Brighton: Advanced Material Development (AMD) has raised a total of £750,000 in funding, as the company launches its plan to exploit the commercial potential of applications for graphene and other 2D nanomaterials. The company will contribute £600,000 to fund several distinct research projects conducted by th
Los Angeles, CA – Symmetry Electronics announced the available distribution of DSP Group’s HDClear 3-Mic Development Kit for Amazon Alexa Voice Service (AVS). The HDClear 3-Mic Development Kit for Amazon AVS enables OEMs to integrate Amazon Alexa into a number of IoT products, including smart speakers, sma
FREMONT, Calif. – The OpenFog Consortium’s OpenFog Reference Architecture for fog computing has been adopted as an official standard by the IEEE Standards Association (IEEE-SA). The new standard, known as IEEE 1934, relies on the reference architecture as a universal technical framework that enables the da
CHANDLER, Ariz. — With the booming growth of Internet of Things (IoT) endpoints, security is sometimes an afterthought for many designers, increasing the risk of exposing intellectual property (IP) and sensitive information. To address the growing need for security, the new SAM L10 and SAM L11 MCU fami
MOUNTAIN VIEW, Calif., – CEVA, Inc. announced the successor to its popular CEVA-Dragonfly NB1 solution targeting the fast growing NB-IoT market. CEVA-Dragonfly NB2 is a highly-integrated and modular solution optimized for Cat-NB2 (3GPP Release 14 eNB-IoT) that can seamlessly be incorporated into ch
TDK Corporation announced that it has been selected as one of the 2017 Top 100 Global Innovators (http://top100innovators.clarivate.com/content/tdk) by Clarivate Analytics (formerly the Intellectual Property and Science business of Thomson Reuters). This is the fourth time TDK has been named to the prestigious lis
Global energy efficiency standards often prohibit manufacturers from importing or selling products that do not meet these standards. In order to comply with specific minimum requirements, energy losses have to be reduced by using the latest technology. Infineon Technologies now offers the IM512 and IM513 series of the CIP
Automotive designers can significantly lower EMI and increase efficiency with the pin-compatible MAX20073 and MAX20074 buck converters from Maxim Integrated Products, Inc. (NASDAQ: MXIM). The compact converters, which offer the industry’s lowest EMI performance for low-voltage point-of-load applications, are
KEMET has expanded its industry-leading X7R 250 volt multilayer ceramic capacitor series to include smaller case sizes and increased capacitance values. These compact surface mount technology footprints benefit designers in saving printed circuit board space while reaching capacitance values up to 0.47 mic
Infineon Technologies expands its product portfolio of the thin-wafer technology TRENCHSTOP™5 IGBT. The new product family is offering up to 40 A 650V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known as D2PAK. The new TRENCHSTOP 5 IGBT in D2PAK package serves the growing deman
Toshiba Electronics Europe will be providing details on its new packaging for its 4.5 kV class press-pack IEGT (PPI) devices at PCIM 2018 in Nürnberg. The new packaging has been developed to further improve the rupture resistance of the device, thereby reducing the likelihood of damage to surrounding componen
KEMET introduced its first 150°C Automotive KO-CAP capacitor. The T599 KO-CAP High Humidity/High Temperature Performance Polymer series delivers stability and endurance under harsh humidity and temperature conditions.
Building on the success of the T598 series, KEMET further refined the design, mate
Analog Devices announced its latest generation of reinforced isolated power converters, setting a new benchmark for low component-level radiated emissions allowing systems to meet EN 55022/CISPR 22 Class B Electromagnetic Interference (EMI) standard requirements. The ADuM5020/6020 and ADuM5028/6028 series eliminate the n
At this year’s PCIM Europe trade fair in Nuremberg Infineon Technologies presents the first products of its automotive Silicon Carbide portfolio: the CoolSiC Schottky diode family is now ready for current and future on-board charger (OBC) applications in hybrid and electric vehicles. Infineon has designed th
ON Semiconductor has announced a new range of ultra-low noise LDO regulators with the industry’s best power supply rejection ratio (PSRR), enabling better performance in noise sensitive analog designs. The new NCP16x series, along with the AEC-Q100 qualified NCV81x automotive variants, delivers improved performance in
Powerbox announces the introduction of its supercapacitor boost technology, S-CAP BOOST, offering backup and peak power solutions to industrial and medical applications. Based on the latest supercapacitor technology combined with intelligent control and monitoring, S-CAP BOOST offers a solution to equipment manuf
Rigol Technologies EU GmbH introduces four new high-end oscilloscopes with a large 10,1“ touch-color display.
The MSO/DS7000 is a versatile mixed-signal high-performance oscilloscope that incorporates many of the latest Rigol own designed ChipSet ASIC technology and integrated processes. With b
TDK Corporation is expanding its portfolio of TMR angle sensors with the TAD2140 type in a TO-6 package for automotive and industrial applications. The new sensor provides an innovative system-in-package solution for PCB-less applications. It includes two full TMR bridges, a dedicated ASIC for signal conditionin
Ultra fast acquisition rate of one million waveforms per second, realtime compensation of transmission losses (deembedding) between the signal source and oscilloscope, and silent operation even at full load – these are just some of the benefits of the high-performance R&S RTP oscilloscope family.
Würth Elektronik eiSos expands its product family of MagI³C power modules with the compact MagI³C VDRM (Variable Step Down Regulator Module) in a LGA-16EP package. The module has an input voltage range of 4 to 18 V for converting voltages from the 5 V, 9 V or 12 V bus. The very compact component (9 x 9
IQD Frequency Products are pleased to announce that they have signed a global distribution agreement with Digi-Key Electronics, one of the world’s leading distributors of electronic components. Through this agreement, Digi-Key will distribute IQD’s frequency products worldwide. The IQD product line, availa
HARTING has developed a range of miniaturised power interfaces with integrated electro-optical conversion, enabling customers to save time and money by combining electrical connectivity and optical transmission in the same module.
The new interfaces are designed for use with powerful electric drives controlle
Nexperia, today announced that two of its LFPAK56-packaged portfolio of MOSFETs are now available with improved creepage and clearance to meet UL2595 requirements for battery-powered equipment rated between 15 and 32 V. Devices are 100% compatible with the industry-standard Power-SO8 footprint; no other compact, surface-m
Hoffman Estates, IL. – Industrial automation solutions provider Omron Automation Americas recently announced the 2017 fiscal year’s winners of the prestigious Distributor of the Year award at its FY18 Sales Conference during the week of May 21st. Over 650 persons representing Omron and its channel pa
FOUNTAIN INN, S.C. – AVX Corporation has joined the Electronics Representatives Association (ERA) as a manufacturer member.
“AVX is proud to become a member of the ERA,” said Alex Schenkel, vice president of global sales, AVX. “The ERA is one of the most respected international trade organizations in the gl
As the roll out of billions of sensors and wireless nodes in the Internet of Things (IoT) progresses, more attention is being paid to the battery technology that powers them. At the same time developers of electric cars are also looking for better battery solutions.
Regularly changing the batteries of a bill
In some ways digital designers have it easier than their analogue and mixed signal compatriots. They have many more tools at their disposal to verify and validate designs before they go to fabrication, which can bring a reasonable measure of assurance that they have their design right, as well as tools that ca
Earlier this year, President Trump’s budget proposal toyed with the notion of draconian cuts to renewable energy subsidies and R&D. And while the $1.3 trillion spending bill ultimately passed without the proposed reductions, the episode reignited the energy subsidy debate. To wit – yay or nay?
On the one h
KYOTO, Japan and OTTAWA, Canada – ROHM and GaN Systems announced their collaboration in the GaN (gallium nitride) Power Semiconductor business, with the goal of contributing to the continuing evolution of power electronics.
This strategic partnership leverages GaN Systems’ industry leading capabilit
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