Rogers Combines Educational Presentation with High-Performance Circuit Materials at DESIGNCON 2012

Rogers Corporation will exhibit and present a white paper concerning Thermal Conductivity at the upcoming DesignCon 2012 conference and exhibition. DesignCon (www.designcon.com), scheduled for January 31 through February 1, 2012 at the Santa Clara Convention Center (Santa Clara, CA), is one of the electronic industry's key meeting places for printed-circuit-board (PCB) designers. Rogers' circuit-materials expert Mr. Al Horn, Associate Research Fellow, is scheduled to speak at 11:05 AM on January 31, 2012, with his presentation, "Measurement and Modeling of the Effect of Laminate Thermal Conductivity and Dielectric Loss on the Temperature Rise of HF Transmission Lines and Active Devices." The session should be of particular interest to designers concerned with dissipating heat in large-signal circuits. Representatives from Rogers Advanced Circuit Materials Division will be on hand at Expo booth #810 to offer guidance on the use of the Company's high-performance PCB materials, including Theta® and RO4000® LoPro™ materials. Rogers' halogen-free Theta materials are engineered for outstanding mechanical and electrical performance in high-speed digital circuits. With a coefficient of thermal expansion (CTE) of 50 ppm/°C in the z-axis, they have about 30% less expansion, across the same temperature range, than standard FR-4 for improved reliability of plated through holes (PTHs) in multilayer circuits. The low dissipation factor of 0.0118 at 1 GHz ensures that Theta materials preserve signal integrity in the most challenging digital circuit designs. Theta materials feature a dielectric constant of 3.90 at 1 GHz. In addition, these dependable laminates support RoHS-compliant manufacturing processes and meet UL-94-V-0 level flammability requirements. RO4000 LoPro circuit materials are a low-profile copper foil option available on the RO4000 series that helps designers significantly drive down insertion loss and improve signal integrity for ATE, wireless, and networking applications. This low cost enhancement to the RO4000 series of dielectric materials is fully compatible with FR-4 fabrication processes and lead-free assembly temperatures. These laminates achieve low PIM values, which are critical for antenna designs and feature a low z-axis coefficient of thermal expansion (CTE) over a wide temperature range for reliable plated-thru-hole performance in multilayer circuits. Visitors to the Rogers' booth can also learn more about how their company can win a ROG Award by telling their story about an application using Rogers' materials. More details on the ROG Contest are also available on Rogers' Twitter page (twitter.com/rogers_acm). About Rogers Corporation Rogers Corporation (NYSE:ROG) is a global technology leader in specialty materials and components that enable high performance and reliability of consumer electronics, power electronics, mass transit, clean technology, and telecommunications infrastructure. With more than 179 years of materials science and process engineering knowledge, Rogers provides product designers with solutions to their most demanding challenges. Rogers' products include advanced circuit materials for wireless infrastructure, power amplifiers, radar systems, high speed digital; power electronics for high-voltage rail traction, hybrid-electric vehicles, wind and solar power conversion; and high performance foams for sealing and energy management in smart phones, aircraft and rail interiors, automobiles and apparel; and other advanced materials for diverse markets including defense and consumer products. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, Belgium, China, Germany, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com