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    300W DC/DC Converter with Matching Aluminum Enclosure

    With the PSZ-1111 aluminium housing set, the 300 W DC/DC converter DC300WS becomes a ready-to-install complete solution for fanless power supply in industrial and mobile applications – available from stock.

    300W DC/DC Converter with Matching Aluminum Enclosure
    ­Bicker Elektronik GmbH, based in Donauwoerth, Germany, is now offering the PSZ-1111 enclosure kit for its high-performance DC300WS DC/DC converter. Consisting of a U-profile and cover, the robust aluminium enclosure turns the compact open-frame converter into an enclosed, ready-to-install assembly that can be
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    Date:
    10/28/2026
    SemiQ Gen4 1200 V and 750 V SiC MOSFETs Cut On-Resistance By 21% and Switching Energy By 11%

    SemiQ Gen4 1200 V and 750 V SiC MOSFETs Cut On-Resistance By 21% and Switching Energy By 11%

    SemiQ Gen4 1200 V and 750 V SiC MOSFETs Cut On-Resistance By 21% and Switching Energy By 11%
    ­SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has announced its the availability of its fourth-generation QSiC™ silicon carbide power devices, launching a family of 1200 V and 750 V SiC ba
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    Date:
    10/27/2026
    EPC Expands 100 V GaN Motor Drive Portfolio with Two New Three-Phase Inverter Evaluation Platforms

    EPC Expands 100 V GaN Motor Drive Portfolio with Two New Three-Phase Inverter Evaluation Platforms

    EPC Expands 100 V GaN Motor Drive Portfolio with Two New Three-Phase Inverter Evaluation Platforms
    ­Efficient Power Conversion (EPC), the world’s leader in enhancement-mode gallium nitride (GaN)–based power solutions, today announced the availability of the EPC91124 and EPC91125, two new 100 V three-phase BLDC motor drive evaluation boards designed to simplify the development of next-generation high-performance mo
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    Date:
    10/27/2026
    Power Integrations Unveils 4th Generation of Pioneering CAPZero X-Capacitor Discharge IC Family

    Power Integrations Unveils 4th Generation of Pioneering CAPZero X-Capacitor Discharge IC Family

    Power Integrations Unveils 4th Generation of Pioneering CAPZero X-Capacitor Discharge IC Family
    ­Power Integrations™, the leader in high-voltage integrated circuits for energy-efficient power conversion, today expanded its industry-leading CAPZero™ family of X-capacitor discharge ICs with the introduction of the CAPZero™-4 device for industrial and consumer applications. Power Integrations pioneered th
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    Date:
    10/26/2026
    EPC GaN FETs Enable 4 kW High-Efficiency Buck-Boost Converter Reference Design

    EPC GaN FETs Enable 4 kW High-Efficiency Buck-Boost Converter Reference Design

    EPC GaN FETs Enable 4 kW High-Efficiency Buck-Boost Converter Reference Design
    ­Efficient Power Conversion (EPC), the world leader in enhancement-mode gallium nitride (eGaN®) power devices, today announced the use of its EPC2361 100 V eGaN FETs in a high-performance buck-boost converter reference design from Analog Devices, Inc. (ADI). The design demonstrates how GaN technology can enable ef
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    Date:
    10/22/2026
    Modular I&O Solution for Immersion Cooling Applications from Amphenol now Available Through Powell Electronics Europe

    Modular I&O Solution for Immersion Cooling Applications from Amphenol now Available Through Powell Electronics Europe

    Modular I&O Solution for Immersion Cooling Applications from Amphenol now Available Through Powell Electronics Europe
    ­Powell Electronics Europe, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, stocks Amphenol LTW’s modular I&O solution, a highly reliable and robust interconnect platform designed for immersion cooling systems. It combines high-speed data transmission, IP
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    Date:
    10/22/2026
    Renesas Launches RX74M and RX74N Flagship 32-bit MCUs, First RX Family Built on 22nm Process and Featuring MRAM

    Renesas Launches RX74M and RX74N Flagship 32-bit MCUs, First RX Family Built on 22nm Process and Featuring MRAM

    Renesas Launches RX74M and RX74N Flagship 32-bit MCUs, First RX Family Built on 22nm Process and Featuring MRAM
    ­Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today launched the RX74M and RX74N, new flagship 32-bit microcontrollers (MCUs) that deliver up to 600 MHz performance and are the first in the RX Family to be built on a 22nm process and incorporate embedded MRAM. Bo
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    Date:
    10/22/2026
    Toshiba Introduces Compact eFuse ICs for 1.8V Power-Line Protection

    Toshiba Introduces Compact eFuse ICs for 1.8V Power-Line Protection

    Toshiba Introduces Compact eFuse ICs for 1.8V Power-Line Protection
    ­Toshiba Electronics Europe GmbH (“Toshiba”) announces the TCKE5 Series of electronic fuse ICs (eFuses), extending its power-line protection range to support 1.8V supplies in space-constrained electronic equipment. Applications include SD memory cards, USB and HDMI® devices, laptop PCs and gaming consoles. Th
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    Date:
    10/22/2026
    TDK Introduces Compact Y1 Safety Capacitors for Operations up to 500 V (AC) and +125 °C

    TDK Introduces Compact Y1 Safety Capacitors for Operations up to 500 V (AC) and +125 °C

    TDK Introduces Compact Y1 Safety Capacitors for Operations up to 500 V (AC) and +125 °C
    ­TDK Corporation has introduced the compact B3201*A5/B5/C5 series of Y1 safety capacitors designed to suppress EMI in demanding automotive and industrial applications. The metallized polypropylene (MKP) film capacitors are rated for AC voltages of 500 V and DC voltages of up to 1500 V. Featuring a maximum oper
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    Date:
    10/21/2026
    Designing Laser Systems for Safe Operation

    Designing Laser Systems for Safe Operation

    Designing Laser Systems for Safe Operation
    Mark Boyle, Director, Product Engineering and Applications, Asif Hyder, Director, Systems Operations, and Gregory Nelson, Systems Proposal Manager, AMADA WELD TECH

    ­“Safety is job one” is a familiar phrase in manufacturing, meant to reinforce the importance of cautious, responsible operation. Without proper safeguards and training, industrial machinery can present serious hazards, leading to injury and, in rare cases, even death. Defining what constitutes safe oper
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    Date:
    10/19/2026
    PSDcast – Is it Time for

    Aaron Strout, the author of WIRED FOR PURPOSE: Why Humanity is the Biggest Differentiator in a Digital World

    PSDcast – Is it Time for "Human Reserved" Jobs?
    ­We’re currently experiencing the mass build-out of AI infrastructure, and to say call the adoption rate rapid is…the understatement of the century – literally so, since AI is apparently the fastest spreading technology in human history (and definitely in the 21st century). All of which led Bill Gate
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    Date:
    10/15/2026
    Tark Thermal Solutions Launches PCX-DG Series Thermoelectric Coolers With Dual Compliant Bonding for Maximum Test System Reliability

    Tark Thermal Solutions Launches PCX-DG Series Thermoelectric Coolers With Dual Compliant Bonding for Maximum Test System Reliability

    Tark Thermal Solutions Launches PCX-DG Series Thermoelectric Coolers With Dual Compliant Bonding for Maximum Test System Reliability
    ­Tark Thermal Solutions, the global leader in thermal management solutions, today announced the PowerCycling PCX-DG Series, a new family of thermoelectric coolers engineered for higher current draw and high heat flux density applications like end-of-line (EOL) optical transceiver test heads, semiconductor test so
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    Date:
    10/13/2026
    TDK Introduces new Dual-Die, Stray-Field Robust Motor Position Sensor for ASIL D Fail Operational Applications

    TDK introduces new dual-die, stray-field robust motor position sensor for ASIL D fail operational applications

    TDK Introduces new Dual-Die, Stray-Field Robust Motor Position Sensor for ASIL D Fail Operational Applications
    ­TDK Corporation (TSE:6762) introduces the Micronas HAR 3025, a dual-die stray-field robust motor position sensor with analog sine/cosine output, designed for automotive and industrial safety-critical applications. The HAR 3025 extends TDK’s fast angular position sensor family with a fully redundant architecture hou
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    Date:
    10/13/2026
    VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution

    HISS horizontal inline sputtering system

    VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution
    ­VON ARDENNE , a global leader in high-precision vacuum coating equipment and co-developed materials solutions, today announced that it is expanding its semiconductor deposition portfolio into panel-level packaging (PLP). The HiPIMS solution deposits high-aspect-ratio barrier and seed layers in through-glass via (TGV)
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    Date:
    10/13/2026
    Toshiba Launches 3300V SiC MOSFET Module for Industrial Equipment

    Toshiba Launches 3300V SiC MOSFET Module for Industrial Equipment

    Toshiba Launches 3300V SiC MOSFET Module for Industrial Equipment
    ­Toshiba Electronics Europe GmbH (“Toshiba”) today announced the expansion of its line-up with the launch of IX800FXF2YMS4, a dual SiC MOSFET module. The new module offers high surge-current capability to support reliable operation in industrial equipment, including inverters and converters for railway ve
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    Date:
    10/09/2026
    Connect Legacy Serial Equipment to Modern Networks with Antaira's STE-6104C-T-V2 Industrial Gateway

    Connect Legacy Serial Equipment to Modern Networks with Antaira's STE-6104C-T-V2 Industrial Gateway

    Connect Legacy Serial Equipment to Modern Networks with Antaira's STE-6104C-T-V2 Industrial Gateway
    ­For operators looking to modernize without replacing proven equipment, Antaira Technologies highlights the STE-6104C-T-V2, a 4-port industrial gateway that connects virtually any RS-232, RS-422 or RS-485 serial device to a new or existing Ethernet (TCP/IP) network. With redundant Ethernet, wide-temperature ope
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    Date:
    10/09/2026
    Cleanova Expands Semiconductor and Ultra-Clean Controlled Environment Filtration Capabilities with Strategic Acquisition of SV Techsol

    Chris Cummins, President and Chief Executive Officer of Cleanova

    Cleanova Expands Semiconductor and Ultra-Clean Controlled Environment Filtration Capabilities with Strategic Acquisition of SV Techsol
    ­Cleanova, a leading global manufacturer of advanced filtration solutions, today announced the strategic acquisition of California-based SV Techsol, expanding its engineering and environmental control capabilities for semiconductor manufacturing and other ultra-clean applications. Founded in the heart of
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    Date:
    10/09/2026
    RS and RS PRO Drive Network and Thermal Reliability in Smart Factories

    RS and RS PRO Drive Network and Thermal Reliability in Smart Factories

    RS and RS PRO Drive Network and Thermal Reliability in Smart Factories
    ­RS, a high-service global product and service solutions provider for industrial customers, streamlines smart factory operations with its RS PRO Total Panel Integration portfolio. This unified product ecosystem simplifies panel design, protects sensitive electronics, and lowers total cost of ownership for organizations ac
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    Date:
    10/07/2026
    Infineon and ZuriQ Deepen Partnership to Advance Scalable Quantum Chips

    Infineon and ZuriQ deepen partnership to advance scalable quantum chips © Infineon

    Infineon and ZuriQ Deepen Partnership to Advance Scalable Quantum Chips
    ­Infineon Technologies AG and ZuriQ AG, a Swiss quantum computing company spun out of ETH Zurich, today announced the expansion of their collaboration to advance scalable quantum computing hardware. The partnership combines ZuriQ’s pioneering trapped-ion quantum computing architecture with Infineon’s expertise in
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    Date:
    10/07/2026
    MEMSensing Launches Bone-Vibration Sensor in Europe

    MEMSensing Launches Bone-Vibration Sensor in Europe

    MEMSensing Launches Bone-Vibration Sensor in Europe
    ­MEMSensing announces the European launch of its microelectromechanical systems (MEMS) bone-vibration sensor developed to improve uplink voice capture in true wireless stereo (TWS) earbuds. Used alongside a conventional microphone, the sensor provides a separate reference for the wearer’s voice that is less af
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    Date:
    10/06/2026
    Mouser Now Shipping New NXP Semiconductors Ara240 Discrete Neural Processing Unit for AI, Edge, Industrial, and Robotics Applications

    Mouser Now Shipping New NXP Semiconductors Ara240 Discrete Neural Processing Unit for AI, Edge, Industrial, and Robotics Applications

    Mouser Now Shipping New NXP Semiconductors Ara240 Discrete Neural Processing Unit for AI, Edge, Industrial, and Robotics Applications
    ­Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now stocking the new Ara240 discrete neural processing unit (DNPU) from NXP® Semiconductors. The Ara240 DNPU enables real-time generative AI, industrial automation systems, au
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    Date:
    10/05/2026
    Pfannenberg USA Upgrades Green Series Cooling Units for Safe, Reliable and Compliant Enclosure Cooling

    Pfannenberg USA Upgrades Green Series Cooling Units for Safe, Reliable and Compliant Enclosure Cooling

    Pfannenberg USA Upgrades Green Series Cooling Units for Safe, Reliable and Compliant Enclosure Cooling
    ­Pfannenberg, Inc., a global leader in thermal management and signaling technologies, announces updates to its Green Series enclosure cooling unit portfolio. Designed around real-world application requirements, the updated Green Series helps industrial customers address evolving F-Gas regulations while maintaining th
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    Date:
    10/05/2026
    Modern Instrumentation for Small Vehicles

    Click image to enlarge

    Figure 1: A possible implementation case with the TRAVEO T2G Graphics shows the “speedometer” on the left-hand side with speed and virtual signal or control symbols, as well as the navigation displayed by a smartphone. On the right is the smartphone with a wireless connection

    Modern Instrumentation for Small Vehicles
    Ralf Hickl, Product Sales Manager ABU at Rutronik

    ­Digital display and control concepts are increasingly finding their way into vehicle classes that were traditionally equipped with mechanical or basic LCD instrument. Today, the requirements and capabilities of these applications extend far beyond simple speed or fuel indicators: Users expect clear, easy-to-read vi
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    Date:
    10/01/2026
    Save Space, Improve Efficiency with 4-Switch Buck-Boost Controllers

    Click image to enlarge

    Figure 1: Ground-referenced current sensing in 4-switch buck-boost converters

    Save Space, Improve Efficiency with 4-Switch Buck-Boost Controllers
    Xu Zhang, Power Design Manager, Analog Devices

    The 4-switch buck-boost converter is popular and well-known for generating a regulated output voltage above, below, or equal to the input voltage. It also disconnects the input/output (I/O) during extreme fault conditions, such as the input short circuit or the output short circuit conditions. Together with over
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    Date:
    10/01/2026
    Putting on the Heat

    Ally Winning, European Editor, PSD

    Putting on the Heat
    Ally Winning, European Editor, PSD

    ­One of my favourite things about this job is hearing how the products that I write about are used in the real world. Normally these are in popular applications, such as datacentres and EV powertrains, but occasionally one pops up that is totally unique. Recently, I talked to Vicor, and its customer, BetterFrost, ab
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    Date:
    10/01/2026
    Archive

    TDK Presents DC-link Capacitors Rated for up to +135°C in Automotive and Industrial Applications

    Sep 30,2026

    Anderson Power Completes IBC Lineup with IBC 80 Release

    Aug 28,2026

    Infineon SEMPER NOR Flash Memory Strengthens Data‑Center Server Management

    Jul 30,2026

    SandboxAQ to Bring Large Quantitative Models to Google Cloud's Marketplace

    Jun 29,2026

     

     

     

     

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    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.

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