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Communications & Datacom

 



 

 

Communications & Datacom

November 2015
OMC 's active alignment-based fiber-optic links solve consistency problems for HV apps

Fiber optic cable assembly with Active Alignment technology

HV applications such as power distribution networks and power supplies often require optical isolation because of the voltages present, however, achieving consistency of performance has proven a challenge for many providers. OMC has combined 30 years of experience in producing glass and polymer fibre optic
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Date:
11/30/2015
Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and PMC-Sierra, a semiconductor and software solutions leader in storage, optical and mobile networks, announced that they have entered into a definitive agreement under which Microsemi will
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Date:
11/30/2015
Talking about mid-size power systems with Acopian

Acopian's Mark Wilkins and Alex Karapetian

In this PSDcast, Acopian's Chief Engineer, Mark Wilkins and their Sales & Marketing Director, Alex Karapetian talk to Power Systems Design about mid-size power systems. Not as glamorous as
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Date:
11/27/2015

In diesem Episode von PSDtv erklärt Omicron Lab ihre IEEE 1588 lösung für industrielle Netzwerke. Mit eine integrierter Antenne PTP Grandmaster Clock , die OTMC 100 , bietet
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Date:
11/27/2015
In this episode of PSDtv Omicron Lab explains their IEEE 1588 timing solution for industrial networks. Among their available solutions, their antenna-integrated PTP grandmaster
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Date:
11/27/2015
XP Power announced today that it has acquired the business and assets of EMCO High Voltage Corporation (“EMCO”), a designer and manufacturer of high voltage power modules, for a total cash consideration of US$ 12.0 million (£7.8 million). EMCO, based in Northern California and with manufacturing operations
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Date:
11/25/2015
RS Components (RS), the trading brand of Electrocomponents and a distributor for engineers, has announced availability of two new solid-state relay (SSR) series from Kudom. These new SSRs offer built-in touch-proof protection and high-quality performance at a highly competitive price to meet the demands of industrial
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Date:
11/24/2015
Silicon Labs has announced the acquisition of Telegesis, a leading supplier of wireless mesh networking modules based on Silicon Labs’ market-leading ZigBee technology. A privately held company founded in 1998 and based near London, Telegesis has established itself as a ZigBee expert with strong momentum in
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Date:
11/24/2015
Infineon's 2EDN EiceDRIVER for MOSFETs sets new standards in robustness and power dissipation

2EDN EiceDRIVER ICs come in industry standard 8-pin packages and feature two independent, non-isolated low-side channels

Infineon Technologies launched their new 2EDN7524 EiceDRIVER ICs for the PFC, LLC and synchronous rectification stages of switch mode power supplies. With this newly introduced driver IC family Infineon is leveraging its extensive knowledge and leading market position offering dedicated MOSFET drivers for the
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Date:
11/24/2015
Spain’s TSK standardizes on AVEVA Integrated Engineering & Design for multi-discipline integration

Integrated Engineering and Design provides pervasive integration across 1D, 2D and 3D views

AVEVA announced that TSK, Spain’s leading specialist in Renewable Energy projects, has selected the AVEVA Integrated Engineering & Design (IE&D) software solution. Initially requiring a 3D design tool, TSK were shown the full benefit of AVEVA’s complete IE&D approach. By integrating all engineering
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Date:
11/24/2015
XP Power claims world’s smallest 130W AC-DC power supplies

ECP130 series miniature open-frame AC-DC power supplies

XP Power has announced the high efficiency ECP130 series of miniature open-frame AC-DC power supplies, with safety approvals for the ITE and medical equipment markets. The units deliver the full 130 W output with only 10 CFM of forced air cooling and are also able to provide a high convection cooled rating of
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Date:
11/24/2015
IDT's latest SPDT switch features KZ constant impedance tech

The IDT F2923 low insertion loss SPDT absorptive RF switch

Integrated Device Technology introduced the industry’s first single-pole, double-throw (SPDT) RF switch featuring its patent-pending KZ constant impedance technology. The IDT F2923 is a low insertion loss SPDT absorptive RF switch designed for a multitude of RF applications, including base stations (2G, 3G,
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Date:
11/24/2015
IDT introduces highly-integrated PMIC for enterprise SSD and computing apps

The P8300 flexible, highly programmable PMIC

Integrated Device Technology introduced a new multi-channel power management IC (PMIC) optimized for enterprise solid state drives (eSSD) and designed to speed time to market and revenue. The P8300 is a flexible, highly programmable PMIC ideal for a broad set of data center, enterprise and high-performance computing
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Date:
11/20/2015
Ericsson announced the launch of a new 60A 3E digital point-of-load (POL) DC/DC power module, the BMR466, designed to power microprocessors, FPGAs, ASICs and other digital ICs on complex boards. Up to eight of the fully regulated 60A (maximum) POL converters can be connected in parallel to deliver up to 480A
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Date:
11/18/2015
Infineon Technologies continues to improve IGBT performance with the release of their S5 (S for soft) family. It is based on the ultra-thin wafer TRENCHSTOP 5 IGBT. This family has been developed specifically for AC-DC energy conversion in industrial applications switching up to 40 kHz, typically to be found
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Date:
11/12/2015
Wirepas has joined the ARM mbed partner ecosystem. Finnish-based Wirepas provides advanced wireless communication solutions for connecting devices to the Internet. Wirepas PINO is highly scalable, energy-efficient, and fully self-configuring network protocol. With PINO customers can create wireless multi-hop
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Date:
11/12/2015
Chris Cokayne of Analog Devices on their ThingWorx partnership and the IoT

Chris Cokayne of Analog Devices

In this PSDcast, Chris Cokayne, Technical Sales Manager at ADI, talks to Alix Paultre of Power Systems Design about the next generation of the Internet of Things (IoT) and the collaborative development partnerships manufacturers need to make in order to have the proper IP palette required to crearte the next
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Date:
11/11/2015
Hirose's high-current hybrid connector saves space and cost

BM24 Series hybrid board-to-FPC connector system

Hirose, a leader in the development of innovative connector solutions, has launched a new hybrid power and signal connector designed for power line connection in various applications. The high-power BM24 Series board-to-flex printed circuit (FPC) connector features a unique, space saving design that concentrates
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Date:
11/10/2015
Adesto Technologies, a leading provider of application-specific, feature-rich, ultra-low power non-volatile memory products, announced the launch of a new line of extended voltage range (1.65V-4.4V Vcc) serial Flash memory products. In 2014, Adesto introduced the world's first
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Date:
11/10/2015
Rutronik Elektronische Bauelemente is now the global distributor for switching technology specialist knitter-switch. The franchise agreement encompasses its entire product portfolio. Since it was founded in 1966, knitter-switch has specialized in switching technology and today offers an enormous selection of
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Date:
11/10/2015
Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will be participating in the Electric Automation Systems and Components Conference (SPS IPC Drives) from Nov. 24-26, 2015 at the Nuremberg Messe in Germany. Microsemi will be showcasing its
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Date:
11/10/2015
Eaton's supercap energy storage modules for backup power UPS systems provide cost-effective long-life alternative to batteries

XLM Supercapacitor Energy Storage Module

Power management leader Eaton announced the XLM Supercapacitor Energy Storage Module, designed to provide fast discharge for bridge events in uninterruptible power supplies (UPS) for mission-critical applications where even brief downtime can have a major negative impact. The modules offer a highly reliable,
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Date:
11/09/2015
EnSilica, a leading independent provider of semiconductor IP and design services, has appointed Anglia Components as its business development partner in the UK and Ireland for its eSi-Modules family of FPGA-based system-on-modules. Anglia will target the eSi-Modules at key vertical industry sectors including
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Date:
11/09/2015
The explosion of Internet applications and data usage has put a great deal of pressure on servers and their related infrastructures. This massive growth of resources poses questions on energy demand to the major Internet providers and server makers, increasing the demand for more efficient energy utilization. Every
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Date:
11/05/2015
The longstanding worldwide trend in telecommunication has been away from fixed (wireline) service and towards wireless communication (see Figure 1). Meanwhile, as part of the convergence of tele- and data-communication, network traffic has been increasing by an order of magnitude roughly every four to five years.
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Date:
11/05/2015
When the first generation of silicon carbide (SiC) Schottky diodes was introduced more than 10 years ago, their widespread adoption was somewhat challenged by unforeseen dV/dt limitations within certain manufacturers’ devices. In particular, devices with lower dV/dt capability were susceptible to failure from
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Date:
11/05/2015
Despite the development of ultralow power integrated devices, the overall demand for power at a system level is only increasing. At the same time, OEMs remain under pressure to make their end-applications physically smaller, which continues to drive demand for smaller and more efficient power supplies. While
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Date:
11/05/2015
IDT taps Richardson for global distribution of RF products

IDT’s RF products include attenuators, mixers, modulators and demodulators, variable gain amplifiers, switches and RF timing devices

Integrated Device Technology announced it is partnering with Richardson Electronics to distribute IDT’s leading RF and RF timing products throughout North America, Europe and Asia. The LaFox, Ill.-based distributor has a large team of experienced RF specialists to work with customers interested in IDT’s
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Date:
11/04/2015
Toshiba launches high-speed photocouplers for industrial automation

The TLP2768A is suited for use in high-speed communication interfaces for industrial automation

Toshiba has launched a photocoupler featuring high speed data transmission (20Mbps) and a very thin package that offers protection against extreme operating temperatures. The TLP2768A is ideally suited for use in high-speed communication interfaces for industrial automation. Contained within
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Date:
11/03/2015
As modern power converters move towards higher efficiency, it is essential to have better models for all of the loss mechanisms in your components. In the first part of this article, we talked about the need for a single continuous equation to match the empirically measured losses. In this second part, the effect
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Date:
11/01/2015
Flexible sensors: an expanding market

Guillaume Chansin, IDTechEx

Large investments have been made to enable flexible, thin sensors rather than rigid sensors. $75 million was recently awarded by the US Department of Defense to establish a new Manufacturing Innovation Institute (MII) for flexible hybrid electronics in San Jose, California. Under the acronym FHE MII, this new
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Date:
11/01/2015

 



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