Industrial

Current
Good Vibrations: New Tech may Lead to Smaller, More Powerful Wireless Devices

Matt Eichenfield's team at Sandia National Laboratories uses multiple microwave frequencies to characterize a nonlinear phononic mixing device they built on a silicon wafer.

­What if your earbuds could do everything your smartphone can do already, except better? What sounds a bit like science fiction may actually not be so far off. A new class of synthetic materials could herald the next revolution of wireless technologies, enabling devices to be smaller, require less signal strength an
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Date:
05/10/2024
Littelfuse Unveils IX4352NE Low-side Gate Driver for SiC MOSFETs and High-power IGBTs

IX4352NE Low-side Gate Driver

­Littelfuse, Inc. is excited to announce the launch of the IX4352NE Low-side SiC MOSFET and IGBT Gate Driver. This innovative driver is specifically designed to drive Silicon Carbide (SiC) MOSFETs and high-power Insulated Gate Bipolar Transistors (IGBTs) in industrial applications. The key differentiator of the IX
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Date:
05/08/2024
Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz

Alliance Memory 16Gb and 32Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds of 2.133GHz

­Alliance Memory announced that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with new 16Gb and 32Gb LPDDR4X devices that combine low power ratings with increased clock speeds and data rates in the 200-ball FBGA package. With low-voltage operation of 0.6V, the 16Gb AS4C512M32MD4V-046BIN and 32Gb
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Date:
05/02/2024
New Models Added to CUI Devices' Line of BGA Heat Sinks

New Models Added to CUI Devices' Line of BGA Heat Sinks

­CUI Devices’ Thermal Management Group today announced the expansion of its line of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family now offers aluminum or copper material options, clean or black anodized material finishes, and adhesive or PCB mounting styles. All BG
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Date:
05/01/2024
Galvanic Isolation Keeps Pace with Control Requirements

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Figure 1: Isolation locations in a PLC

­There are two distinct trends in the design of the electronic systems that support motors. On one side are power generation and electrical distribution subsystems that operate at voltages that are moving toward the kilovolt regime. On the other are high-speed MCUs that enable advanced algorithms to optimise sy
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Date:
05/01/2024
How the IIoT is Changing the Face of Manufacturing

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Figure 1: Nordic’s nRF9160 SiP is the lowest power complete cellular IoT solution on the market – extending battery life

­Digital computers first disrupted factory automation in the late 1960s. The machines ushered an era of computer aided design (CAD), consistent manufacture of complex components, greater automation using programmable logic controllers (PLCs), and higher productivity. The period was considered the third generation of
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Date:
05/01/2024
The Elegance of a Flyback Controller Without a Dedicated Isolated Feedback Path

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Figure 1: Conventional flyback controller with feedback path based on an optocoupler

­Figure 1 shows the architecture of a conventional isolated flyback converter. These converters can be found frequently in power classes of up to about 60 W. A supply voltage is converted to an output voltage with the help of a primary-side switch and a transformer with adjusted turns ratio. Information about th
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Date:
05/01/2024
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