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Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction

Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction

Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction
­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor Series: the CE0603G, CE0603M, CE1005Q, and CE1608Q Series. These new inductors feature a monolithic structure ac
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Date:
02/24/2026
KIOXIA Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications

KIOXIA Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications

KIOXIA Sampling UFS 5.0 Embedded Flash Memory Devices for Next-Generation Mobile Applications
­KIOXIA Europe, a world leader in memory solutions, today announced that KIOXIA Corporation has begun shipping evaluation samples of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC. UFS 5.0 is a new standard for embed
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Date:
02/24/2026
Emerson Launches New Software Defined Radio for Radar, Satellite and 6G Research

Emerson Launches New Software Defined Radio for Radar, Satellite and 6G Research

Emerson Launches New Software Defined Radio for Radar, Satellite and 6G Research
­Emerson today announced the launch of the NI USRP X420, a software defined radio (SDR) designed to meet the demanding requirements of advanced radar systems, satellite communications, and emerging 6G research. The X420 expands the NI Universal Software Radio Peripheral (USRP) product line with frequency coverage
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Date:
02/24/2026
STMicroelectronics' new MasterGaN power ICs Combine Flexibility with Advanced GaN Technology

STMicroelectronics' new MasterGaN power ICs Combine Flexibility with Advanced GaN Technology

STMicroelectronics' new MasterGaN power ICs Combine Flexibility with Advanced GaN Technology
­STMicroelectronics has introduced MasterGaN6, beginning the second generation of the MasterGaN half-bridge family. The new power system in package couples an updated BCD driver with a high-performance GaN power transistor that has just 140mΩ RDS(on). Leveraging the high integration already established
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Date:
02/24/2026
First Fully Integrated, Highly Configurable 80 Gbps Differential DP3T Switch for Advanced AI Device Validation

First Fully Integrated, Highly Configurable 80 Gbps Differential DP3T Switch for Advanced AI Device Validation

First Fully Integrated, Highly Configurable 80 Gbps Differential DP3T Switch for Advanced AI Device Validation
­Menlo Microsystems, Inc. announced the MM5627, the first switch in its category to combine 80 Gbps performance with high configurability, integrated DP3T logic, and fully integrated on-chip components. Designed for high-speed test and validation of AI GPUs, CPUs, and advanced semiconductor ICs, the MM5627 en
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Date:
02/24/2026
Multistage Thermoelectric Coolers Deliver Ultra-Compact Footprints with Temperature Differentials (ΔTs) up to 100 to 120°C in Vacuum

Multistage Thermoelectric Coolers Deliver Ultra-Compact Footprints with Temperature Differentials (ΔTs) up to 100 to 120°C in Vacuum

Multistage Thermoelectric Coolers Deliver Ultra-Compact Footprints with Temperature Differentials (ΔTs) up to 100 to 120°C in Vacuum
­Tark Thermal Solutions, the leading global manufacturer of thermal management solutions (formerly Laird Thermal Systems), announces the launch of two and three stage OptoTEC® MSX Series micro multistage thermoelectric coolers (TEC) engineered for high coefficient of performance (COP) in infrared sensors and X-
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Date:
02/24/2026
Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance

Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance

Keysight Introduces Infiniium XR8 Oscilloscopes to Accelerate High-Speed Digital Validation and Compliance
­Keysight Technologies, Inc. launched its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.  As interface standards such as USB, DisplayPort, and DDR r
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Date:
02/20/2026
ABLIC Launches Automotive Shunt Reference IC with Industry's Best ±0.1% Output Voltage Accuracy

ABLIC Automotive Shunt Reference IC: S-19760/1 Series

ABLIC Launches Automotive Shunt Reference IC with Industry's Best ±0.1% Output Voltage Accuracy
­ABLIC Inc., a member of the MinebeaMitsumi Group, today announced the launch of the S-19760/1 Series automotive shunt reference ICs, which achieve the industry’s highest (*1) output voltage accuracy of ±0.1% and the industry’s lowest (*1) output voltage temperature coefficient of ±20ppm/℃. The new S-19760
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Date:
02/18/2026
Precise Wavelength Typing for LED Chips – Flexible Spectral Binning for Sensor and Measurement Applications

Green/Red LED Chip

Precise Wavelength Typing for LED Chips – Flexible Spectral Binning for Sensor and Measurement Applications
­Many lighting applications work with the dominant wavelength (lambda dom) as standard. However, in numerous technical applications – even in the visible spectral range – this variable is not ideally suited. Especially in sensory applications, the exact spectral characteristics are particularly important
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Date:
02/18/2026
ABB Launches Integrated Carbon Capture Measurement Solution to Accelerate Industrial Decarbonization

ABB Launches Integrated Carbon Capture Measurement Solution to Accelerate Industrial Decarbonization

ABB Launches Integrated Carbon Capture Measurement Solution to Accelerate Industrial Decarbonization
­ABB has announced the launch of its first fully integrated gas analyzer package for Carbon Capture, Utilization and Storage (CCUS) applications, combining three proven ABB technologies into a single, streamlined solution. The new offering provides a comprehensive, real-time measurement suite for CO₂ impurity de
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Date:
02/18/2026
Musashi Energy Solutions Adds Staco Energy Products as Authorized Reseller of ESS400 Power Backup Systems

Staco Energy Products' FirstLine PE 3-Phase UPS Paired with Musashi's Hybrid SuperCapacitor-based ESS400 System

Musashi Energy Solutions Adds Staco Energy Products as Authorized Reseller of ESS400 Power Backup Systems
­Musashi Energy Solutions (MES), a wholly-owned subsidiary of Musashi and a leading developer of Hybrid SuperCapacitor (HSC) cells and systems for mission-critical backup power, is pleased to officially announce Staco Energy Products as an OEM-Authorized Channel for Sales and Service of the ESS400 Energy Storage Sy
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Date:
02/18/2026
Temperature Sensors: TDK launches High‑Reliability Automotive NTC Thermistors Rated for +175 °C

Temperature Sensors: TDK launches High‑Reliability Automotive NTC Thermistors Rated for +175 °C

Temperature Sensors: TDK launches High‑Reliability Automotive NTC Thermistors Rated for +175 °C
­TDK Corporation announced that it has expanded its NTCSP series of NTC thermistors. These components are designed for conductive‑glue mounting for operation in high‑temperature environments up to +175 °C. Mass production of this series began in February 2026. To drive higher automotive performance, more powe
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Date:
02/17/2026
STMicroelectronics' Fast-Acting Isolated Gate Drivers for Smaller, Safer Automotive Modules

STMicroelectronics' Fast-Acting Isolated Gate Drivers for Smaller, Safer Automotive Modules

STMicroelectronics' Fast-Acting Isolated Gate Drivers for Smaller, Safer Automotive Modules
­STMicroelectronics’ STGAP2SA and STGAP2HSA automotive-grade, galvanically isolated 4A gate drivers with 60ns response time and close part-to-part matching allow high switching frequencies for increased power density and efficiency. Suitable for IGBTs and silicon MOSFETs operating with a hi
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Date:
02/17/2026
ABB Advances Power System Simulation Models to Support Grid Compliance

ABB Advances Power System Simulation Models to Support Grid Compliance

ABB Advances Power System Simulation Models to Support Grid Compliance
­ABB has introduced significant advancements to the power simulation models for its ABB UNITROL 1000 Automatic Voltage Regulators (AVR), enabling superior simulation accuracy and usability for optimizing system performance and compliance. AVRs play a vital role in managing the voltage output of a synchronous ge
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Date:
02/16/2026
SCHURTER Coin Cell Supercapacitors

SCHURTER Coin Cell Supercapacitors

SCHURTER Coin Cell Supercapacitors
­Coin cell supercapacitors are compact electrochemical energy storage devices with a high capacity that can quickly store and release electrical energy. Compared to conventional batteries, they offer several advantages, including high power density, a long cycle life, and fast charge and discharge rates.  Supercapacitors have arou
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Date:
02/16/2026
Navitas Unveils 5th Generation SiC Trench-Assisted Planar Technology

Navitas Unveils 5th Generation SiC Trench-Assisted Planar Technology

Navitas Unveils 5th Generation SiC Trench-Assisted Planar Technology
­Navitas Semiconductor announced the launch of its 5th-generation GeneSiC technology platform. The High Voltage (HV) SiC Trench-Assisted Planar (TAP) MOSFET technology represents a significant technological leap over previous generations and will deliver an industry leading 1200V line of MOSFETs. It complements Na
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Date:
02/13/2026
SemiQ Establishes Distribution Partnership with NAC Semi to Expand Global Reach for Silicon Carbide Solutions

SemiQ Establishes Distribution Partnership with NAC Semi to Expand Global Reach for Silicon Carbide Solutions

SemiQ Establishes Distribution Partnership with NAC Semi to Expand Global Reach for Silicon Carbide Solutions
­SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has announced a distribution agreement with NAC Semi (NAC Group, Inc.), a global electronic component design services and distribution company.  This partnership
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Date:
02/12/2026
Toshiba Introduces 40V eFuse ICs in Small TSOP6F Packages for Power Line Circuit Protection in Industrial and Consumer Applications

Toshiba Introduces 40V eFuse ICs in Small TSOP6F Packages for Power Line Circuit Protection in Industrial and Consumer Applications

Toshiba Introduces 40V eFuse ICs in Small TSOP6F Packages for Power Line Circuit Protection in Industrial and Consumer Applications
­Toshiba Electronics Europe GmbH (“Toshiba”) expands its electronic fuse (eFuse) lineup with the introduction of the 40V TCKE6 series. The five new products are the TCKE601RA, TCKE601RL, TCKE602RM, TCKE603RA, and TCKE603RL. The eFuse ICs are suitable for use in industrial equipment, such as robots and programmable lo
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Date:
02/12/2026
TDK Presents DC Link Capacitors for up to +125 °C in Demanding Automotive and Industrial Applications

TDK Presents DC Link Capacitors for up to +125 °C in Demanding Automotive and Industrial Applications

TDK Presents DC Link Capacitors for up to +125 °C in Demanding Automotive and Industrial Applications
­TDK Corporation announces the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics. With a maximum operating temperature of +125 °C and no power derating up to +105 °C, the series ensures stable capacitance and reliable en
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Date:
02/11/2026
Vacuum Interrupters Introduces RVI-PV-74A Replacement Vacuum Interrupter

Vacuum Interrupters Introduces RVI-PV-74A Replacement Vacuum Interrupter

Vacuum Interrupters Introduces RVI-PV-74A Replacement Vacuum Interrupter
­Vacuum Interrupters, a leading manufacturer of replacement vacuum interrupters, pole assemblies, parts, and components for medium-voltage vacuum circuit breakers and contactors, introduces the RVI-PV-74A replacement vacuum interrupter. This direct fit-and-function replacement unit for General E
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Date:
02/11/2026
Endeavour Launches TurboCell: The First Power Platform Purpose-Built for the AI Era

Endeavour Launches TurboCell: The First Power Platform Purpose-Built for the AI Era

Endeavour Launches TurboCell: The First Power Platform Purpose-Built for the AI Era
Exponential AI growth is outpacing utility expansion and available generation capacity, creating a growing gap that limits where AI infrastructure can be built and how quickly it can be powered. Endeavour today announced TurboCell, a rapidly deployable, scalable power system that accelerates time-to-compute wh
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Date:
02/11/2026
EPC Announces Strategic GaN Technology Licensing and Second Sourcing Agreement with Renesas

EPC Announces Strategic GaN Technology Licensing and Second Sourcing Agreement with Renesas

EPC Announces Strategic GaN Technology Licensing and Second Sourcing Agreement with Renesas
­Efficient Power Conversion (EPC), the world leader in enhancement-mode gallium nitride (eGaN®) power devices, today announced a comprehensive licensing agreement with Renesas Electronics Corporation, a premier global supplier of advanced semiconductor solutions and high-voltage GaN transistors. Under the agree
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Date:
02/11/2026
Industry's Smallest, Most Efficient Laser Firing System ICs are Now Available in Production Quantities

Industry's Smallest, Most Efficient Laser Firing System ICs are Now Available in Production Quantities

Industry's Smallest, Most Efficient Laser Firing System ICs are Now Available in Production Quantities
­Silanna Semiconductor, a global provider of high-performance mixed-signal solutions, today announced its FirePower™ laser firing system ICs for smaller, more efficient LiDAR and rangefinder applications are available in production quantities.  These devices have been developed to significantly reduc
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Date:
02/11/2026
Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise

Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise

Keysight Enables Enterprise-Scale AI Adoption in Semiconductor Design with SOS Enterprise
­Keysight Technologies, Inc. announced SOS Enterprise, an advanced edition of its engineering data management platform. The solution builds on the SOS Core software and automates engineering data governance and traceability to prepare for AI adoption at scale. As semiconductor and electronics dev
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Date:
02/11/2026
Thermal-Magnetic Protection in an 8-mm Package

Thermal-Magnetic Protection in an 8-mm Package

Thermal-Magnetic Protection in an 8-mm Package
­Phoenix Contact introduces the PTCB TM, the smallest pluggable thermal-magnetic circuit breakers on the market. Measuring just 8 millimeters wide, the individual circuit breakers feature both protection and signaling in a single module. The narrow design saves up to 65% space compared with other thermal-magnetic ci
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Date:
02/11/2026
Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance

Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance

Empower Introduces High-Density Embedded Silicon Capacitors to Advance Next-Generation AI and HPC Performance
­Empower Semiconductor, the world leader in powering artificial intelligence (AI)-class processors, today announced the launch of three new embedded silicon capacitors (ECAPs™), designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors. The new EC
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Date:
02/10/2026
Allegro MicroSystems Expands Current Sensing Leadership with Industry's Highest Accuracy Magnetic Current Sensor

Allegro MicroSystems Expands Current Sensing Leadership with Industry's Highest Accuracy Magnetic Current Sensor

Allegro MicroSystems Expands Current Sensing Leadership with Industry's Highest Accuracy Magnetic Current Sensor
­Allegro MicroSystems, Inc., a global leader in power and sensing solutions for motion control and energy-efficient systems, today introduced the ACS37017, a new Hall-effect current sensor that sets the industry benchmark for accuracy. With the launch of the ACS37017, Allegro completes a strategic expansion of
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Date:
02/10/2026
Cree LED Unveils OptiLamp LEDs With Active Intelligence in Every Pixel

Cree LED Unveils OptiLamp LEDs With Active Intelligence in Every Pixel

Cree LED Unveils OptiLamp LEDs With Active Intelligence in Every Pixel
­Cree LED®, a Penguin Solutions brand, today announced OptiLamp™ LEDs, a new display technology that integrates driver and control intelligence directly into every LED pixel. Built on patented Cree LED technology, the OptiLamp portfolio advances LED display design by delivering superior image quality wi
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Date:
02/09/2026
Navitas Unveils Breakthrough 10 kW DC-DC Platform Delivering 98.5% Efficiency for 800 VDC Next-Gen AI Data Centers

Navitas Unveils Breakthrough 10 kW DC-DC Platform Delivering 98.5% Efficiency for 800 VDC Next-Gen AI Data Centers

Navitas Unveils Breakthrough 10 kW DC-DC Platform Delivering 98.5% Efficiency for 800 VDC Next-Gen AI Data Centers
­Navitas Semiconductor, a leader in GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, unveiled a breakthrough 10 kW DC-DC power platform delivering up to 98.5% peak efficiency and 1 MHz switching frequency, enabling unprecedented power density to support the rapid, la
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Date:
02/09/2026
Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity
­Microchip Technology announced a collaboration with Hyundai Motor Group (HMG) to explore the adoption of advanced in-vehicle network solutions based on 10BASE-T1S Single Pair Ethernet (SPE) technology. This cooperation effort is intended to support the development of more efficient, reliable and scalable ve
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Date:
02/06/2026
TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery

TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery

TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery
­TDK Corporation expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A and is engineered to meet the demanding requirements of AI servers, edge computing, and data center systems. By stacking or paralleling se
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Date:
02/05/2026
GE Vernova Expands its Grid Automation Portfolio with a new Solution for Modern Grids

GE Vernova Expands its Grid Automation Portfolio with a new Solution for Modern Grids

GE Vernova Expands its Grid Automation Portfolio with a new Solution for Modern Grids
­GE Vernova Inc. announced the launch of a new solution designed to simplify grid operations and protection as electricity networks expand globally and become more complex. GridBeats™ APS (Automation and Protection System) is a new product within GE Vernova’s GridBeats™ portfolio of software-
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Date:
02/03/2026
STMicroelectronics' Space-Grade Driver Supports High-Speed Data and Low-Voltage Logic

STMicroelectronics' Space-Grade Driver Supports High-Speed Data and Low-Voltage Logic

STMicroelectronics' Space-Grade Driver Supports High-Speed Data and Low-Voltage Logic
­Supporting faster data speeds in space applications, ST’s RHFLVDS41 Low-Voltage Differential Signaling driver sets a new performance benchmark among QML-V qualified devices for data exchanges at up to 600Mbps. Having a wide operating-voltage range, from 2.3V-3.6V, the driver is compatible with th
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Date:
02/03/2026
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