The Advanced Semiconductor Packaging Market (반도체 패키징 시장), valued at US$ 30.1 Bn in 2022, is poised for steady expansion. Projected to grow at a CAGR of 5.2% from 2023 to 2031, the market is expected to reach US$ 40.3 Bn by the end of 2031. This growth is fueled by
Infineon Technologies AG, a leader in power, automotive and IoT semiconductors, announced the formation of a new business unit to drive the company’s growth in the area of sensors by combining the existing Sensor and Radio Frequency (RF) businesses into one dedicated organization. The new business unit SURF (S
Telit Cinterion, an end-to-end IoT solutions enabler, receives approval for the ME310M1-W1 module by two major U.S. MNOs. The certifications enable IoT specialists and their customers to begin using the ME310M1-W1 immediately — not only in the United States but also worldwide — thanks to its comprehensive gl
