Alpha and Omega Semiconductor Unveils World’s First NVIDIA OVR4-22 Multiphase PWM Controller Powering AI Server and Graphic Cards
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for the Automotive Industry
OmniOn Power’s New Pole-Mounted Power System Delivers 4500 Watts of Power for up to Eight Wireless Radios
STMicroelectronics Introduces First STM32-Ready Wireless IoT Modules, Leveraging Collaboration with Qualcomm
Saki announces the launch of its most advanced 3D X-ray Inspection machine for IGBT & Power Modules: 3Xi-M200v3.
enwitec Sets New Standards with PowerShield 500 and PowerShield Pro 1100
Linux Foundation Energy Announces Open Source Power Grid Projects for AI Modeling and Edge Applications, Plus Scope 3 Emissions Visibility
Morse Micro Launches Industry-Leading Wi-Fi HaLow Router: HaLowLink 1
bp extends global agreement with ABB as automation, electrical and telecommunications strategic supplier for upstream and downstream facilities
Technip Energies and GE Vernova Awarded a Major Contract for the Net Zero Teesside Power Project
Melexis Makes a Splash with New Triphibian Pressure Sensor Featuring LIN Interface
Roadzen CEO, Rohan Malhotra
Nordic Launches Thingy:91 X Prototyping Platform for Cellular IoT and Wi-Fi Locationing
Mark Angus, Chief Growth Officer at RESA Power
The Antaira LMP-0702G-SFP-24-T-V2 managed switch comes embedded with four Gigabit Ethernet ports with PoE supplying 30W per port, one data-only Gigabit Ethernet port, and two dual-rate SFP fiber ports
Deploying Balancing Power Could Accelerate U.S. Energy Transition and Save $68 Trillion Globally by 2050: New Wärtsilä Report
Mantosh Malhotra, chief business officer of SynaXG
Thermal Cameras Market to Reach New Heights by 2034, Expected to Reach $6.9 Billion by 2034
Toby Bond, a senior scientist at the CLS, who conducted the research for his PhD
Wave Energy Milestone: First Grid-Connected Array in the Middle East
HMI Introduces 16V, 20A Advanced Hot-Swap/E-Fuse for Robust Load Protection and Efficient Power Management
Calex Launches High-Efficiency Bi-Directional DC-DC Converters for e-Mobility Applications
LG and Ambarella Join Forces to Advance AI-Driven In-Cabin Vehicle Safety Solutions
Cem Som, Vice President at Wurth Electronics Midcom Europe, Don Rigdon, President at Wurth Electronics Midcom and Dominik Kern, President at Wurth Electronics Midcom (from left to right), opening the prototype lab at the Hightech Innovation Center in Munich-Freiham.
Fred Zhou of SGS (second from left) with representatives from GCC Lab
Yokogawa Test & Measurement Releases AQ2300 Series Modular High-Precision SMU to Expedite the Development of Semiconductor Devices
Saagar Govil, CEO of Cemtrex
Mouser Electronics Announces Partnership with DS PENSKE for Formula E Season 11 with Debut in Brazil
Hurricane Beryl caused extensive damage to trees and utility poles.
UFS Ver. 4.0 Embedded Flash Memory Devices for Automotive Applications from KIOXIA Achieve Automotive SPICE CL2 Certification
EITS Series Tactile Switches
Silicon Labs’ Breakthrough Ultra-Low Power Wi-Fi 6 and Bluetooth LE 5.4 Modules Supercharge Device Deployment
Israel’s Minister of Environmental Protection, Mrs. Idit Silman
Saagar Govil, Cemtrex, Chairman & CEO
Bourns Expands Digital Shunt Sensor Line with 500 Amp Series Meeting High Accuracy Measurement Needs in a Wider Range of Applications
Governor Stitt Signs Energy MOU with Ambassador of Denmark
X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology
Yokogawa Test & Measurement Releases WT1800R Series High Performance Power Analyzer
Georgia Cronin, General Manager Customer & Energy Solutions at Jemena
Figure 1. Current process
Holger Postl, Carsten Rinka, Dr. Lorenz Kasch and Dr. Anjes Tjarks with signed letter of intent.
Smart Card IC Market to Witness Steady Growth, Surpassing US $5.2 Billion by 2034
Jason Lomberg, North American Editor, PSD
Ally Winning, European Editor, PSD
Click image to enlarge
Figure 1: OMRON Power Relay Line Up
Click image to enlarge
Figure 1: Automotive electronic communications networks are becoming increasingly complex due to the rising number of MCUs needed in modern vehicles
Click image to enlarge
Figure 1: ≥400V EV batteries are attenuated by resistor dividers to interface with the rest of the BMS
Click image to enlarge
Figure 1: State-of-the-art electromotors are steadily replacing combustion engines
Click image to enlarge
Figure 1: Grinding fasteners to perfection is part of the process when manufacturing custom fasteners for assembly
Click image to enlarge
Figure 1: Typical OBC electrical schematic
Click image to enlarge
Click image to enlarge
Figure 1: Wire Protection with Fuses
Kevin Parmenter, Director, Applications Engineering. TSC, America
Jason Lomberg, North American Editor, PSD
Ally Winning, European Editor, PSD
Click image to enlarge
Figure 1: A negative-to-positive converter electrical schematic, with VIN –6 V to –18 V (–24 V peak) and with VOUT +12 V at 6 A
