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Communications & Datacom

 



 

 

Communications & Datacom

December 2014
A pilot scheme launched by the European Commission in 2013 is likely to lead to a set of guidelines that will help reduce the environmental footprint of data centers. The Product Environmental Footprint (PEF) pilots will harmonize industry regulations across the European Union and include projects that look
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Date:
12/30/2014
Here are the results of an output capacitor benchmark study used in a step-down DC/DC converter design, based on a well-used control IC (Maxim’s MAX 1537 [1]) with a 6-24V input voltage range and two separate voltage outputs of 3.3 and 5V. “Some 99 percent of so-called ‘design’ problems associated
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Date:
12/30/2014
There is no Moore’s Law for passive components like capacitors, but relentless development is delivering the kinds of devices engineers need to deliver cutting-edge new products for modern living. Capacitors have for many years enabled electronic designers to manage energy within circuits and fulfill basic
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Date:
12/30/2014

The counterfeiting of well-known brands and products is a growing problem, estimated to be five to seven percent of world trade. Among those well-known brands are consumer safety and critical electrical products, which can have threatening implications for workers and facilities. The cost
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Date:
12/30/2014
Frederik Dostal von Analog Devices Ãber Energy Harvesting

Frederik Dostal von Analog Devices

In diesem PSDcast Frederik Dostal von Analog Devices spricht mit Alix Paultrevon Power Systems Design über die Fragen im Zusammenhang mit Energie ernten und einige der Dinge ADI bieten über Lösungen für das Engineering Community. Energy Harvesting ist nicht nur ein Akku-Tausch Technologie, so dass kleine
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Date:
12/30/2014
As the overall size of communications, medical, and other cloud-enabled equipment continues to decrease, power management becomes an increasingly important design consideration. The latest highly-integrated power management solutions provide advantages in powering RF systems, FPGAs, and processors, and powerful
. . . Read More
Date:
12/30/2014
Defining consumer electronics

Kevin Parmenter, Excelsys

Once upon a time electronics went into neat precise product categories, making marketing people at electronics component companies happy. However the situation has become far more complex. Consumer electronics products are now finding their way into other applications, because frankly they are better, faster,
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Date:
12/30/2014
Energy-harvesting NFC/RFID tag authenticator securely protects sensitive data transfer between master and slave devices

MAX66242 DeepCover Secure Authenticator

Designers can now perform secure wireless data communication on their embedded systems without needing the host microcontroller, but by simply using a single MAX66242 DeepCover Secure Authenticator from Maxim Integrated Products. The MAX66242 secure authenticator is an advanced tag that combines a wireless NFC/RFID
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Date:
12/29/2014
The Consumer Electronics Association (CEA) announced that the 2015 International CES will feature the largest ever showcase of products, services and technologies that make up the “Internet of Things” (IoT), with more than 900 exhibitors planning to share innovations that harness the power of the network
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Date:
12/29/2014
Doug Bailey of Power Integrations on Power.com

Doug Bailey of Power Integrations

In this PSDcast Doug Bailey of Power Integrations talks to Alix Paultre of Power Systems Design about the company's rebranding with the launch of www.power.com and the redesign of the company's logo. The changes are not only cosmetic; they reflect the significant growth, expansion, and strategy of the new Power
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Date:
12/24/2014
Coupling quantum dot light emitters with nanofibers for quantum internet applications

Research is ongoing to develop fiber in-line technology to integrate atomic sources of light into optical nanofibers

Professor Hakuta and his group at the Center for Photonic Innovations are addressing the following issues to develop fiber in-line technology to integrate atomic sources of light into optical nanofibers. Fabrication of high efficiency tapered glass nanofibers; development of reproducible methods for integrating
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Date:
12/24/2014
AVX claims smallest and thinnest fused undertab high CV tantalum SMD chip capacitors available

F98-AS1 Series fused undertab high CV tantalum SMD chip capacitors

AVX, a leading manufacturer of passive components and interconnect solutions, has released a new series of fused high CV tantalum SMD chip capacitors with undertab terminations. The new F98-AS1 Series capacitors feature a proprietary lead-frame-less structure with precise dimensions and low stress packaging,
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Date:
12/23/2014
ROHM's latest Intelligent power modules offer high-performance switching

ROHM IPM

ROHM Semiconductor unveiled its new IPM (Intelligent Power Module) family for power-efficient motor driving and inverter applications. Based on ROHMs experience with Power Devices the new module series includes IGBT based modules optimized for low or high speed operation as well as MOSFET based IPMs which incorporates
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Date:
12/23/2014
Anderson Power Products offers 3 & 5 position Mini PL SPEC Pak connector

Mini PL SPEC Pak is a series of compact, environmentally sealed connectors

Anderson Power Products (APP) Mini PL SPEC Pak is a series of compact, environmentally sealed connectors. Mini PL SPEC Pak connectors are touch safe on both sides and feature a latching shell. Power handling capabilities up to 23 amps and 600 volts AC/DC per pole allow more power in a smaller waterproof (IP68)
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Date:
12/22/2014
2014 trends lay groundwork for IoT

The Intel Edison is part of a Wearables campaign by Intel.

The Internet of Things (IoT) promises to construct a digital shadow of the physical world, and this presents opportunities that are tremendous in scope and profound in their implications. At the same time, realizing this vision of a massively interconnected life requires both the push of a critical mass of smart
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Date:
12/19/2014
John Bard of Fujitsu on server power and thermal management

John Bard of Fujitsu

In this PSDcast John Bard, VP of Enterprise Servers at Fujitsu America, talks to Alix Paultre of Power Systems Design about the latest issues in server energy and thermal management. They discuss the importance of modernizing IT infrastructures, especially for mission critical apps like power grid statics, billing,
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Date:
12/19/2014
Alpha and Omega Semi's 40V 0.99mOhm MOSFET comes in a DFN5x6 package

The AON6590 is designed to address a wide
range of applications including primary-side and secondary-side switching, secondary-side
synchronous rectification, and POL
modules

Alpha and Omega Semiconductor, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, announced the release of the AON6590, the flagship device in its new 40V medium voltage portfolio. The AON6590 is designed to address a wide range of
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Date:
12/18/2014
ON Semi unveils latest ultra-low power precision op-amps

NCS325 and NCS333 op amps

ON Semiconductor, driving energy efficiency innovations, has introduced a family of affordable, precision CMOS operational amplifiers (op amps) that deliver zero drift operation and industry leading quiescent current for front-end amplifier circuits and power management designs. Targeted at industrial, white
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Date:
12/18/2014
Alan Grau of Icon Labs on device security

Alan Grau of Icon Labs

In this PSDcast Alan Grau, President and CEO of Icon Labs, talks to Alix Paultre of Power Systems Design on the issues of security in cloud-enabled embedded systems and devices. Icon Labs provides unique and specialized security software for IoT devices and embedded systems. These products are modular security
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Date:
12/17/2014
O2Micro, a global leader in the design, development and marketing of high-performance integrated circuits and solutions, was granted a U.S. patent for its Battery Management Systems (BMS) with Vertical Bus Circuits. A BMS monitors battery modules to ensure safe operation and
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Date:
12/17/2014
Linear's latest step-down ÂμModule regulator's entire solution fits within 0.5cm²

The LTM4625 5A, 20VIN step-down µModule regulator

Linear Technology launched the LTM4625, a 5A, 20VIN step-down µModule (micromodule) regulator in a 6.25mm x 6.25mm x 5.01mm BGA package which, with a few passive components, fits into 0.5cm² on a double-sided PCB. Like other µModule regulators, the LTM4625 includes the DC/DC controller, power switches, inductor
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Date:
12/17/2014
Molex modular D-Sub mixed-layout connectors handle up to IP69-rating for harsh environments

Molex modular D-Sub mixed-layout connector

Molex introduced modular D-Sub mixed-layout connectors and cable assemblies through FCT electronic, a Molex company. Tailored to meet specific customer requirements, the UL-approved D-Sub mixed layout connectors can combine power, signal, RF and pneumatics to accommodate a range of industrial automation applications.
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Date:
12/17/2014
Orion's latest high-airflow fan tray available with redundant power capability

OA406 Series AC fan tray

Orion Fans, a leading manufacturer of standard and custom AC and DC fans, fan trays and accessories, has expanded its high-airflow fan tray offering to include a front exhaust unit available with up to six-fan positions. Ideal for narrow depth cabinets found in security, audio and A/V
. . . Read More
Date:
12/17/2014
Silego Technology introduced the SLG4LCxxxxV series, a Universal Fast Charge Identification Solution that features Qualcomm® Quick Charge™ 2.0 technology. The SLG4LCxxxxV series helps identify devices supporting Quick Charge 2.0 and provides the correct control information to the power supply to set the proper
. . . Read More
Date:
12/16/2014
Stackpole Improves Resistor Voltage Ratings

RSF / RSMF Series 3W and 5W resistors

Stackpole announces upgrades in the working voltage ratings for the RSF / RSMF Series 3W and 5W resistors. The RSF3 working voltage is improved from 400V to 800V, the RSMF3 working voltage is improved from 500V to 600V, and the RSF5 and RSMF5 working voltage is upgraded from 750V to 1000V. This enhances
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Date:
12/16/2014
Lattice Semiconductor, a leader in ultra-low power, small form-factor, customizable solutions, announced the availability of human voice detection and command recognition IP for smartphones and other handhelds for the growing Internet of Things (IoT) category of devices. These IPs are implemented in the iCE40
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Date:
12/15/2014
ams, a leading provider of high performance sensors and analog ICs, added to its family of power management ICs (PMICs) for mobile multi-core ARM processors with the AS3722, which provides a complete power-control solution for Nvidia’s Tegra K1 mobile system-on-chip (SoC). ams is also releasing
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Date:
12/15/2014
Vishay's VRPower DrMOS power stages deliver high power-density for multiphase POL regulators

Vishay Siliconix SiC789 and SiC788

Vishay Intertechnology introduced a new family of VRPower integrated DrMOS power stage solutions in three PowerPAK package sizes to meet the various design challenges in high-power and high-performance multiphase POL applications. The Vishay Siliconix SiC789 and the SiC788 are offered in the MLP66-40L with an
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Date:
12/12/2014
Linear's latest FMEA-compliant 45V LDO operates up to +150°C

Linear Technology LT3007

Linear Technology announced a new wider temperature range H grade version of the LT3007, the latest member in a family of high voltage, micropower, robust PNP-based LDOs, featuring an ultralow 3µA quiescent current. The device's H grade 150°C junction temperature rating enables high temperature or high power
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Date:
12/12/2014
Power management company Eaton announced the release of its BRX miniature circuit breaker. The product will provide electrical contractors design freedom by reducing costs and making installation easier. By implementing the BRX miniature circuit breaker, there is no need for specified upstream breakers, and
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Date:
12/12/2014
IR’s latest high-density FastIRFET in 4x5 PQFN packaging offers a compact solution for DC-DC apps

IRFH4257D FastIRFET dual power MOSFET

International Rectifier, a leader in power management technology, announced the introduction of the IRFH4257D FastIRFET dual power MOSFET housed in a high performance 4x5 PQFN power block package. The new package option expands the power block family’s capability to lower power for compact designs in 12V input
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Date:
12/12/2014
Renesas Electronics, a premier provider of advanced semiconductor solutions, introduced 5 new product versions in the RMLV0816B and RMLV0808B series of Advanced Low-Power SRAM (Advanced LP SRAM), the company’s flagship SRAM (static random access memory) devices. The new memory devices have a density of 8 megabits
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Date:
12/11/2014
Pulse Electronics introduces its latest HDBaseT transformers

Pulse Electronics' HDBaseT Ethernet transformers

Pulse Electronics, a leading provider of electronic components, introduced its new HDBaseT transformers that provide common mode noise reduction for improved EMI performance and isolation for power over HDBaseT (PoH) applications. Pulse Electronics' HD8004FNL and HD8005FNL transformers are qualified for Valens
. . . Read More
Date:
12/11/2014
Silego's high-accuracy programmable current-sensing load switch Rich touts ultra-low RDSON

Silego Technology’s CurrentPAK

Silego Technology introduced the CurrentPAK family of configurable mixed-signal ICs, or CMICs. A high-performance load switch with efficient, high-accuracy current measurement, CurrentPAK is also the world’s first load switch to have advanced programmable features. Using Non-Volatile Memory (NVM), designers
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Date:
12/11/2014
Anton Roth von IsabellenhÃtte Ãber das elektronische Design industry

Anton Roth von Isabellenhütte

In diesem PSDcast Anton Roth von Isabellenhütte spricht mit Alix Paultre der Power Systems Design auf der electronica 2014 zu den Electronic Design Industrie. Positive Indikatoren sind u.a. die Automobilindustrie, industrielle anwendungen, und dem Internet der Dinge.
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Date:
12/10/2014
Vishay Intertechnology introduced its latest Trench IGBT (Insulated Gate Bipolar Transistor) platform featuring Punch Through (PT) and Field Stop (FS) technologies. Designed to increase efficiency in motor drives, UPS, solar inverters, and welding machine inverters, the Vishay Semiconductors devices, provided
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Date:
12/10/2014
Heard of structural electronics?

Dr Peter Harrop, Chairman, IDTechEx

Structural electronics is one of the most important developments this century yet most people have never heard of it. Strange - there are over 37 million items on Google. Two years ago, IEEE published,"3D Printing for Rapid Prototyping of Structural Electronics". Drayson revealed the "structural
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Date:
12/10/2014
Delta-Q Technologies, a leader in battery charging solutions for electric drive vehicles and industrial machines, today revealed new insights into its tailored approach to charging lead acid batteries in machines such as golf cars, lift trucks, aerial work platforms and floor cleaning machines. The company's
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Date:
12/10/2014
Infineon launches advanced high-power-module platform with royalty-free license of package design

Royalty-Free License of Package Design for Industry Use

Infineon Technologies announced the launch of two new power module platforms designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5kV. To make the benefits of the new module broadly available, Infineon is offering a royalty-free license of the design to all providers
. . . Read More
Date:
12/10/2014
EtherNet/IP equipment can now be remotely monitored and controlled with Netbiter

Netbiter gateway

The Netbiter Remote Management solution from HMS Industrial Networks now allows automation devices using EtherNet/IP to be monitored and controlled via the web. By connecting a Netbiter EasyConnect 300-series gateway, users of EtherNet/IP-based equipment can do maintenance from any location.The Netbiter Remote
. . . Read More
Date:
12/10/2014
Cree claims highest-power 50V GaN HEMT at 320W

Cree's family of 50V discrete GaN high electron mobility transistor (HEMT) die

Cree, a leading global supplier of silicon carbide (SiC) and gallium nitride (GaN) wafers and devices, has extended its family of 50V discrete GaN high electron mobility transistor (HEMT) die with the release of three new components: a 20W, 6GHz die; a 75W, 6GHz die; and a 320W, 4GHz die. Currently comprised
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Date:
12/10/2014
Analog Devices unveils direct conversion receiver development platform for radar

The AD-FMCOMMS6-EBZ evaluation board

Analog Devices announced an integrated direct conversion receiver development platform for radar systems where reduced size, weight and power (SWaP) implementation is critical. The new AD-FMCOMMS6-EBZ platform is a 400-MHz to 4.4-GHz receiver (1350 MHz to 1650 MHz with installed filters) supporting the key L-
. . . Read More
Date:
12/10/2014
GreenPeak Technologies, an industry-leading Smart Home semi-conductor/system company, announced that they will be demonstrating an exciting array of impressive Real Life Smart Home applications at the January 2015 Consumer Electronics Show in Las Vegas, Sands Expo, “The Heart of the Smart Home”, in booth
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Date:
12/10/2014
Power & energy dataloggers suit three-phase applications

AEMC Power and Energy Data Logger

CAS DataLoggers released the flexible and powerful AEMC Power and Energy Data Loggers, ideal for electricians, engineers and contractors working in building/system monitoring and upgrades as well as residential energy audits. These cost-effective products have high speed and a removable SD memory to suit your
. . . Read More
Date:
12/09/2014
Bringing customers one step closer to the wireless Internet of Tomorrow, Freescale Semiconductor today extended its wireless charging portfolio by introducing the industry’s first 15W Qi-compliant wireless charging solution. The solution paves the way for ultra-fast wireless recharging for a variety of larger
. . . Read More
Date:
12/09/2014
Power Integrations launching InnoSwitch family of advanced switcher ICs

InnoSwitch family of highly-integrated switcher ICs

Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, announced a new class of power-supply ICs. The InnoSwitch family of highly-integrated switcher ICs combines primary, secondary and feedback circuits into a single, worldwide safety-rated, surface-mount package.
. . . Read More
Date:
12/05/2014
Vishay releases Its first two 600V fast body diode N-channel MOSFETs for soft switching topologies

Vishay Siliconix SiHx28N60EF and SiHx33N60EF

Vishay Intertechnology introduced the first two devices in its new 600 V EF Series of fast body diode n-channel power MOSFETs. With low reverse recovery charge and on-resistance, the Vishay Siliconix SiHx28N60EF and SiHx33N60EF increase reliability and save energy in industrial, telecom, computing, and renewable
. . . Read More
Date:
12/04/2014
Linear's 20A step-down uModule regulator is optimized for low VIN to low VOUT Conversion

LTM4639 20A DC/DC step-down µModule (micromodule) regulator

Linear Technology introduced the LTM4639, a 20A DC/DC step-down µModule (micromodule) regulator capable of converting 2.5V to 7V main-power system rails to point-of-load voltages as low as 0.6V with optimum efficiency. In complex rack-mount systems, improved voltage conversion efficiency results in savings
. . . Read More
Date:
12/04/2014
Pasternack expands portfolio of in-stock RF amplifiers

Pasternack connectorized RF amplifiers

Pasternack Enterprises, a leading manufacturer and supplier of RF, microwave and millimeter wave products, has significantly expanded their portfolio of connectorized RF amplifiers including high power amplifiers, high-rel amplifiers, broadband amplifiers, limiting amplifiers, power amplifiers, low noise amplifiers
. . . Read More
Date:
12/04/2014
In this episode of PSDtv Linear Technology demonstrates their latest wireless charging solution for Power Systems Design at electronica 2014.
. . . Read More
Date:
12/04/2014
In this episode of PSDtv Infineon demonstrates their latest tech for motion and presence capture for Power Systems Design at electronica 2014.
. . . Read More
Date:
12/04/2014
NXP Semiconductors introduced their line of multi-gate, multifunction, dual PCB configurable logic devices with Schmitt-trigger inputs. By offering more flexibility in the combinations of logic functions that can be achieved, NXP Logic allows design flexibility, reduced inventory cost and faster qualification
. . . Read More
Date:
12/03/2014
Harwin EZ-Shield Cans now available in kit form for fast, low cost development

EZ-Shield Can EMC protection screening products

Harwin, a leading hi-rel connector and SMT board hardware manufacturer, now offers its EZ-Shield Can EMC protection screening products in kit form, enabling designers to rapidly construct PCB cans at minimal cost for development purposes. Harwin’s EZ-Shield Cans are simply pressed onto pre-positioned
. . . Read More
Date:
12/03/2014
Push-pin heat sinks enable over 100,000 configurations

ATS push pin heat sinks

With 108,000 possible configurations, Advanced Thermal Solutions now provides the widest choice of push pin-mounted heat sinks for cooling BGAs and other hot components. More than 200 ATS heat sinks are available with convenient push pin mounting. The lightweight aluminum heat sinks include straight fin, cross-cut,
. . . Read More
Date:
12/03/2014
PFC (power-factor correction) circuit designers have used average current-mode control for decades (figure 1). Various analog PFC-control chips based on this control algorithm are available in the commercial market.
. . . Read More
Date:
12/03/2014
The Qt Company has announced that six leading designers and suppliers of embedded chipsets have joined the Qt Partner Program. The program aims to create value for the whole Qt ecosystem with members integrating technologies with Qt so that users benefit from a seamless, integrated experience. The
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Date:
12/02/2014
Mouser empowers â€Next Great Thing’ with development tools center

Engineering Development Tools Center on Mouser.com

Mouser Electronics announced the launch of its new Engineering Development Tools Center on Mouser.com. This time-saving microsite allows developers to select from a variety of development tools for products such as microcontrollers, analog and digital ICs, LED lighting, optoelectronics, wireless, and more. The
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Date:
12/02/2014
Wind River, a leader in delivering software for intelligent connected systems, announced its achievement as the continued real-time operating system (RTOS) and embedded Linux market leader according to the latest findings from VDC Research. VDC’s study of the Embedded/Real-Time Operating Systems segment covers
. . . Read More
Date:
12/02/2014
In this episode of PSDtv Freescale Semiconductor describes Farnell's latest evaluation board at electronica 2014 for Power Systems Design. The board has a wealth of I/O connectivity
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Date:
12/01/2014
UPS Systems, the UK’s largest independent supplier of standby power solutions, has been awarded RISQS accreditation by Achilles. The 'Railway Industry Supplier Qualification Scheme' (RISQS), formerly known as Achilles Link-Up, has been developed to provide a fair, open and transparent third party
. . . Read More
Date:
12/01/2014
Some 4.9 billion connected “things” will be in use in 2015, up 30% from 2014, and will reach 25 billion by 2020, according to recent research from industry analyst Gartner. Designers from embedded electronics specialist, ByteSnap Design, are behind a range of M2M devices, from a Head-Up Display for motorcyclists,
. . . Read More
Date:
12/01/2014
Linear's ultrathin 1.8mm, 3A ÂμModule regulator offered in a 6.25mm x 6.25mm LGA package

LTM4623 3A µModule step-down regulator

Linear Technology introduced the LTM4623 3A µModule (micromodule) step-down regulator in an ultrathin 1.8mm profile LGA package with only a 6.25mm x 6.25mm footprint. With solder paste, the package height is less than 2mm, meeting the height restrictions of many PCIe (Peripheral Component Interconnect Express),
. . . Read More
Date:
12/01/2014
Linear's LTM4623 3A ÂμModule step-down regulator comes in a 1.8mm-high LGA package

Ultrathin 3A µModule Regulator

Linear Technology introduced the LTM4623 3A µModule (micromodule) step-down regulator in an ultrathin 1.8mm profile LGA package with only a 6.25mm x 6.25mm footprint. With solder paste, the package height is less than 2mm, meeting the height restrictions of many PCIe (Peripheral Component Interconnect Express),
. . . Read More
Date:
12/01/2014

 



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