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    Technical Features

    May 2024
    Transformer Design Comparisons for Mitigating EMI in Gate Driver Circuits

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    Figure 1: Gate driver circuit diagram with a Bourns transformer

    Transformer Design Comparisons for Mitigating EMI in Gate Driver Circuits
    Matthew Russell, Master’s student at University College Cork, and a student engineer at Bourns Electronics Ireland

    While gate driver-based converters deliver improved efficiency, speed and signal integrity, their high frequency switching features can produce elevated levels of conducted electromagnetic interference (EMI), posing challenges to electromagnetic compatibility (EMC) and overall system reliability. To solve this
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    Date:
    03/29/2026
    Qorvo Hard-Wires Safety Features into Motor Controllers for 44V-72V Power Tools and Appliances

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    Figure 1: PAC52711

    Qorvo Hard-Wires Safety Features into Motor Controllers for 44V-72V Power Tools and Appliances
    By: José Quiñones, Staff Applications Engineer, Qorvo

    Introduction We're all familiar with the pervasive hum of gas-powered gardening equipment in the spring, summer and fall, from hedge trimmers, leaf blowers, chainsaws, and jack hammers, not to mention the droning of snowblowers in the winter. While gas-powered tools have long been a staple for outdoor mainte
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    Date:
    05/31/2024
    New Power Supply Concepts Needed for Intelligent Edge Sensors

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    Figure 1: SPoE supplies up to 52W via a single 2-wire cable up to 1km in length

    New Power Supply Concepts Needed for Intelligent Edge Sensors
    Frederik Dostal, Power Management Expert, Analog Devices

    ­A smart sensor is created by adding a microcontroller to the sensor. However, this unit has higher current consumption, so new concepts for supplying the higher current are required. This is especially true for existing industrial plants and infrastructure. The solutions should provide easy and secure means of
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    Date:
    05/01/2024
    How the IIoT is Changing the Face of Manufacturing

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    Figure 1: Nordic’s nRF9160 SiP is the lowest power complete cellular IoT solution on the market – extending battery life

    How the IIoT is Changing the Face of Manufacturing
    Lorenzo Amicucci, Business Development Manager, Nordic Semiconductor

    ­Digital computers first disrupted factory automation in the late 1960s. The machines ushered an era of computer aided design (CAD), consistent manufacture of complex components, greater automation using programmable logic controllers (PLCs), and higher productivity. The period was considered the third generation of
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    Date:
    05/01/2024
    Circuit Simulation Shapes Up for Energy-Conscious Design

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    Figure 1: Improved I-V curves

    Circuit Simulation Shapes Up for Energy-Conscious Design
    Jeff Strang, GM Power Management, and Surinder P. Singh, Sr. Manager, Customer Design Tools, Qorvo, Inc.

    ­SPICE (Simulation Program with Integrated Circuit Emphasis) was created at Berkeley in 1970 and has become the reference for integrated circuit simulators, receiving an IEEE Milestone in Electrical Engineering and Computing award in 2011. The ability to model components and simulate their behavior has empowered ge
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    Date:
    05/01/2024
    GenAI – Helping to Tame the Most Power-Intensive Computing Application on Earth

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    Figure 1: GenAI training GPU-based processor chiplet complex with high-bandwidth memories (HBMs) mounted on an accelerator module (AM)

    GenAI – Helping to Tame the Most Power-Intensive Computing Application on Earth
    Maury Wood, VP Strategic Marketing, Vicor

    ­Training generative AI (genAI) neural network models typically take months, with thousands of multi-billion-transistor GPU-based processors, high-bandwidth SDRAMs, and terabit per second optical network switches operating simultaneously and continuously. While genAI holds the promise of increasing human productivity, it
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    Date:
    05/01/2024
    Galvanic Isolation Keeps Pace with Control Requirements

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    Figure 1: Isolation locations in a PLC

    Galvanic Isolation Keeps Pace with Control Requirements
    Joachim Hausmann, Toshiba Electronics Europe GmbH

    ­There are two distinct trends in the design of the electronic systems that support motors. On one side are power generation and electrical distribution subsystems that operate at voltages that are moving toward the kilovolt regime. On the other are high-speed MCUs that enable advanced algorithms to optimise sy
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    Date:
    05/01/2024
    Improving Residential Solar System Designs

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    Figure 1: Residential Solar Inverter System Block Diagram

    Improving Residential Solar System Designs
    Kane Jia, Application Marketing Engineer, onsemi

    ­The deployment of residential solar systems, which is expected to proliferate over the next five years, will provide many benefits to users, including providing a reliable, clean, green energy source to power home appliances, charge electric vehicles and transfer power back to the grid. This article provides an
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    Date:
    05/01/2024
    How to Extend Data and Power over Extended Distances

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    Figure 1: Illustration of FMP System

    How to Extend Data and Power over Extended Distances
    Tom Valentine, VP Sales & Marketing, Remee Wire & Cable

    ­Class 1, 2, and 3 circuits are classified as remote-control, signaling, and power-limited circuits in the National Electrical Code (NEC). The NEC defines such circuits as that portion of the wiring system between the load side of the overcurrent protection device (OCPD) or the power-limited supply and all co
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    Date:
    05/01/2024
    Power Modules: One Shortcut to EMI Compliance

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    Figure 1: Notional spectra for a square, trapezoidal, and triangular signal

    Power Modules: One Shortcut to EMI Compliance
    Brian DeBoi, Module Applications Engineer, Wolfspeed

    ­Electronic devices that are in proximity or share common conductors are susceptible to electromagnetic interference (EMI) that can disrupt their operation. Minimizing emissions is necessary to ensure that electrical systems do not interfere with each other’s normal operation when placed in the same environment. Po
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    Date:
    05/01/2024
    Archive

    Transformer Design Comparisons for Mitigating EMI in Gate Driver Circuits

    Mar 29,2026
    Matthew Russell, Master’s student at University College Cork, and a student engineer at Bourns Electronics Ireland

    Smart Consideration of Inductor Thermal Performance for DC-DC Converter Performance and Reliability

    Feb 28,2026
    Len Crane, Director of Technical Marketing

    1250 V/1700 V GaN HEMTs for NVIDIA 800 VDC Architecture

    Jan 31,2026
    Kamal Varadarajan & Chris Lee, Power Integrations

    Future-Proof Automotive High-Voltage-to-SELV Conversion

    Dec 30,2025
    Greg Green, Director of Automotive Marketing, Vicor

     

     

     

     

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