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Wearables and Nanopower

 



 

 

Wearables and Nanopower

Current
Renesas Electronics Unveils Industry-Leading Fully Encapsulated Dual 30A and Single 33A Digital Power Modules
Renesas Electronics announced two new fully encapsulated digital DC/DC PMBus power modules that deliver the highest power density and efficiency in their class. The dual ISL8274M operates from a 5V or 12V power rail, provides two 30A outputs and up to 95.5% peak
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Date:
02/07/2018
Toshiba Electronics Europe has today announced a new USB-based Bluetooth development platform based around their innovative and advanced TC35678 BT 4.2 single-chip Bluetooth Low Energy (LE) controller. The BMSKUSBBT1760A(P) USB board reduces development time and
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Date:
02/07/2018
Now at Mouser: TDK’s Ultra-Thin PiezoHapt Actuator Provides Fast Haptic Feedback for Wearables and More
Mouser Electronics is now stocking the PiezoHapt ultra-thin actuator from TDK. Expanding TDK’s portfolio of haptic devices, including the PowerHap actuator, the PiezoHapt is one of the world's thinnest haptic components on the market today. With a thickness of
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Date:
02/07/2018

MILPITAS, Calif. — Worldwide silicon wafer area shipments in 2017 increased by 10 percent against 2016 shipments, while worldwide silicon revenues rose by 21 percent over 2016 levels, reported the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry. Silicon
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Date:
02/06/2018

 



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