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Infineon Collaborates with Typhoon HIL to Accelerate Development of xEV Power Electronic Systems using Real-Time Hardware-in-the-loop Platform

Customers working with Infineon’s AURIX™ TC3x/TC4x automotive microcontrollers can now use a complete HIL simulation and test solution using Typhoons HIL simulator.

­Infineon Technologies AG announced a collaboration with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide automotive engineering teams with a fully-integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working wi
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Date:
06/05/2025

ROHM Develops Breakthrough AI-Equipped MCU

ROHM Develops Breakthrough AI-Equipped MCU

­ROHM Semiconductor announced they have developed AI-equipped MCUs (AI MCUs) – ML63Q253x-NNNxx / ML63Q255x-NNNxx – that enable fault prediction and degradation forecasting using sensing data in a wide range of devices, including industrial equipment such as motors. These MCUs are the
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Date:
06/05/2025
STMicroelectronics Announces Mass Production and Lead Customer Success for Turnkey Bluetooth/Wi-Fi Modules Developed with Qualcomm

STMicroelectronics Announces Mass Production and Lead Customer Success for Turnkey Bluetooth/Wi-Fi Modules Developed with Qualcomm

­STMicroelectronics has announced mass-production start for its ST67W611M1 combined Wi-Fi 6 and Bluetooth Low Energy 5.4 module, describing the early success of Siana, a lead customer for its fast-to-market connectivity. The module is the first product of ST’s collaboration with Qualcomm Technologies, Inc. anno
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Date:
06/04/2025
Würth Elektronik Presents its Skoll-I Bluetooth Module

Product-related service: A dedicated evaluation board and various software tools are available for the Skoll-I wireless module.
Image source: Würth Elektronik

­Manufacturer of electronic and electromechanical components, introduces Skoll-I, a compact wireless module that combines both Bluetooth® Classic and Bluetooth® LE (Low Energy) version 5.4 in a single solution. Measuring just 16.6 × 12 × 1.7 mm, the module is already certified for conformity in
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Date:
06/03/2025
Cissoid’s Unique Modular SIC Inverter Platform Available from Rhopoint Components

Cissoid’s Unique Modular SIC Inverter Platform Available from Rhopoint Components

­Rhopoint Components, specialist distributor  of precision electronic components, sensors, connectors and modular systems, announces the availability of the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module. Applications include power systems for Electric Vehicles
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Date:
06/02/2025
Bourns Unveils Current Transformer Line with New Model that Features High Turns Ratio with Permalloy T-Core Construction

Bourns® Model PCP300-T414250S Current Transformer

­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today unveiled the Company’s new current transformer line with its Model PCP300-T414250S Transformer. The new model is made with high-efficiency permalloy material th
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Date:
06/02/2025
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