Consumer

July 2013
High current power inductors from Cooper Bussmann are now available from TTI
A new range of high current power inductors from Cooper Bussmann featuring low DCR specifications and a high maximum operating temperature can now be ordered from TTI, Inc., the world's leading specialist
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Date:
07/31/2013
UCLA researchers double efficiency of novel solar cell
Nearly doubling the efficiency of a breakthrough photovoltaic cell they created last year, UCLA researchers have developed a two-layer, see-through solar film that could be placed on windows, sunroofs,
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Date:
07/30/2013
Linear offers PMIC power management solutions for portable processors
Linear Technology recently released the LTC3676 and LTC3676-1, complete PMIC power management solutions for portable processors including Freescale's i.MX6 series, PXA, OMAP, ARM Cortex and other
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Date:
07/30/2013
STMicroelectronics, a semiconductor leader serving customers across the spectrum of electronics applications, has perfected advanced features in its latest PC USB chips that significantly reduce the
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Date:
07/29/2013
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its low loss, low skew, high-speed
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Date:
07/26/2013
ROHM double-layer capacitors feature industry-leading voltage and resistance
ROHM Semiconductor has recently announced the development of thin, high-output Electric Double Layer Capacitors (EDLCs) featuring the industry's highest voltage (3.0V). In addition, by reducing various
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Date:
07/26/2013
United Microelectronics and SuVolta announced joint technology development of a 28nm process that integrates SuVolta's Deeply Depleted Channel™ (DDC) transistor technology into UMC's 28nm High-K Metal
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Date:
07/25/2013
Governor Andrew M. Cuomo announced that the Eastman Business Park in Rochester will host a new $23 million Battery and Energy Storage Technology Testing and Commercialization Center. DNV KEMA Energy
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Date:
07/25/2013
SuVolta transistor technology validated in an ARM processor
SuVolta, a developer of scalable semiconductor technologies for low-power, high-performance IC chips, announced that it has realized significant processor speed gains with associated power reduction
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Date:
07/24/2013
Smart connector designed to meet needs of high-power storage batteries
Anderson Power Products® (APP®), a leader in high power interconnect solutions, announces an addition to their multipole connector selection with the release of the new SB® Smart connector, designed
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Date:
07/24/2013
Mouser Electronics has signed a global agreement with Intel®, creator of the microprocessor and owner of the most advanced process technologies in the industry. Mouser's comprehensive offerings and
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Date:
07/23/2013
SuVolta appoints Dr. Louis Parrillo as COO
SuVolta, a developer of scalable semiconductor technologies for low-power, high-performance ICs, announced the appointment of Dr. Louis Parrillo as the company's Chief Operating Officer (COO). As
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Date:
07/23/2013
Stackpole develops high humidity resistors
Stackpole's RNCS Series precision resistors have a nichrome element that is passivated to protect it from corrosion due to humidity and moisture. The result is a precision resistor that performs
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Date:
07/23/2013
Vishay expands Gen III P-channel offering with PowerPAK -40 V and -30 V MOSFETs
Vishay Intertechnology extended its offering of TrenchFET® Gen III p-channel power MOSFETs with -40 V and -30 V devices offered in the PowerPAK® 1212-8 and PowerPAK 1212-8S packages. Featuring industry-low
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Date:
07/22/2013
Power Integrations' wall-charger IC implements Qualcomm's rapid-charging protocol for mobile devices
Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, introduced the CHY100, presented as the first AC-DC wall-charger interface IC that enables designers
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Date:
07/18/2013
As the FPGA devices get larger and more complex, the need for advanced and easily accessible debug tools becomes paramount. The Microsemi IGLOO®2 and SmartFusion®2 implement advanced architectural
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Date:
07/17/2013
The European Telecommunications Standards Institute (ETSI) recently published a new draft of the standard for EMC in common mobile phone chargers (EN 301 489-34), outlining changes to the radio frequency
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Date:
07/17/2013
AVX Intros mini frameless tantalum poly capacitors for consumer apps
AVX, a leading manufacturer of passive components and interconnect solutions, has introduced a new series of miniature, Frameless®, tantalum polymer SMD capacitors. Utilizing proprietary FRAMELESS™
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Date:
07/17/2013
ams, a leading provider of high performance analog ICs and sensors, launched an 8A LED flash driver that provides a photo flash light output at least four times brighter than flash systems commonly
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Date:
07/17/2013
Altium Limited, a leader in smart-system design automation and provider of solutions for 3D PCB design (Altium Designer) and embedded software development (TASKING), has released a range of component
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Date:
07/16/2013
Phihong releases 5W USB adapter for personal electronics
Phihong, a leading supplier of OEM power solutions, has introduced a low-cost, 5W, fixed blade, USB power adapter for personal electronics. Designated the PSA05A, the new USB wall plug adapter is
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Date:
07/15/2013
SiTime's latest MEMS resonators claim to outperform quartz
Until recently, all MEMS oscillators used compensation circuitry to stabilize the output frequency over temperature. SiTime's TempFlat MEMS oscillators eliminate temperature compensation, resulting
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Date:
07/12/2013
IAR Systems launched a updated version of its embedded development toolchain IAR Embedded Workbench® for ARM®. Version 6.60 adds possibilities for running Power Debugging on all ARM cores, as well
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Date:
07/12/2013
Nujira, a leader in Envelope Tracking (ET) technology, and TowerJazz, a specialty foundry leader, announced their partnership agreement will include production of Nujira's latest NCT-L1300 Coolteq.L
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Date:
07/10/2013
Telit Wireless Solutions, a leading global provider of high-quality machine-to-machine (M2M) modules, services and solutions, today announced call for sponsors for its popular developer's conference,
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Date:
07/10/2013
MEMS Time-Keeper Extends Standby Life of Mobile Devices

Click image to enlarge

Figure 1: Block diagram showing high-level architecture of a smart phone

With un-tethered instant access to data, news and entertainment, consumers are spending more time on Smartphones and mobile devices. Device users are demanding faster connectivity, multi-core Ghz+
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Date:
07/08/2013
Filter capacitor considerations

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Figure 1. Theoretical (left) and Actual (right) models of a capacitor.

Due to the constant evolution of consumer electronics, efficient power conversion is critical for reliable performance, and the filtering of output ripple is a critical factor in supplying consistent
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Date:
07/08/2013
Technology trends in mobile charging

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Figure 1: Greenchip solution based on TEA1720B and TEA1705

Mobile battery capacity is increasing to cope with the extra energy demands of power-hungry features, larger displays and more powerful CPUs. With bigger batteries to charge, how can system designers
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Date:
07/08/2013
High-power controller drives LEDs, regulates solar cells, charges batteries, and other demanding consumer apps

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Figure 1. A single high power LED (20A) driver with analog and PWM dimming

The best LED drivers accurately regulate LED current for consistent color reproduction and modulate it rapidly for high contrast dimming. They also recognize and survive short and open circuits, monitor
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Date:
07/08/2013
New power architecture addresses PFC load efficiency issues

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Figure 1: Block Diagram of an Isolated AC/DC Compound Converter

As Power Factor Correction (PFC) migrates to lower power AC/DC converters, maintaining efficiency at low loads becomes an increasing challenge. The approach usually taken involves adding an extra
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Date:
07/08/2013
NXP Semiconductors introduced the AXP logic family, designed for high-performance low-voltage and low-power applications. The AXP family is fully specified at the 0.8-volt supply range, making it
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Date:
07/08/2013
IDT power management solution validated for Intel Atom-based apps
Integrated Device Technology delivering essential mixed-signal semiconductor solutions, announced that it has developed and validated an intelligent, scalable, and distributed power management solution
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Date:
07/08/2013
Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, announced it has completed the acquisition of Energy Micro AS. This strategic acquisition accelerates Silicon Labs'
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Date:
07/02/2013
Compact self-powered DC panel mount voltmeter suits battery monitoring
Murata recently released the compact DMR20-10-DCM "nanoMeter" self-powered auto-ranging DC voltmeter designed for mounting in an industry-standard "oiltight" 30 and 30.5 mm / 1.2 inch round panel
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Date:
07/02/2013
Imec solves metallization issues in advanced interconnects for the sub-1X technology node
Imec has developed a Manganese (Mn)-based self-formed barrier (SFB) process that significantly improves Resistance Capacitance (RC) performance, via resistance and reliability in advanced interconnects.
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Date:
07/02/2013
Gaia Converter to exhibit advanced power conversion products at DSEI 2013
Gaia Converter, a leading manufacturer of modular power components, will be exhibiting at this year's DSEI - the world's leading defence and security exhibition. Gaia will be displaying its extensive
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Date:
07/01/2013
TI's Li-Ion battery fuel gauge IC promises to boost battery run-time in portable medical and industrial devices
Texas Instruments introduced what they believe is the industry's smallest and most accurate Li-Ion battery fuel gauge integrated circuit, the bq27421, which boosts battery run-time in portable medical
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Date:
07/01/2013
C&K's microminiature side-actuated switch increases operating life
C&K Components, a leading international supplier of tactile, toggle, rocker and pushbutton switches, and smart card interconnect devices, has developed an SMT side-actuated switch series that increases
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Date:
07/01/2013
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