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UL Solutions Breaks Ground at North America Advanced Battery Laboratory in Auburn Hills, Michigan

UL Solutions Breaks Ground at North America Advanced Battery Laboratory in Auburn Hills, Michigan

­UL Solutions officially began construction of its North America Advanced Battery Laboratory in Auburn Hills, Michigan. Located near the center of the United States (U.S.) automotive industry, the facility will help enable electric vehicle (EV) and industrial battery original equipment manufacturers (OEMs) an
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Date:
06/06/2023

Laird Thermal Systems Unveils Micro Multistage Thermoelectric Cooler and Optical TEAs Integration Capability

Laird Thermal Systems Unveils Micro Multistage Thermoelectric Cooler and Optical TEAs Integration Capability

­Laird Thermal Systems has developed the new OptoTEC MSX Series of micro multistage thermoelectric coolers and the capability to integrate them into various optical packages, including widely used TO-39, TO-46, or TO-8, creating advanced Optical Thermoelectric Assemblies (TEAs). The MSX Series utilizes advanced ce
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Date:
06/06/2023
ROHM Introduces Class-Leading Low ON Resistance N-Channel MOSFETs

ROHM Introduces Class-Leading Low ON Resistance N-Channel MOSFETs

­ROHM Semiconductor announced the RS6xxxxBx / RH6xxxxBx series of N-channel MOSFETs (40V/60V/80V/100V/150V; 13 part numbers) suitable for applications operating on 24V/36V/48V power supplies, such as base stations, servers, and motors for industrial and consumer equipment. In recent years, wo
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Date:
06/01/2023
Bringing a Digital Dimension to Revolutionary Smart Shunt Technology

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Figure 1: A Riedon SSD Smart Shunt

­By achieving high efficiency levels, environmental guidelines can be adhered to and electricity consumption costs made more manageable. Conversely, elevated efficiency levels must be maintained in places where energy is being generated, so that it can always be used to full effect.  There are many high
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Date:
06/01/2023
Power ICs Integrate Fast, Autonomous, Precise Protection Circuits for Ultimate System Robustness

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Figure 1: Device overload causes high temperatures and destruction

­As maximum load requirements increase and size decreases, the current, power and thermal stress also increases for the power switching device. The need to protect against overload conditions becomes paramount. As switching frequency increases, the need for faster fault detection, reaction, and protection times be
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Date:
06/01/2023
Precision Thin Film Resistors – Nichrome vs Tantalum Nitride – a Comparison

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Figure 1: Precision Chip Resistors

­The two main resistive materials used in the manufacturing of precision chip resistors are nichrome (NiCr) and tantalum nitride (TaN).  This article will discuss the similarities and differences between resistors made with these two material types; from manufacturing to material properties to overall el
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Date:
06/01/2023
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