Powering AI
Current
High-Power, High-Efficiency Eighth-Brick IBC Optimized for AI demands
Flex Power Modules has introduced the BMR353, a next-generation high-power DC/DC intermediate bus converter (IBC) engineered for the demanding power requirements of AI data centers.
The non-isolated eighth-brick IBC delivers a fully regulated 12.2 V output from a 40-60 V input, providing 860 W of continuous
. . . Learn More
Date:
07/09/2026
Grid Stability Analytics AI Market To Reach USD 9.7 billion by 2033
According to our latest research, the global Grid Stability Analytics AI market sizein 2024 stands at USD 2.15 billion, reflecting robust investments in grid modernization and digital transformation. The market is expected to expand at a CAGR of 17.2% from 2025 to 2033, reaching a projected value of USD 9.
. . . Learn More
Date:
07/09/2026
Melexis Expands Groundbreaking Triphibian Technology for Low-Pressure Applications
Melexis introduces new low-pressure variants across its Triphibian® pressure sensor family, supporting configurable pressure spans as low as 2 bar. Available for the MLX90830, MLX90833, and MLX90834, the new variants extend Triphibian technology, which uniquely measures both gas and liquid pressures, into th
. . . Learn More
Date:
07/09/2026
Alpha and Omega Semi Unveils AmpStack Packaging - A Leap Forward in MOSFET Power Density
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its AOPL66801 80V MOSFET in a half-bridge configuration available in a state-of-the-art DF
. . . Learn More
Date:
07/08/2026
Click image to enlarge
Figure 1: Data Center Power Distribution Architecture Evolution
The exponential growth of AI, high-performance computing (HPC), and cloud services is driving an unprecedented surge in data center power demands. Traditional 50V DC power distribution architectures, once sufficient for kilowatt-scale IT racks, are rapidly approaching physical and economic limits as AI workloads pu
. . . Learn More
Date:
07/01/2026
Click image to enlarge
Figure 1: a demonstration of how electrohydrodynamic (EHD) airflow is achieved
From smartphones and laptops to automotive infotainment and smart IoT devices, the direction of travel is consistent: more functionality, more performance, and more intelligence, delivered in smaller and thinner form factors. For design engineers, this creates a familiar but intensifying challenge, and with ea
. . . Learn More
Date:
07/01/2026
Archive
 - small.jpg)
