Technical Features

Current

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Figure 1: Infineon’s four-step qualification plan for CoolGaN™ devices

Developing a New Approach to Predicting the Behavior of GaN Devices

Oliver Haeberlen, Fellow Power Semiconductor Devices & Technologies, and Tim McDonald, Senior Consulting Advisor to the CoolGaN™ Development Program, both at Infineon Technologies

Introduction Silicon semiconductor technology has evolved considerably over the past 50 years, during which time, multiple failure modes affecting device reliability have been discovered, researched, and addressed. This has led to the development of models and equations for failure modes like time-de

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Date:

02/24/2023

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Figure 1: Comparative wire-overhead analysis for key protocol messages

The Importance of Being Direct and Concise in Communication Protocols

Angelo Corsaro, PhD, CEO/CTO, ZettaScale Technology

When it comes to communication protocols, it is far more important to focus on conciseness and directness — as anything that is not strictly necessary to convey information is just a waste of time and energy. In other terms, if we think in terms of information theory when communicating, then we w

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Date:

03/01/2023

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Figure 1: As more renewable energy sources have been added to the grid, it has been become largely de-centralized where power comes from a variety of local sources

Meeting Narrow-band Power Line Communication Requirements in Smart Grid Infrastructure Designs

Cathal Sheehan, Senior Technical Magnetics Marketing Manager at Bourns

Today’s smart energy grids must be able to access real-time data collection through sophisticated communication, monitoring and control capabilities giving operators the ability to manage increasingly decentralized power generation and remedy any outage situations. Adding renewables and energy storage to th

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Date:

03/01/2023

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Figure 1a

Pushing the Power Density Envelope in DC/DC Conversion

Antonello Laneve, Dr. Roberto Rizzolatti, Christian Rainer, Dr. Mario Ursino, Dr. Diogo Varajao all at Infineon Technologies

One of the biggest challenges in enabling Artificial Intelligence (AI) computing is the increase of processing power in a fixed converter footprint. As a consequence, such intense power demands are shifting rack power levels above the 30-kW range. The “Open Compute Project” (OCP) attempts to address these ch

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Date:

03/01/2023

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Figure 1: Multi-function laser / IPL systems have complex power needs

Innovations in Laser Power Solutions for Medical Applications

Dermot Flynn, Director, Strategic Marketing, Medical – Advanced Energy Industries, Inc.

According to a report by Straits Research, the market for aesthetic lasers and energy devices was valued at USD 4.46 billion in 2021, with a projection that it will exceed USD 10 billion by 2030 – a growth of over 10% PA. Developments in the laser technology have created new laser-based treatments such as r

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Date:

03/01/2023

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Figure 1: A diagram of the circuit showing the distributed I/O to place accelerometers and full bridge strain gauges terminated close to the measurement locations

EtherCAT Measurement Terminals in Wind Farm Monitoring

Pulse Technical Team

The UK aims to build enough wind farms to power every household by 2030. The potential of wind power was demonstrated by a recent record, when on a single day in January wind farms produced 19,835 megawatts, which is enough to cover more than half of England’s electricity needs. The increased investment in

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Date:

03/01/2023

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Figure 1: Simplified schematic diagram of the bi-directional converter

GaN-Based Design of a 2 kW 48 V/12 V Bi-Directional Power Module for 48 V Mild Hybrid Electric Vehicles

Michael de Rooij, EPC

The hybrid vehicle market has more than doubled from 2017 from 2.0% to 5.1% and by 2025, one of every 10 vehicles sold worldwide is projected to be a 48 V mild hybrid. 48 V systems boost fuel efficiency, deliver four times the power without increasing engine size, and reduce carbon-dioxide emissions without in

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Date:

03/01/2023

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Figure 1: The loop from switch to DC link capacitor can be long and have significant inductance

PCB Design Considerations with SiC FETs

Mike Zhu, application engineer at Qorvo

Optimising PCB layout in a power converter design is a complex task at the best of times, but there can be extra challenges when you have to allow for the ultra-fast voltage and current edge rates seen with wide band-gap devices such as a SiC FET, a normally-off, cascode combination of a SiC JFET and Si-MOSFET. Th

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Date:

03/01/2023

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Figure 1: SiC devices offer superior properties to legacy silicon, including higher efficiency, faster switching speeds, and exceptional thermal dissipation

SiC Delivers Next-Generation Efficiency and Sustainability

Llew Vaughan-Edmunds, Senior Director Marketing, Navitas Semiconductor

Silicon carbide (SiC) is a critically important technology as high-power, high-speed applications test the limits of conventional silicon. Next-generation systems not only continue to push the boundaries of performance and capability, but also disrupt and replace systems that burn fossil fuels (e.g. transportation, el

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Date:

03/01/2023