­Analog Devices Expands Partnership with TSMC

Date
02/26/2024

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Special arrangement through JASM secures ADI’s long-term chip supply and focuses on 40nm and finer process technology nodes

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Special arrangement through JASM secures ADI’s long-term chip supply and focuses on 40nm and finer process technology nodes

 

Analog Devices has made a special arrangement with TSMC to supply long-term wafer capacity through Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”).

 

JASM is TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.

 

Building on ADI’s more than 30-year partnership with TSMC, this adds another option for ADI to secure additional capacity of fine-pitch technology nodes to serve critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL™) applications. The joint efforts reinforce ADI’s resilient hybrid manufacturing network, which helps to insulate external factors while supporting the means to increase output and scale rapidly to meet customer needs.

 

“Our hybrid manufacturing network helps deliver a competitive edge to our customers. Together with TSMC, we can serve our customers with more resilient supplies, respond even more rapidly to customer needs and changing market conditions, and focus our investments on innovative manufacturing solutions that benefit society and the planet,” said Vivek Jain, Executive Vice President of Global Operations & Technology at ADI. 

 

“Today’s announcement demonstrates TSMC’s commitment to helping our customers meet their long-term capacity needs,” said Sajiv Dalal, Executive Vice President of Business Development at TSMC North America. “We’re delighted to expand our ongoing collaboration with ADI that will help to ensure a steadfast and dynamic journey of semiconductor innovation with robust manufacturing capabilities.”

 

https://www.analog.com/en/who-we-are/resilient-hybrid-manufacturing.html

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