Home / News / Product News

     

    Product News

    Current
    iDEAL Semiconductor Signs Distribution Agreement with Marubun to Expand Access to SuperQ Power MOSFETs in Japan

    iDEAL Semiconductor Signs Distribution Agreement with Marubun to Expand Access to SuperQ Power MOSFETs in Japan

    iDEAL Semiconductor Signs Distribution Agreement with Marubun to Expand Access to SuperQ Power MOSFETs in Japan
    ­iDEAL Semiconductor, a developer of next-generation silicon power devices based on its patented SuperQ® technology, today announced a distribution agreement with Marubun Corporation, value-added Technology Distributor with its broad portfolio in cutting-edge semiconductors, electronic components, and electronic ap
    . . . Learn More
    Date:
    10/20/2026
    STMicroelectronics Expands Space-Grade Portfolio with QML-V Qualified Quad LVDS Receiver

    STMicroelectronics Expands Space-Grade Portfolio with QML-V Qualified Quad LVDS Receiver

    STMicroelectronics Expands Space-Grade Portfolio with QML-V Qualified Quad LVDS Receiver
    ­STMicroelectronics’ RHFLVDS42 QML-V qualified quad low-voltage differential signaling (LVDS) receiver combines high communication speeds, low power consumption, and enhanced robustness for aerospace applications. The receiver enables data exchange at up to 600Mbps. With a wide operating voltage r
    . . . Learn More
    Date:
    10/19/2026
    GMS Reinvents Tactical System Modernization with Thunderbolt-Enabled Expansion Modules

    New MOSA-compliant Expansion™ modules transform virtually any compatible platform into a rapidly upgradeable
    C5ISR and mission system, enabling low-cost insertion of plug-and-play AI, autonomy, advanced networking,
    secure storage, and next-generation warfighting capabilities without costly platform

    GMS Reinvents Tactical System Modernization with Thunderbolt-Enabled Expansion Modules
    ­General Micro Systems (GMS), the undisputed leader in ultra-rugged small form factor (SFF) embedded computing for defense and aerospace applications, today unveiled its MOSA-compliant smart peripheral Expansion™ modules, a breakthrough family of Thunderbolt™-enabled subsystems that fundamentally redefine ho
    . . . Learn More
    Date:
    10/13/2026
    Tark Thermal Solutions Launches PCX-DG Series Thermoelectric Coolers With Dual Compliant Bonding for Maximum Test System Reliability

    Tark Thermal Solutions Launches PCX-DG Series Thermoelectric Coolers With Dual Compliant Bonding for Maximum Test System Reliability

    Tark Thermal Solutions Launches PCX-DG Series Thermoelectric Coolers With Dual Compliant Bonding for Maximum Test System Reliability
    ­Tark Thermal Solutions, the global leader in thermal management solutions, today announced the PowerCycling PCX-DG Series, a new family of thermoelectric coolers engineered for higher current draw and high heat flux density applications like end-of-line (EOL) optical transceiver test heads, semiconductor test so
    . . . Learn More
    Date:
    10/13/2026
    TDK Introduces new Dual-Die, Stray-Field Robust Motor Position Sensor for ASIL D Fail Operational Applications

    TDK introduces new dual-die, stray-field robust motor position sensor for ASIL D fail operational applications

    TDK Introduces new Dual-Die, Stray-Field Robust Motor Position Sensor for ASIL D Fail Operational Applications
    ­TDK Corporation (TSE:6762) introduces the Micronas HAR 3025, a dual-die stray-field robust motor position sensor with analog sine/cosine output, designed for automotive and industrial safety-critical applications. The HAR 3025 extends TDK’s fast angular position sensor family with a fully redundant architecture hou
    . . . Learn More
    Date:
    10/13/2026
    VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution

    HISS horizontal inline sputtering system

    VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution
    ­VON ARDENNE , a global leader in high-precision vacuum coating equipment and co-developed materials solutions, today announced that it is expanding its semiconductor deposition portfolio into panel-level packaging (PLP). The HiPIMS solution deposits high-aspect-ratio barrier and seed layers in through-glass via (TGV)
    . . . Learn More
    Date:
    10/13/2026
    Toshiba Launches 3300V SiC MOSFET Module for Industrial Equipment

    Toshiba Launches 3300V SiC MOSFET Module for Industrial Equipment

    Toshiba Launches 3300V SiC MOSFET Module for Industrial Equipment
    ­Toshiba Electronics Europe GmbH (“Toshiba”) today announced the expansion of its line-up with the launch of IX800FXF2YMS4, a dual SiC MOSFET module. The new module offers high surge-current capability to support reliable operation in industrial equipment, including inverters and converters for railway ve
    . . . Learn More
    Date:
    10/09/2026
    Connect Legacy Serial Equipment to Modern Networks with Antaira's STE-6104C-T-V2 Industrial Gateway

    Connect Legacy Serial Equipment to Modern Networks with Antaira's STE-6104C-T-V2 Industrial Gateway

    Connect Legacy Serial Equipment to Modern Networks with Antaira's STE-6104C-T-V2 Industrial Gateway
    ­For operators looking to modernize without replacing proven equipment, Antaira Technologies highlights the STE-6104C-T-V2, a 4-port industrial gateway that connects virtually any RS-232, RS-422 or RS-485 serial device to a new or existing Ethernet (TCP/IP) network. With redundant Ethernet, wide-temperature ope
    . . . Learn More
    Date:
    10/09/2026
    Infineon Introduces 27 kW Three-Phase PSU Solution for Next-Generation AI Server Power Architectures

    Artificial intelligence workloads are redefining the power requirements of modern data centers.

    Infineon Introduces 27 kW Three-Phase PSU Solution for Next-Generation AI Server Power Architectures
    ­Artificial intelligence workloads are redefining the power requirements of modern data centers. Increasing GPU performance and rising rack densities are driving a shift toward 800 VDC or ±400 VDC power supply architectures. To address these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is
    . . . Learn More
    Date:
    10/08/2026
    New Druck Sensor Helps Space Companies Improve Safety and Accelerate Testing Programs

    New Druck Sensor Helps Space Companies Improve Safety and Accelerate Testing Programs

    New Druck Sensor Helps Space Companies Improve Safety and Accelerate Testing Programs
    ­Druck, a Crane Company business and leaders in pressure measurement, has launched the UNIK5000F, a new oxygen-compatible pressure sensor designed to meet the demanding requirements of the rapidly expanding global space industry. Developed for applications including rocket propulsion testing,
    . . . Learn More
    Date:
    10/08/2026
    Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing

    Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing

    Teradyne Announces Magnum E2 to Address Next-Generation Memory Test Demands Driven by AI and High-Performance Computing
    ­Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced Magnum E2, a next-generation high-speed memory test system for advanced DRAM and flash interfaces, including LPDDR6, DDR6, GDDR7, and NAND flash. Built on Teradyne's proven Near-DUT Test (NDT) architecture, the fou
    . . . Learn More
    Date:
    10/08/2026
    Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics

    Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics

    Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics
    ­Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its GaN portfolio into low-voltage applications with its first family of 100V enhancement mode (E-mode) GaN-based discrete power transistors. The RTP100E005G1FL, RTP100E2P6G1FL, RTP100E1P8G1FL-DSC and RTP100E1P2G1FL-DSC lo
    . . . Learn More
    Date:
    10/07/2026
    RS and RS PRO Drive Network and Thermal Reliability in Smart Factories

    RS and RS PRO Drive Network and Thermal Reliability in Smart Factories

    RS and RS PRO Drive Network and Thermal Reliability in Smart Factories
    ­RS, a high-service global product and service solutions provider for industrial customers, streamlines smart factory operations with its RS PRO Total Panel Integration portfolio. This unified product ecosystem simplifies panel design, protects sensitive electronics, and lowers total cost of ownership for organizations ac
    . . . Learn More
    Date:
    10/07/2026
    Littelfuse Unveils Ultra-Low Capacitance TVS Diode Arrays with Industry's Lowest Clamping Voltage

    Littelfuse Unveils Ultra-Low Capacitance TVS Diode Arrays with Industry's Lowest Clamping Voltage

    Littelfuse Unveils Ultra-Low Capacitance TVS Diode Arrays with Industry's Lowest Clamping Voltage
    ­Littelfuse, Inc., an industrial technology manufacturing company shaping solutions for the safe and efficient transfer of electrical energy, today announced AQ4315-01ETG and SP4315-01WTG, two new Bidirectional TVS Diode Arrays (SPA® Diodes) that combine industry-leading low clamping voltage with ultra-low ca
    . . . Learn More
    Date:
    10/07/2026
    A Reliable, High-Performance Alternative to Legacy Autopilots: Upbeat Launches Bluemag Pi with Onboard AI

    A Reliable, High-Performance Alternative to Legacy Autopilots: Upbeat Launches Bluemag Pi with Onboard AI

    A Reliable, High-Performance Alternative to Legacy Autopilots: Upbeat Launches Bluemag Pi with Onboard AI
    ­Upbeat Technology, a pioneer in ultra-low-power compute, voice, and edge AI sensing solutions, today announced the launch of Bluemag Pi, a sensor-integrated AI flight controller built for long-endurance fixed-wing aircraft, commercial multirotor drones, and unmanned surface vessels. The board runs on Upbeat's UP3
    . . . Learn More
    Date:
    10/07/2026
    MEMSensing Launches Bone-Vibration Sensor in Europe

    MEMSensing Launches Bone-Vibration Sensor in Europe

    MEMSensing Launches Bone-Vibration Sensor in Europe
    ­MEMSensing announces the European launch of its microelectromechanical systems (MEMS) bone-vibration sensor developed to improve uplink voice capture in true wireless stereo (TWS) earbuds. Used alongside a conventional microphone, the sensor provides a separate reference for the wearer’s voice that is less af
    . . . Learn More
    Date:
    10/06/2026
    Mouser Now Shipping New NXP Semiconductors Ara240 Discrete Neural Processing Unit for AI, Edge, Industrial, and Robotics Applications

    Mouser Now Shipping New NXP Semiconductors Ara240 Discrete Neural Processing Unit for AI, Edge, Industrial, and Robotics Applications

    Mouser Now Shipping New NXP Semiconductors Ara240 Discrete Neural Processing Unit for AI, Edge, Industrial, and Robotics Applications
    ­Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now stocking the new Ara240 discrete neural processing unit (DNPU) from NXP® Semiconductors. The Ara240 DNPU enables real-time generative AI, industrial automation systems, au
    . . . Learn More
    Date:
    10/05/2026
    Pfannenberg USA Upgrades Green Series Cooling Units for Safe, Reliable and Compliant Enclosure Cooling

    Pfannenberg USA Upgrades Green Series Cooling Units for Safe, Reliable and Compliant Enclosure Cooling

    Pfannenberg USA Upgrades Green Series Cooling Units for Safe, Reliable and Compliant Enclosure Cooling
    ­Pfannenberg, Inc., a global leader in thermal management and signaling technologies, announces updates to its Green Series enclosure cooling unit portfolio. Designed around real-world application requirements, the updated Green Series helps industrial customers address evolving F-Gas regulations while maintaining th
    . . . Learn More
    Date:
    10/05/2026
    Navitas and Microchip Collaborate to Deliver 800V Reference Design for Next-Generation AI Data Centers

    Navitas and Microchip Collaborate to Deliver 800V Reference Design for Next-Generation AI Data Centers

    Navitas and Microchip Collaborate to Deliver 800V Reference Design for Next-Generation AI Data Centers
    ­Navitas Semiconductor and Microchip Technology - As AI data centers scale to support high-power GPU clusters, the industry is shifting toward 800V DC rack power architectures to improve distribution efficiency, increase power density and support next-generation server designs. To help accelerate this tr
    . . . Learn More
    Date:
    10/05/2026
    OMNIVISION Launches Industry's First 2.2-micron Global Shutter HDR Sensor for Flagship Industrial and Robotics Machine Vision Cameras

    OMNIVISION Launches Industry's First 2.2-micron Global Shutter HDR Sensor for Flagship Industrial and Robotics Machine Vision Cameras

    OMNIVISION Launches Industry's First 2.2-micron Global Shutter HDR Sensor for Flagship Industrial and Robotics Machine Vision Cameras
    ­OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and display technology, today announced the industry’s first 2.2-micron (µm) 5-megapixel (MP) global shutter (GS) high dynamic range (HDR) CMOS image sensor that is purpose-built for industrial ma
    . . . Learn More
    Date:
    10/05/2026
    Wärtsilä and RCT Solutions Launch Valo, a New Energy Storage Integrator with 20 GWh on Day One

    Dr. Luke Witmer, Chief Technology Officer of Valo

    Wärtsilä and RCT Solutions Launch Valo, a New Energy Storage Integrator with 20 GWh on Day One
    ­Technology group Wärtsilä and RCT Solutions GmbH today launched Valo, a global battery energy storage system integrator designed to help customers navigate the growing complexity of delivering utility-scale energy storage projects.   Energy storage projects are getting bigger, but scale is only p
    . . . Learn More
    Date:
    10/01/2026
    Archive

    TDK Presents DC-link Capacitors Rated for up to +135°C in Automotive and Industrial Applications

    Sep 30,2026

    Movandi Redefines Synthesizer PLL Efficiency, Delivering Peak Performance at Lower Power for Next-Gen Wireless and AI Infrastructure

    Aug 28,2026

    Renesas Gen 3 MRDIMM Chipset Solutions Advance DDR5 Memory Performance to 16,000 MT/s for Next-Gen AI and HPC Applications

    Jul 30,2026

    KYOCERA AVX Releases new Web-Based Antenna Integration Tool

    Jun 29,2026

     

     

     

     

     Home | Site Map | Privacy Policy | Refund Policy | Terms of Service | Copyright © 2026 Power Systems Design, All rights reserved 

    Power Systems Design

    146 Charles Street
    Annapolis, Maryland 21401 USA

    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.

    Links

    Contact PSD

    Copyright © 2026 Power Systems Design, All rights reserved