Technical Features
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Figure 1. Infineon StrongIRFET™ and OptiMOS™ power MOSFET 20-300 V technologies
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Figure 1: Unipolar RDS∙A versus breakdown voltage data by technology (room temperature)
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Figure 1. Intelligent Rack PDUs for Powering, Monitoring, and Managing Critical Infrastructure
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Figure 1: An electrolytic capacitor essentially consists of an anode and cathode film, separator paper, and electrolytes
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Figure 1: 1200A MPE HEMP Filter
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Figure 1. Power delivery and power efficiency has become the largest concern in large scale computing systems. The industry has witnessed a dramatic increase in power consumed by processors with the advent of ASICs and GPUs processing complex AI functions. Rack power has also subsequently increased with AI capability being utilized in large scale learning and inferencing application deployments. In most cases, power delivery is now the limiting factor in computing performance as new CPUs look to consume ever increasing currents. Power delivery entails not just the distribution of power but also the efficiency, size, cost and thermal performance
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Figure 1: Data center energy use has stayed flat even with exponential traffic increase. Source: IEA
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Figure 1: The evolution of process technologies improves upon the trench gate structure for a lowered on-resistance per unit area
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Figure 1. Precision high-side current sense circuit based on the LTC2063 zero-drift amplifier
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Figure 1: The block diagram of the MDC901 GaN gate driver
