Power Modules

Headlining the release is the NPS4053, a high density Integrated Circuit (IC) designed to provide a smaller footprint and superior system protection to help increase system reliability and ensure safety. The device is optimized for application in portable devices such as notebook computers, desktops, docking stations, a

The SZDL3105BB-EVB02 buck converter design example is configured for a 5 V to 20V at5 A output and integrates all necessary connections to properly test and evaluate the efficiency and other performance metrics of the Silanna SZDL3105B fully-integrated DC/DC converter. A range of compatible daughter boards ensure

THERM-A-GAP GEL 50TBL is a new dispensable thermal gel that offers 5 W/m-K bulk thermal conductivity. At a minimum bond line thickness of 0.05 mm, the apparent thermal conductivity exceeds 10 W/m-K. With a ‘TBL’ suffix that stands for ‘thin bond line’, the new thermal gel needs no mixing or secondary

They solidify the new package standard in this power range with a power density of 1,6 W/cm3 by almost doubling the power density compared to 6 Watt converters in DIP-24 packages. The TEL 6 and TEL 6WI offer wide 2:1 or 4:1 input voltage ranges respectively and feature a high efficiency of up to 87% which enables a