Internet of Things

Current
Current transducers with measuring range up to 450 Apk
The family consists of three new models: LZSR 100-P, LZSR 150-P and LZSR 200-P.   These new transducers
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Date:
05/22/2019
8 x 8mm LFPAK MOSFET family delivers up to 48x power density
LFPAK88 devices replace larger power packages such as D²PAK and D²PAK-7, and measuring 8 x 8mm offer a footprint reduction of 60 %, and a 64 % lower profile.  
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Date:
05/22/2019
UnitedSiC adds 7 SiC FETs to 650V product portfolio
These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power supplies, telecom rectifiers, and on-board chargers respectively.
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Date:
05/22/2019

New CoolSiC Schottky diode 1200 V G5 portfolio from Infineon
It can easily replace silicon diodes for higher efficiency. The expanded 8.7 mm creepage and clearance distances offer extra safety in high-pollution environments. Forward currents up to 40 A are available to address EV DC charging, solar energy systems,
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Date:
05/22/2019
Samtec’s mPOWER Ultra Micro Power Connectors Now at Mouser
Offering current ratings up to 21 A per blade in a 2 mm pitch, mPOWER connectors provide an ultra-small, high-power solution with exceptional design flexibility for power-only or power-and-signal applications.
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Date:
05/22/2019
Low profile 180W U-channel PSU for space-critical applications
The low-profile devices are just 1.16” high and occupy a small 4.3” x 2.5” footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection)
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Date:
05/22/2019
LTM2810 ÂμModule Isolators, Now Shipping from Mouser
Date:
05/22/2019
High Temperature Micro-D Series connectors available at TTI
Optimised to save space and weight in demanding applications, such as space vehicles, defence systems and oil exploration equipment, Micro Series Connectors are rugged and moisture-sealed. These data, power and signal interconnects combine versatility
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Date:
05/22/2019
High Power Factor LED Driver-Controller with Mixed-Mode Dimming
  The AL1665 is designed to drive an external MOSFET to control LED loads and maintain a high power factor. It provides a compact and efficient solution that helps minimize
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Date:
05/22/2019
Open Frame Power Supplies with UL8750 Safety Approval
    The LU225 family meets EN55015 (EN55032) Class B Conducted EMI, IEC61000-3-2 Class C (LED
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Date:
05/22/2019
Maximising Battery Life for IoT Devices on LPWANS

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IoT Connected Devices

It is generally agreed that the Internet of Things (IoT) has moved from the hype stage and is now about pragmatic adoption; a sentiment reflected by the fact that IoT has dropped from Gartner’s Hype Cycle for Emerging Technologies 2018 report, moving through its peak. It is now all about facilitating the interconnection
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Date:
05/07/2019
Are you SiC of Silicon? - Part 2

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Anup Bhalla, Vice President Engineering, UnitedSiC

State of SiC Device and Package Technology It has long been known that packaging technology is key to unleashing the potential of wide-bandgap (WBG) devices. Silicon Carbide device manufacturers have been making rapid improvements in device technology figures of merit such
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Date:
05/01/2019