Power Systems Design (PSD) Information to Power Your Designs

New ATS Heat Sinks Designed for NVIDIA Jetson Thor Modules

Advanced Thermal Solutions, Inc. (ATS) has introduced a line of high-performance heat sinks engineered for NVIDIA Jetson Thor modules, providing robust thermal management for next-generation edge computing, physical AI, and robotics platforms. The new heat sinks include active and passive cooling options, gi

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Date:

12/17/2025

AI data center (Source: Canva)

97% of Companies Fail to Measure AI’s Environmental Impact, New Analysis Shows, but Energy Experts Say Optimization-Focused AI Can Solve It

The Thomson Reuters Foundation has published the first findings from its AI Company Data Initiative (AICDI), analysing AI governance disclosures from 1,000 companies across 13 sectors. Developed with UNESCO, it is currently the world’s largest dataset on how firms describe and oversee their use of artificial intelligence. The results reveal a wide gap between AI adoption and its governance – companies are deploying AI far faster than they are managing its risk

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Date:

12/12/2025

Flex Power Modules Extends Manufacturing to Europe in Support of Growing AI Demand

Flex Power Modules has extended its manufacturing to Europe with new production based at the Flex facility in Althofen, Austria. This move boosts the company’s power module capacity, enabling Flex Power Modules to respond faster and more efficiently to rapidly growing demand from AI data center customers. This expansion

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Date:

12/11/2025

EMASS and Semtech Collaborate on Low-Power Edge AI

EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced a strategic collaboration with Semtech to bring low-power edge AI solutions integrated with LoRaWAN® connectivity to market. EMASS’s ECS-DoT AI-enabled system-on-chips (SoCs) integrate Semtech’s LoRa® tr

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Date:

12/09/2025

Spacechips Drives Imaginative new AI-Enabled Satellite Applications

The demand for smaller satellites, with sophisticated computational capabilities and reliable and robust onboard processor systems to support the five to ten-year duration of a mission, is pushing the limits of the latest ultra‑deep‑submicron FPGAs and ASICs and their power delivery networks. These high-performance pr

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Date:

12/09/2025

Navitas, Cyient Semiconductors Enter into a Strategic Partnership to Accelerate GaN Adoption in India’s AI, Mobility, Industrial, and Energy Markets

Navitas Semiconductor Corporation, the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors and Cyient Semiconductors Private Limited, a fast-growing provider of ASIC, ASSP and power solutions provider have announced a st

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Date:

12/08/2025

Ivo Ivanov, CEO of DE-CIX

AI in Space: Why Tomorrow’s Networks Will Need an Interconnected Orbit

Ivo Ivanov, CEO of DE-CIX

AI’s growth is pushing the boundaries of what our digital infrastructure can support. In many places, the power required to train and run models is already outpacing the speed at which new energy capacity can be deployed, and the physical limits of terrestrial grids are beginning to shape the debate about wh

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Date:

12/04/2025

Tria Technologies to Bring Qualcomm Dragonwing IQ-6 Series to Market with Two New Compute Modules

Tria Technologies, an Avnet company specializing in the manufacturing of embedded compute boards, has introduced the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ-615 modules, marking commercial availability of computer-on-module (COM) worldwide featuring a Qualcomm Dragonwing™ IQ-615 processor. The modules provide AI

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Date:

12/03/2025

Eric Pittana, Senior Director of Global Marketing and EMEA Sales, Empower Semiconductor

Bringing Power Directly to the AI Processor

Ally Winning, European Editor, PSD

This column has focused many times on the upcoming challenges for data centres, whether that is meeting the data centre’s needs for power in the first instance, or for taking that power and converting it to feed the computing racks, but those two issues are not the only ones – taking the power supplied to

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Date:

12/03/2025

Alpha and Omega Semiconductor Enables 48V Hot Swap in AI Servers with New High SOA MOSFET in LFPAK 8x8

Alpha and Omega Semiconductor Limited (AOS) announced its AOLV66935 a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8x8 package. AOS’ latest MOSFET is designed as an ideal solution for 48V Hot Swap architectures in AI servers. The power demands of AI servers are intensifying, primarily driven by

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Date:

12/02/2025

Jason Lomberg, North American Editor, PSD

What I’m Thankful For

Jason Lomberg, North American Editor, PSD

Welcome to the December issue! And since we just passed Thanksgiving (hope you didn’t move up too many belt loops!) and we’ve entered the season of giving, I thought it was prudent to list all the things I’m thankful for this year. Strap in – it’s about to get sappy in here. In no particular order:

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Date:

12/01/2025

Click image to enlarge

Figure 1. MicroPOL cross section and SeSUB

Power Density without Compromise: Designing for Next-Generation FPGAs and SoCs

Tony (Anthony) Ochoa, TDK Director of Marketing - POL Power Group

Every leap in compute capability, from advanced FPGAs and SoCs to custom ASICs and AI accelerators, comes with steeper demands on power delivery. The challenge is no longer just supplying enough watts. It is doing so within shrinking board space, while maintaining efficiency, reliability, and manageable design

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Date:

12/01/2025

Jason Lomberg, North American Editor, PSD

Does the “Uncanny Valley” Hide the True Danger of Generative AI?

Jason Lomberg, North America Editor, PSD

For more than half a century, techies have tussled with the so-called “uncanny valley”, and AI has only exacerbated the issue. But is that really the scariest part of generative AI? Are we downplaying a far more serious danger? OpenAI recently released their Sora 2 AI video creation model with the go

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Date:

12/01/2025

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