Technical Features

February 2019

Figure 1: Power schematic circuit for the bi-directional three-level, two-phase converter

Optimizing Flying Capacitor Multilevel Converters for GaN Technology

Alejandro Pozo Arribas, Senior Applications Engineer, Efficient Power Conversion (EPC)

Introduction Modern power systems demand higher efficiency, increased power density, and reduced electromagnetic interference (EMI)—all while adhering to shrinking size constraints. Among the converter topologies addressing these challenges, the Flying Capacitor Multilevel (FCML) converter stands out for it

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Date:

05/30/2025

The Power and Evolution of GaN – Part 6

Alex Lidow, CEO and Co-founder of EPC

Slightly more than forty years ago, the silicon power MOSFET was a disruptive technology that displaced the bipolar transistor as the power conversion device of choice for the semiconductor industry – and a $12B market emerged. Click image to enlarge GaN Cube The dynamics of this transition taught us that there a

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Date:

02/24/2019