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Infineon Introduces AURIX TC4x Software to Enable Quality, Safety, and Security in Automotive Applications

Patrick Will, Senior Director and Head of Software Product Marketing and Management at Infineon

­Infineon Technologies AG has launched a comprehensive software portfolio designed specifically for the latest AURIX™ TC4x microcontroller (MCU) family. It enables automotive safety applications with production ready ASIL D drivers for the AUTOSAR MCAL and safety software. By reducing efforts for software pa
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Date:
09/04/2025
Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

Heilind Electronics Now Stocks 3M Four-Wall Header 2500 Series

­Heilind Electronics, a leading global distributor of interconnect, electromechanical, and sensor solutions, is pleased to announce that it now stocks the 3M™ Four-Wall Header 2500 Series, a versatile 100″ × .100″ wire-to-board connector designed to deliver space-saving performance, reliable mating, an
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Date:
09/04/2025
iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

iDEAL Semiconductor Announces 200 V Family of SuperQ-based MOSFETs With Industry-Leading Cost x Performance

­iDEAL Semiconductor has announced the first of its 200 V family of SuperQ™-based MOSFETs has entered mass production, with four additional 200 V devices now sampling. SuperQ is the first major advance in silicon MOSFET technology in more than 25 years, breaking through long-standing limits in switching
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Date:
09/04/2025
SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

­Effective immediately, SEGGER programming support is available for selected SPI flash-memory devices from Winbond Electronics Corporation. SEGGER’s highly regarded J-Link and Flasher product lines are now fully compatible with Winbond's high-performance W25H, W25Q, and W25X SpiFlash® multi-input/-output (I/O)
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Date:
09/04/2025
Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

­Toshiba Electronics Europe GmbH (“Toshiba”) announces the release of three new 650V silicon carbide (SiC) MOSFETs, which incorporate its latest 3rd generation SiC MOSFET chips. The TW027U65C, TW048U65C, and TW083U65C are housed in a surface-mount TOLL package and are designed to reduce switching losses in
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Date:
09/02/2025
Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia

Vero's Range of PCB Prototyping Aids and Accessories now Stocked at Anglia

­Anglia Components is now stocking an extensive range of PCB Prototyping aids and accessories from UK company Vero Technologies Ltd. The two companies have signed an agreement covering the UK and the EU, giving Anglia’s customer base access to a wide range of products and accessories for PCB prototyping, te
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Date:
09/02/2025
Bourns Miniature Thermal Cutoff Mini-Breaker Series Supports New 240 Watt USB Power Delivery Standard Limit

Bourns® SE Series resettable miniature Thermal Cutoff (TCO) Mini-Breakers

­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced its SE Series miniature Thermal Cutoff (TCO) Mini-Breaker devices that are designed to support 240 W, which meets the upper limit of the USB Power Delivery (P
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Date:
09/02/2025
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