 mm × 2.0 mm and a height of 1.2 mm. Thanks to the magnetic metal core these newly developed inductors offer a rated
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Date:
02/12/2019
Battery Shunt Resistors Increase Accuracy, Lower Costs
MALVERN, Pa. — Vishay Intertechnology, Inc. introduced the new WSBS5216 and WSBS5216...14 12 W Power Metal Strip battery shunt resistors in the compact 5216 case size. With extremely low resistance of 100 µΩ, the Vishay Dale AEC-Q200 qualified devices increase accuracy and lower costs compared with Hall
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Date:
02/11/2019
Power Analysis Software for 12-bit HD Oscilloscopes
Chestnut Ridge, NY – Teledyne LeCroy launched its 3-Phase Power Analysis software package, which brings 1-phase and 3-phase static and dynamic power analysis to its HDO8000A, HDO6000A and WavePro HD 12-bit High Definition oscilloscopes. With the 3-Phase Power Analysis software package, research
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Date:
02/04/2019