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Microchip Unveils New High-Density Power Module for AI at the Edge Applications

Microchip Unveils New High-Density Power Module for AI at the Edge Applications

­AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications. Microchip Technology announces the MCPF1412, a highly efficient and fully integrated point-of-load 12A power module with a
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Date:
04/24/2025