Figure 1: Detailed block diagram of service robots
Pablo Yelamos Ruiz, Applications Engineer, Infineon Technologies AG
People have been infatuated with controllable machines for a very long time. Today robots are in our immediate surroundings, leaning away from industry-based usage and shifting the focus toward becoming our everyday helpers. With the commercialization of robots, modern engineering designs stress how important
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Figure 1: I-V characteristics of 10ms half sine pulses at different peak currents. Curve (c) is slightly above, curve (d) is far above the destruction threshold.
Thomas Hunger, Oliver Schilling, Frank Wolter, Thomas Schütze Infineon Technologies AG Warstein, Germany
The ability of silicon power diodes to withstand a rapid forward current load, described by its i2t-value, is an important criterion that has to be regarded in the selection of the proper devices
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Figure 1 - Typical wind farm configuration
Curt Collins, Director of Sales, Pacific Crest Transformers Medford, Oregon
The grounding transformer is an often neglected component of the wind farm - shunted off to a sidebar issue. However, those who neglect to adequately plan for grounding transformers do so at their
Dr. Florian Schwager, Product Manager, Solar Barrier Films, Performance Polymers, Evonik
Thin-film solar cells are developing into a rapidly growing market segment. If their commercial potential is to be fully exploited, the solar modules must be produced in a roll-to-roll manufacturing
ITT Interconnect Solutions' EVC series connectors
Ted Worroll, Product Manager, ITT Interconnect Solutions
This advanced charging in electric vehicles (EV) requires highly efficient power contacts to provide flexible functionality, with minimal modifications, across a power range from a low of 15 amps/120
Dan Tooth PhD, Field Applications Engineer, Texas Instruments
An engineer designing with FPGAs or Processors often has to provide some serious amount of power at high efficiency over load. Not only must the rails be regulated correctly and not overheat, but additional functionality may be required.
Recent evaluation boards from Xilinx (ML605 and SP605) for Virtex-6
