Automotive & Transportation

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Cost-Optimized PolarFire Core FPGAs and SoCs from Microchip Technology Deliver High Performance with a 30% Lower Price Tag

In the current marketplace, Bill of Material (BOM) costs are continuing to rise and developers must work to optimize performance and budgets. Recognizing that a significant portion of the mid-range FPGA market does not require integrated serial transceivers, Microchip Technology is releasing PolarFire® Core Field-Programmable Ga

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Date:

05/20/2025

Ennovi’s Dominik Pawlik

PSDcast – Power Interconnects for EVs

With hybrid and electric vehicles growing in complexity, every component within them must also evolve. Power interconnects, for instance, and how power busbars have become preferable over traditional wiring systems. Ennovi recently wrote an article for us addressing this very topic -- Power Interconnects from Hybrids to Electric Vehicles – and on the line to discuss it is Ennovi’s Dominik Pawlik.

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Date:

05/15/2025

Latest GaN Half-Bridge Drivers from STMicroelectronics are Fine-Tuned for Power Conversion and Motion Control

STMicroelectronics’ new high-voltage half-bridge gate drivers for GaN applications add extra flexibility and features for greater efficiency and robustness. The latest STDRIVEG610 and STDRIVEG611 give designers two options to manage GaN devices in power conversion and motion applications for great

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Date:

05/14/2025

EMC Components: TDK Offers Multilayer Chip Beads with the Industry's Highest Rated Current of 8 A for Power Supply Lines

TDK Corporation has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025. These 1608-size chip beads for power supply lines achieve a rated current o

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Date:

05/13/2025

Peter Schaefer, Chief Sales Officer Automotive, Infineon Technologies AG

Infineon and Visteon Collaborate on Advanced Power Conversion Systems for Next-Generation Electric Vehicles

Infineon Technologies AG, the leading provider of automotive semiconductors, and Visteon Corporation, a global leader in automotive cockpit electronics, today announced the companies have signed a Memorandum of Understanding (MOU) to advance the development of next-generation electric vehicle powertrains. In this join

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Date:

05/09/2025

Power Integrations’ 1700 V Switcher IC Delivers Reliability and Space-Saving Benefits in 800 V BEVs

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced five new reference designs targeting 800 V automotive applications based on the company’s 1700 V InnoSwitch™3-AQ flyback switcher ICs. Spanning power levels from 16 W to 120 W,

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Date:

05/08/2025

Inertial Labs, a VIAVI Solutions Company, Launches Tactical-Grade MEMS IMU with 1 Deg/hr Gyro Bias

Inertial Labs, a VIAVI Solutions Inc. Company, today introduced the IMU-H100, a micro-electromechanical systems (MEMS) inertial measurement unit (IMU) developed to enhance tactical guidance and navigation capabilities of unmanned aerial vehicles (UAVs), short-range missiles and precision gu

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Date:

05/06/2025

To enable the next generation of solid-state power distribution systems, Infineon is expanding its SiC portfolio with the new CoolSiC™ JFET product family.

Infineon Introduces new CoolSiC JFET Technology for Smarter and Faster Solid-State Power Distribution

To enable the next generation of solid-state power distribution systems, Infineon Technologies AG is expanding its silicon carbide (SiC) portfolio with the new CoolSiC™ JFET product family. The new devices deliver minimized conduction losses, solid turn-off capability, and high robustness, making them ideal fo

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Date:

05/06/2025

Navitas Redefines Reliability with Industry’s First Automotive ‘AEC-Plus’ Qualified SiC MOSFETs in HV-T2PaK Top-Side Cooled Package

Navitas Semiconductor introduces a new level of reliability to meet the system lifetime requirements of the most demanding automotive and industrial applications. Navitas’ latest generation of 650 V and 1200 V ‘trench-assisted planar’ SiC MOSFETs combined with an optimized, HV-T2Pak top-side cooled pa

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Date:

05/05/2025

Click image to enlarge

Figure 1: EV parked outside residential home

The Daily Use of EV Chargers: Human Interface Technology

Wayne Liang, senior segment manager of Microchip Technology’s E-Mobility business

Automotive manufacturers are increasingly offering a wider selection of EVs to their fleet, which requires a larger quantity of easy-to-use chargers for customers. There are several types of chargers that are currently in use including Level 1, Level 2 and DC fast chargers depending upon their size and capacity. Ho

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Date:

05/01/2025