Technical Features

March 2011
High-Density Power Modules Boost Performance for a New Generation of Mobile Robots

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Figure 1: Dusty eliminates the conventional, labor-intensive process of physically transferring building plans onto the floor with a robot programmed at the job site to automate the same task.

­Innovations in power conversion technology are enabling a transformation in robotics design. Today’s integrated power modules address the demanding size, weight, power budgets and cost efficiencies required to move robots from factory, residential and commercial applications into a vast new landscape bounded onl
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Date:
11/01/2022
PV Off-the-Roll

Photo by Solarion AG

Thin-film solar cells are developing into a rapidly growing market segment. If their commercial potential is to be fully exploited, the solar modules must be produced in a roll-to-roll manufacturing
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Date:
03/24/2011
Grounding Transformers

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Figure 1 - Typical wind farm configuration

The grounding transformer is an often neglected component of the wind farm - shunted off to a sidebar issue. However, those who neglect to adequately plan for grounding transformers do so at their
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Date:
03/24/2011
Surge Current Limitations

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Figure 1: I-V characteristics of 10ms half sine pulses at different peak currents. Curve (c) is slightly above, curve (d) is far above the destruction threshold.

The ability of silicon power diodes to withstand a rapid forward current load, described by its i2t-value, is an important criterion that has to be regarded in the selection of the proper devices
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Date:
03/24/2011
Effective Contact

ITT Interconnect Solutions' EVC series connectors

This advanced charging in electric vehicles (EV) requires highly efficient power contacts to provide flexible functionality, with minimal modifications, across a power range from a low of 15 amps/120
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Date:
03/24/2011
An engineer designing with FPGAs or Processors often has to provide some serious amount of power at high efficiency over load. Not only must the rails be regulated correctly and not overheat, but additional functionality may be required. Recent evaluation boards from Xilinx (ML605 and SP605) for Virtex-6 and Spart
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Date:
03/15/2011
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