Military, Aerospace & Hi-Rel
Current
MIT and the U.S. Air Force have signed an agreement to launch a new program designed to make fundamental advances in artificial intelligence that could improve Air Force operations while also addressing broader societal needs.
The effort, known as the MIT-Air Force AI Accelerator, will leverage the
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Date:
05/20/2019
Tampa, FL – Saft has recently launched a new product in the Xcelion line, the Xcelion 56V lithium-ion (Li-ion) battery, offering customers a variant on the proven technology behind the Xcelion 6T for applications requiring higher voltage.
As the third Xcelion product, the Xcelion
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Date:
05/20/2019
CLEVELAND, Ohio. – Laird Performance Materials has developed Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components while also yielding
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Date:
05/09/2019
WASHINGTON -- VPT, Inc. released its SGRB Series of space qualified DC-DC converters at the Satellite 2019 Show. Using advanced GaN technology, the SGRB is capable of very high efficiency, up to 95%, as well as radiation tolerance. A fixed-frequency reduced voltage switching topology results in very low
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Date:
05/06/2019
CHANDLER, Ariz. — Demand is growing for SiC power products that improve system efficiency, robustness and power density in automotive, industrial and aerospace and defense applications. Microchip Technology Inc., via its Microsemi subsidiary, announced the production release of a family of SiC power devices
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Date:
05/03/2019
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Anup Bhalla, Vice President Engineering, UnitedSiC
State of SiC Device and Package Technology
It has long been known that packaging technology is key to unleashing the potential of wide-bandgap (WBG) devices. Silicon Carbide device manufacturers have been making rapid improvements in device technology figures of merit such
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Date:
05/01/2019
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