Power Passives & Discretes

May 2019
Mouser stocking Bourns GMOV Hybrid Components
GMOV components present a long-life, reliable protection solution that provides a higher level of performance and safety compared to standard metal oxide varistors (MOVs). The Bourns GMOV series are ideal in AC applications where conditions are less than predictable
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Date:
05/30/2019
CIPOS Tiny complements Infineon’s families of IPMs
The 3-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drives. By using the latest TRENCHSTOP IGBT6, it is possible to realize maximum efficiency with minimum footprint. Applications profiting from
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Date:
05/30/2019
Microchip Carbide (SiC) products for reliable power electronics
Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products. These products meet the need to improve system efficiency, robustness and power density in Electric Vehicles
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Date:
05/30/2019

3 Phase input, 5kW AC-DC power supply is software configurable
The range features both ITE/industrial and medical agency approvals that feature a three-phase, three-wire, 180 to 528VAC input. This drastically simplifies installation as there is no need for a neutral connection, which is often not available in industrial applications.
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Date:
05/30/2019
SiC-Based Hybrid IGBT and Isolated High Current IGBT Gate Driver
The AFGHL50T65SQDC uses the latest field stop IGBT and SiC Schottky diode technology to offer low conduction and switching losses in multiple power applications, including those that will benefit from reduced reverse recovery losses, such as totem pole based bridgeless
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Date:
05/30/2019
Ultra-wide input EN 50155 DC/DC converters
The DC/DC converters serve a wide range of rolling-stock applications, as well as high-voltage battery-powered systems with their ultra-wide 14V-160V DC input-voltage range. The single-output 40W and 60W quarter-brick
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Date:
05/30/2019
HybridPACK power modules enable fast vehicle electrification
The four new HybridPACK Drive modules are optimized for different inverter performance levels between 100 kW and 200 kW. Furthermore, Infineon’s HybridPACK Double Sided Cooling (DSC) S2 is a technology upgrade to the existing HybridPACK DSC. This module targets
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Date:
05/30/2019
Versatile Boost Controller for LED/LCD Applications
The device supplies a constant voltage or constant current to drive displays and backlights with a dimming ratio of 100:1. It is well suited for use as a backlight driver for LCD TVs, LCD monitors, and flat
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Date:
05/30/2019
WiBotic and GaN Systems Bring â€True Autonomy’ to Mobility
The partnership advances capabilities of mobile industrial robots, freeing them from limitations imposed by current restricted charging methods that allow for continuous operation. For mobile robots to work efficiently, flexibly, and without interruption - they need
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Date:
05/30/2019
Exagan Opens Power Solutions Center in Europe
The opening of the best-in-class facility, which is operating in close collaboration with technology partner CEA Tech, follows the launch of Exagan’s first GaN applications center in Taiwan last October. The
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Date:
05/30/2019
LEM introduces AI-PMUL digital integrator for Rogowski coils
AI-PMUL is a versatile digital signal conditioner of Rogowski coils secondary signal which offers a wide range of standard analogue True RMS and instantaneous outputs. The Rogowski coils output voltage is proportional
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Date:
05/30/2019
200A current sense transducer costs 40% less than competition
This enables users to access Danisense’s unique, double-core, balanced flux gate measurement technology, at a very affordable price/performance ratio. The DC200IF boasts excellent linearity (6 ppm) with a
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Date:
05/30/2019
This series is optimized for industrial applications including street lamps, commercial AC systems, and general-purpose AC servos and inverters used in high power equipment. SiC power semiconductors deliver
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Date:
05/30/2019
A Safer Supply Chain with Vincotech’s Multi-sourced Offering
This supplier of module-based solutions for power electronics pointed out that its multiple sourcing strategy goes to protect customers’ business interests by mitigating risks in the supply chain. Vincotech
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Date:
05/30/2019
Extended range of reliable and efficient DC-DC converters
The modules are provided in sealed and encapsulated packaging, to ensure they will work reliably when subjected to dust, moisture, severe vibration and other harsh conditions. The PKE3000 and PKE5000 series
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Date:
05/30/2019
Rugged 2KW RF power LDMOS transistor for ISM applications
The process has been developed to enable the implementation of extremely rugged transistors with operating voltages of up to 65V. The first product to use the process, the ART2K0FE, is a 2KW transistor with
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Date:
05/30/2019
10 Watt DC-DC Converter Range in Compact Package
The new series comprises 14 variants. Targeting a diverse range of applications, including instrumentation, data communication, telecommunication and computer peripheral equipment, industrial automation and
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Date:
05/30/2019
Ultra-thin Open Frame Non-isolated DC-DC Converter
The dimension of K78-JT-500R3 series is 12.50 x 13.50 x 3.50mm, which is 4.75mm lower in height than that of K78-T-500R3 series. Besides, the K78-JT-500R3 series features SMD package, and provides an ultra-wide input voltage range of 4.75 - 36V. This series also
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Date:
05/30/2019
Compact Size SMD Package CAN/RS485/RS232 Transceiver Modules
The transceivers assist fast signal response in industries of power grid, industrial control, and transportation(rail, automotive), etc. The series adopt the SMT process, which enables customers to easily achieve
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Date:
05/30/2019
Current transducers with measuring range up to 450 Apk
The family consists of three new models: LZSR 100-P, LZSR 150-P and LZSR 200-P.   These new transducers
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Date:
05/22/2019
8 x 8mm LFPAK MOSFET family delivers up to 48x power density
LFPAK88 devices replace larger power packages such as D²PAK and D²PAK-7, and measuring 8 x 8mm offer a footprint reduction of 60 %, and a 64 % lower profile.  
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Date:
05/22/2019
UnitedSiC adds 7 SiC FETs to 650V product portfolio
These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power supplies, telecom rectifiers, and on-board chargers respectively.
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Date:
05/22/2019
New CoolSiC Schottky diode 1200 V G5 portfolio from Infineon
It can easily replace silicon diodes for higher efficiency. The expanded 8.7 mm creepage and clearance distances offer extra safety in high-pollution environments. Forward currents up to 40 A are available to address EV DC charging, solar energy systems,
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Date:
05/22/2019
Samtec’s mPOWER Ultra Micro Power Connectors Now at Mouser
Offering current ratings up to 21 A per blade in a 2 mm pitch, mPOWER connectors provide an ultra-small, high-power solution with exceptional design flexibility for power-only or power-and-signal applications.
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Date:
05/22/2019
Low profile 180W U-channel PSU for space-critical applications
The low-profile devices are just 1.16” high and occupy a small 4.3” x 2.5” footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection)
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Date:
05/22/2019
LTM2810 ÂμModule Isolators, Now Shipping from Mouser
Date:
05/22/2019
High Temperature Micro-D Series connectors available at TTI
Optimised to save space and weight in demanding applications, such as space vehicles, defence systems and oil exploration equipment, Micro Series Connectors are rugged and moisture-sealed. These data, power and signal interconnects combine versatility
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Date:
05/22/2019
High Power Factor LED Driver-Controller with Mixed-Mode Dimming
  The AL1665 is designed to drive an external MOSFET to control LED loads and maintain a high power factor. It provides a compact and efficient solution that helps minimize
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Date:
05/22/2019
Open Frame Power Supplies with UL8750 Safety Approval
    The LU225 family meets EN55015 (EN55032) Class B Conducted EMI, IEC61000-3-2 Class C (LED
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Date:
05/22/2019
Are you SiC of Silicon? - Part 2

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Anup Bhalla, Vice President Engineering, UnitedSiC

State of SiC Device and Package Technology It has long been known that packaging technology is key to unleashing the potential of wide-bandgap (WBG) devices. Silicon Carbide device manufacturers have been making rapid improvements in device technology figures of merit such
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Date:
05/01/2019