Technical Features
March 2011
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Figure 1: Infineon’s four-step qualification plan for CoolGaN™ devices
Introduction
Silicon semiconductor technology has evolved considerably over the past 50 years, during which time, multiple failure modes affecting device reliability have been discovered, researched, and addressed.
This has led to the development of models and equations for failure modes like time-de
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Date:
02/24/2023
Photo by Solarion AG
Thin-film solar cells are developing into a rapidly growing market segment. If their commercial potential is to be fully exploited, the solar modules must be produced in a roll-to-roll manufacturing
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Date:
03/24/2011
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Figure 1 - Typical wind farm configuration
The grounding transformer is an often neglected component of the wind farm - shunted off to a sidebar issue. However, those who neglect to adequately plan for grounding transformers do so at their
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Date:
03/24/2011
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Figure 1: I-V characteristics of 10ms half sine pulses at different peak currents. Curve (c) is slightly above, curve (d) is far above the destruction threshold.
The ability of silicon power diodes to withstand a rapid forward current load, described by its i2t-value, is an important criterion that has to be regarded in the selection of the proper devices
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Date:
03/24/2011
ITT Interconnect Solutions' EVC series connectors
This advanced charging in electric vehicles (EV) requires highly efficient power contacts to provide flexible functionality, with minimal modifications, across a power range from a low of 15 amps/120
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Date:
03/24/2011
An engineer designing with FPGAs or Processors often has to provide some serious amount of power at high efficiency over load. Not only must the rails be regulated correctly and not overheat, but additional functionality may be required.
Recent evaluation boards from Xilinx (ML605 and SP605) for Virtex-6 and Spart
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Date:
03/15/2011
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