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Technical Features

August 2013
Solar Inverter Design

Figure 1: Replacing a SJ with a SiC MOSFET, switching loss decreases significantly

Due to the ever-increasing demand for a clean and renewable source of energy, installing solar systems has accelerated significantly in the last decade. Contemporary solar applications require very highly efficient, power-dense and lightweight grid-tied inverters. Traditionally, IGBT has been the device of
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Date:
05/03/2020
Urban Legends about Thermal Interface Materials

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Figure 1: Simplified thermal model using datasheet values. The thermal interface material is hidden inside the yellow area

Proper thermal design in power electronics is the necessary fundamental to ensure that the final application will operate throughout the predicted lifetime. Thus, it remains a key element in the design
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Date:
08/22/2013
Transient thermal resistance (Zth) of power modules determined by simulation and measurement.

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Fig. 1. Comparison of measurement with FEM-Simulation and calculation results

The transient thermal resistance (Zth) of a power module describes a key performance that is used to estimate the maximum output current for transient loads. It can also be used to calculate the temperature
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Date:
08/16/2013
High-accuracy current measurement in automotive applications

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Figure 1: Transducer accuracy

The automotive industry has been undergoing a major transformation during the past few years. After more than a century of improving and refining the traditional gasoline and diesel engines that
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Date:
08/13/2013

Considering high-voltage GaN Cascodes

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Figure 1

Price, performance and availability will be the obvious primary determinants of the initial sales growth of GaN transistors and diodes. Product acceptance also hinges upon the additional factors
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Date:
08/06/2013
In any operating system, distribution losses are a significant factor in overall system efficiency at every level. In the case of telecom central office applications, traditional 48Vdc systems become very expensive to install (due to increased copper cost and weight) and run (due to I2R loss) while in large da
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Date:
08/01/2013