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Consumer Electronics

 



 

 

Consumer Electronics

July 2016
Open-source Bluetooth low-energy beacon is simple to program and debug via the Cloud

Puck.js Bluetooth low-energy beacon

Nordic Semiconductor announced the availability on Kickstarter of a Nordic nRF52832 SoC based Bluetooth low energy (formerly Bluetooth Smart) beacon, named Puck.js, that is said to be so simple to program almost anyone can do it wirelessly from a website using a graphical editor or easy-to-learn JavaScript instead
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Date:
07/28/2016
RUTRONIK now offers ARM-based starter kits from Advantech

ARM-based Starter Kits powered by NXP and TI processors

With its new ARM-based Starter Kits powered by NXP and TI processors, Advantech provides a shortcut for ARM platform evaluation and development, and are now available through Rutronik. The ARM-based starter kit includes key elements of a development environment including main boards with CPU cables, adapter
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Date:
07/28/2016
Driving infotainment systems
As the use of electronics in automobiles increases steadily in recent years, there is a higher demand to improve fuel efficiency. Wide-ranging development efforts, such as reducing car body weight, improving tire performance, and raising the efficiency of electronic circuits are being made by automobile manufacturers
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Date:
07/27/2016

The automotive segment is often misunderstood, quickly being solely associated with cars and related applications. It is however much bigger than that, including a broad range of applications such as buses, trucks, industrial vehicles, mobile machinery and mining equipment, forklifts, cleaning automated machines,
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Date:
07/27/2016
Molex has announced that six partners have joined the new Transcend Alliance, a consortium of companies working together to expand and promote the use of network connected lighting in commercial buildings by developing and implementing new systems and protocols. New integrated lighting network solutions,
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Date:
07/27/2016
myDevices, creators of Cayenne, the drag-and-drop IoT project builder, and Senet, a North American provider of public, low-power, wide-area networks (LPWANs) for long range-based (LoRa-based) Internet of Things (IoT) applications, announced their IoT technology partnership. The collaboration between the two
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Date:
07/27/2016
Offering a rationalized peripheral set, two new ultra-low-power STM32L4 product lines from ST Microelectronics provide a cost-optimized solution. With up to 256 Kbytes of Flash memory, our new STM32L43x MCUs comprise variants with versatile combinations of an integrated USB controller and LCD controller, while
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Date:
07/27/2016
Toshiba helps downsize LED modules with single-wire input illumination LED driver

The TB62D786FTG has a single-wire Manchester-encoded interface

Toshiba Electronics Europe has introduced a 9-channel output LED driver IC that will save board space and reduce the size of LED modules in a variety of lighting and illumination applications. The TB62D786FTG has a single-wire Manchester-encoded interface, which is often used for wireless communication.
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Date:
07/26/2016
Power Integrations, a leader in driver technology for high-voltage IGBTs and SiC MOSFETs, announced the appointment of Thomas Simonis as VP of high-power products with responsibility for product management, R&D and marketing. With over 25 years of service in the high-voltage motor-driver and semiconductor
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Date:
07/26/2016
Panasonic launches industry-thinnest aerogel thermal insulation solution

NASBIS is made of a material called aerogel

Panasonic Automotive & Industrial Systems Europe has recently unveiled a thermal insulation sheet which is the thinnest insulation solution currently available on the market. The NASBIS (Nano Silica Balloon Insulation Sheet) high-performance thermal insulation sheet comes with a thickness of 50μm, 100 μm,
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Date:
07/26/2016
ams, a leading provider of high-performance sensors and analog ICs, has closed the transaction to acquire 100% of the shares in the color and spectral sensing systems specialist MAZeT for an undisclosed amount in cash. The strategic acquisition extends ams’ market leadership in advanced optical sensors and
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Date:
07/26/2016
IDTechEx Research believes the conductive inks and pastes market is subject to major change with long-lasting consequences on the business models of many large incumbent suppliers. The decline and/or sluggish growth coupled together with intense competition in core markets has forced many suppliers to re-think
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Date:
07/25/2016
Wuerth unveils mix-and-match power coil selection tool

Mix and Match precise AC loss calculator for power inductors

Wuerth Elektronik eiSos makes a broad product spectrum of wireless power charging coils. Now the company provides developers with a tool to simplify selection of the right transmitter and receiver coils. Mix and Match, like the world's most precise AC loss calculator for power inductors, is another offering
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Date:
07/25/2016
GCT launches high-performance USB type-C connector family

GCT USB Type-C connector

Global Connector Technology (GCT), a leading global supplier of PCB connection solutions, has introduced a range of high-performance USB Type-C connectors that sets new market standards in design flexibility, transfer speed, power and usability. Designed for mobile and smart devices, the USB
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Date:
07/25/2016
AVX's latest locking plug contacts suit B2B apps

70-9159 Series single two-piece contacts

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has added a locking plug to its low-profile 70-9159 Series single two-piece contacts for high current, coplanar PCB mating applications, which deliver the industry’s smallest profile capable of supporting a full 5A. The
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Date:
07/25/2016
Verizon Communications and Yahoo! announced they have entered into a definitive agreement under which Verizon will acquire Yahoo’s operating business for approximately $4.83 billion in cash, subject to customary closing adjustments. Yahoo informs, connects and entertains a global audience of more
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Date:
07/25/2016
Fairchild’s active bridge solution enhances performance for PoE-based IoT devices

GreenBridge active bridge quad MOSFET FDMQ8205

Fairchild, a leading supplier of high-performance semiconductor solutions, enhanced its industry-leading GreenBridge active bridge quad MOSFET technology with FDMQ8205, the first member of its next-generation GreenBridge series for applications that receive power via Power Over Ethernet (POE), such as security
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Date:
07/25/2016
Power Integrations' TRIAC-dimmable LYTSwitch-7 LED driver ICs can cut the BOM by 40%

LYTSwitch-7 single-stage, non-isolated, TRIAC-dimmable, buck topology LED driver IC

Power Integrations, a leader in high-efficiency, high-reliability LED driver ICs, announced its LYTSwitch-7 single-stage, non-isolated, TRIAC-dimmable, buck topology LED driver IC family. Capable of delivering up to 22 watts without a heatsink in a very small SO-8 footprint, these high-efficiency devices are
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Date:
07/22/2016
KEMET unveils advanced high-stability ceramic dielectric capacitor tech

Advanced U2J Class-I ceramic dielectric capacitor

KEMET, a leading supplier of electronic components, introduced its advanced U2J Class-I ceramic dielectric capacitors. This U2J surface mount platform offers more than twice the capacitance available in C0G/NP0. It also provides superior temperature performance over X7R, X8R and X5R, rendering it an ideal capacitor
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Date:
07/22/2016
A mid-year checkup on 2016 GaN tech predictions

Xray-in-a-pill colonoscopies will gain European approval in 2016 and will eliminate the key barriers to early detection of Colon Cancer

Prognosticators do not often risk their reputations by giving their predictions a “checkup” midway through the period of their predictions. But, I am going to give it a shot and here we go… Wireless Power Will Become Mainstream Wireless power will continue to gain traction
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Date:
07/21/2016
Texas Instruments introduced the industry’s fastest 5.7-kVRMS isolated dual-channel gate driver, the first of a new gate driver family in TI’s isolation portfolio. The UCC21520’s flexible, universal compatibility enables its use as an isolated driver in low-side, high-side, high-side/low-side or half-bridge
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Date:
07/19/2016
Murata introduces thin laminate energy storage device

UMAL low-profile high capacity energy device

Murata announced the UMAL, a low-profile high capacity energy device. Designed to meet the demand for a slim high capacity energy source with a maintenance-free extended life cycle in wireless sensor nodes, the UMAL has charge/discharge and life-cycle characteristics superior to conventional secondary batteries. The
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Date:
07/19/2016
Renesas Electronics Europe and SEGGER announced their collaboration to facilitate expansion of the ecosystem of Renesas’ RX Family of 32-bit microcontrollers (MCUs) through adoption of SEGGER’s newly-released SystemView software. Forthwith SystemView will support streaming over J-Link, as well as real-time
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Date:
07/19/2016
ams' latest light sensors can shrink smart phone apertures up to 50%

TMD2725 combined proximity and ambient light sensor

ams, a leading provider of high performance sensors and analog ICs, introduced new proximity sensing and proximity/ambient light sensing modules which enable android smartphone manufacturers to reduce the sensor aperture in the display’s cover glass to its smallest diameter. Use of the TMD2620 proximity
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Date:
07/19/2016
Arrow signs agreement for Cypress Semi's IoT portfolio

WICED Cypress' IoT platform

Arrow Electronics will distribute Cypress Semiconductor’s newly acquired Internet of Things (IoT) portfolio, comprising state-of-the-art Wi-Fi, Bluetooth and ZigBee RF technologies capable of connecting nearly every emerging product category in the IoT ecosystem – including home appliances, health and fitness
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Date:
07/15/2016
Murata launches compact low-cost standalone LoRa module

LoRaWAN long range wireless module

Murata announced the launch of a compact low-cost low power wide area network (LPWAN) wireless module that supports the LoRaWAN long range wireless protocol. This standalone compact module measures just 12.5 x 11.6 x 1.76 mm, is constructed in a metal shielded package and comprises a Semtech SX1276 ultra long
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Date:
07/14/2016
Indium’s ITO and IGZO Reclaim and Recycle Program helps increase ROI

Indium's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials

Indium's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials. ITO and IGZO targets are widely used for coating glass and display surfaces. Since not all the material is consumed in the deposition process, Indium
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Date:
07/14/2016
Nordic Semi unveils product roadmap for low-power cellular IoT

Nordic Semiconductor announced the development of a low-power LTE technology for cellular IoT.

Nordic Semiconductor, a leading provider of ultra low power wireless connectivity, announced the development of a low power LTE technology for cellular Internet of Things (IoT). This development leverages Nordic Semiconductor's more than 10 years of leadership in ultra low power (ULP) wireless and its recruitment
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Date:
07/12/2016
Diodes' mini secondary-side MOSFET driver reduces BOM cost in 5V to 12V supplies

APR345 secondary-side MOSFET driver

The APR345 secondary-side MOSFET driver introduced by Diodes Incorporated delivers the smallest size, lowest BOM cost solution for synchronous rectification in 5V to 12V power supplies. This device is suitable for line-powered adapters and chargers for consumer products such as smartphones and tablets, PVRs
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Date:
07/12/2016
Allegro's DMOS microstepping driver offers translator, overcurrent protection

A5985 stepper motor driver IC

Allegro MicroSystems Europe announced a new integrated bipolar stepper motor driver IC with built-in translator for easy operation. Allegro’s A5985 is designed to operate bipolar stepper motors from full-step up to 1/32 step modes that are selectable by MSx logic inputs. This new device has an output drive
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Date:
07/12/2016
Nanya Technology and Rutronik Elektronische Bauelemente have concluded a Europe-wide franchise contract, that covers the entire Nanya product portfolio of SDRAM memory. Nanya develops, produces and distributes standard and mobile SDRAM memory. The Taiwanese manufacturer is specifically targeting the automotive
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Date:
07/12/2016
PSDcast - Wenjun Sheng of Telink Semi on IoT connectivity

Wenjun Sheng, CEO of Telink Semiconductor

In this PSDcast Wenjun Sheng, CEO of Telink Semiconductor, talks to Alix Paultre of Power Systems Design about the infrastructure of the IoT, especially in the devices themselves. Connectivity is a part of the description of the IoT, yet device wireless protocols and systems are still in flux. Telink Semiconductor
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Date:
07/11/2016
Analogy Devices’ D/A converter empowers next-gen television

AD9162 converter

Analog Devices, Inc. (ADI) today introduced a D/A converter that brings the future of television to today's home viewers, enabling them to enjoy ultra–high-definition (UHD) and 4K television across more channels at unprecedented streaming and download speeds. The new AD9162 D/A converter represents a breakthrough
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Date:
07/11/2016
KOA Speer expands molded current-sense resistor line

SLN5 current sense resistors

KOA Speer Electronics introduced the SLN5 Molded Current Sense Resistor, featuring a 7 Watt power rating in 4527 size. The SLN5 offers a terminal port temperature of 70°C. This is a molded resin resistor designed for current detection and provides excellent dimension accuracy, mountability, and shock resistance.
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Date:
07/11/2016
SEGGER’s debug tech now available for Zilog’s ZNEO32! family

SEGGER has introduced J-Link support for Zilog’s ZNEO32! Cortex-M3 based family of MCUs

SEGGER has introduced J-Link support for Zilog’s ZNEO32! Cortex-M3 based family of microcontrollers (MCUs). This includes support for debug, as well as Flash-based programming. Production line programming is also available via the SEGGER Flasher family. Projects using the ZNEO32! MCUs can
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Date:
07/07/2016
STMicro releases dev ecosystem, adds low-power STM32L4 Micros

the slim-form-factor NUCLEO-L432KC board

STMicroelectronics has introduced the development ecosystem for its latest low-power, high-performance STM32L4 microcontrollers (MCU) and expanded the series with five new product lines comprising a range of package and memory-density options. The expanded STM32L4 ecosystem builds on ST’s
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Date:
07/07/2016
AR Systems appoints new Japan Country Manager

Hiroshi Ishikawa

IAR Systems announces that the company has appointed Hiroshi Ishikawa as Country Manager for Japan. Kiyofumi Uemura, who has been acting as both APAC Director and Japan Country Manager, will focus on his role as APAC Director as well as a new role as globally responsible for IAR Systems automotive business. “Our
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Date:
07/06/2016
Infineon Technologies is taking an active role in the development of European-level cybersecurity guidelines, now that the European Commission signed the contract for a Public-Private-Partnership (PPP) with the European Cyber Security Organisation (ECSO) ASBL. Representing the private sector, ECSO will work
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Date:
07/06/2016
ERG Lighting introduces eLumination driverless AC LED light engines

eLumination driverless AC LED light engine

The eLumination Series from ERG Lighting is a family of driverless AC LED light engines for architectural, display and down lighting that have a flicker index of only 0.15 – less than half of the 0.34 offered by the competition. They are U.S. made and offered in 4” and 6” round versions for downlights
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Date:
07/06/2016

 



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