Medical, Healthcare & Wellness
Chris Dries, President and CEO at UnitedSiC
March 18, 2019, Princeton, New Jersey and Norwood, Massachusetts: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced a strategic investment and long-term supply agreement from Analog Devices, Inc.
It barely feels we are past the Christmas holidays and yet here we are looking forward to the start of the exhibition season. Even although it’s only March, my colleagues in the US are currently gearing up for the biggest show of the year in that region. APEC sets the tone for the whole year in the power industry
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Figure 1. Boost topology for generating a high voltage from a low voltage
If a high voltage needs to be generated from a low voltage, a boost converter can be used. This represents one of the three elementary switching regulator topologies and requires only two switches, an inductor, and input and output capacitors. Besides the boost converter, the other basic topologies are the buck
Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor
The promise of wide bandgap semiconductors (WBG) are higher switching frequency and higher operating temperatures perhaps smaller sizes, greater efficiencies and perhaps higher reliability, less size, less cooling – no fans for example, smaller heatsinks, smaller capacitors, less weight and overall better
FREMONT, CA – Phihong has announced its lineup of extended operating range battery chargers for power wheelchairs and mobility scooters. The complete line of products include: 2.5A, 3.5A and 8A chargers for different battery capacities.
The DA80U-240A-R and the DA64U-240A-R, rated 24V/3.5A and 24V/2.5A,
San Jose, Calif. and Tokyo, Japan — Maxim Integrated Products, Inc. announced that its MAX30101 heart-rate sensor is integrated into the new Raku Raku Smartphone F-01L from Fujitsu Connected Technologies Limited. The smartphone, which measures heart rate and sleep patterns, can be used for applications such
Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1 x 0.5 inches or 25.4 x 12.5mm, this innovative non-isolated unit offers two independent and
Microchip announces the new PolarFire FPGA imaging and video solution to address the challenges of developing complex computer algorithms which enable systems to capture and display information and high-resolution images. The PolarFire FPGA imaging and video solution
Power Integrations announced the SIC1182K SCALE-iDriver, a high-efficiency, single-channel SiC MOSFET gate driver that delivers the highest peak output gate current available without an external boost stage. Devices can be configured to support different gate-drive
RS Components has introduced an innovative frequency converter from Rexroth that delivers potential energy savings of up to 80% across industrial and automation applications. The EFC 5610 intelligent variable-frequency drive enables manufacturers and other industrial
SL Power today announced two new external power supply families to provide medical equipment with the highest level (Level VI) of efficiency and reliability. Rated at 150 watts and 240 watts respectively, the ME150 and ME240 families are compact desktop-style units
Dialog Semiconductor unveiled the SmartBond DA1469x family of Bluetooth low energy SoCs, its most advanced, feature-rich range of multi-core microcontroller units (MCUs) for wireless connectivity. The new product family which includes four variants, builds on the
e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application.
Supplied in a space-saving 28-pin QFN package,
These ICs operate over a very wide frequency range with 50 Ω-match from 24 GHz up to 44 GHz, facilitating ease of design and reducing the costs of building a single platform that can cover all 5G mm Wave frequency bands including 28 GHz and 39 GHz. Additionally,
Powerbox announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W
Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in
Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified.
These logic solutions are the smallest devices of their type suitable for
The new Han ES Press HMC (High Mating Cycles) connector series from HARTING combines the facility to be installed quickly without tools with extremely robust construction that allows the devices to handle at least 10,000 mating cycles.
PULS Power has undertaken not to discontinue standard products while enough demand is present to make them viable for manufacture.
This provides their customers with the reassurance that they will not be forced
MIGDAL HAEMEK, Israel, and SAN JOSE, California — TowerJazz and Axbio Inc. announced the release of a microfluidics Bio-CMOS device for molecular in vitro diagnostic (IVD), based on TowerJazz’s 65nm RFCMOS platform, following a successful development in its 300mm manufacturing facility in Uozu, Japan.
MALVERN, Pa. — Vishay Intertechnology, Inc. introduced a new series of high voltage thick film chip resistors that offer high power ratings up to 1.5 W and working voltages to 3000 V in five compact case sizes ranging from 1206 to 2512. For increased design flexibility, the Vishay Techno CRHP
Laird Thermal Systems has developed a large capacity Direct-to-Air Thermoelectric Assembly (TEA) that offers greater cooling capacity than traditional thermoelectric based systems. Designed for refrigeration of medical chambers and analytical storage compartments, the DA-280 TEA is an alternate
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Figure 1: Core material performance curves
What do new applications need in order to take advantage of new devices like wide band-gap semiconductors? They need the best inductors. And what is the best inductor for your application? Answering that requires proper characterization of the inductors, which is more than can be conveniently obtained