IoT & Smart Cities

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Morse Micro Announces Mass Production of MM8108 Wi-Fi HaLow SoC, Modules, Evaluation Kit and HaLowLink 2

Morse Micro, the world’s leading provider of Wi-Fi HaLow silicon solutions, today announced the mass production and general availability of its second-generation MM8108 System-on-Chip (SoC).This milestone represents a major leap-forward for Wi-Fi HaLow, bringing unparalleled data throughput at range, which wi

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Date:

09/23/2025

SEGGER Establishes Programming-Support Partnership with Winbond Electronics Corporation

Effective immediately, SEGGER programming support is available for selected SPI flash-memory devices from Winbond Electronics Corporation. SEGGER’s highly regarded J-Link and Flasher product lines are now fully compatible with Winbond's high-performance W25H, W25Q, and W25X SpiFlash® multi-input/-output (I/O)

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Date:

09/04/2025

Toshiba Launches 650V 3rd Generation SiC MOSFETs in Compact TOLL Package

Toshiba Electronics Europe GmbH (“Toshiba”) announces the release of three new 650V silicon carbide (SiC) MOSFETs, which incorporate its latest 3rd generation SiC MOSFET chips. The TW027U65C, TW048U65C, and TW083U65C are housed in a surface-mount TOLL package and are designed to reduce switching losses in

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Date:

09/02/2025