Military, Aerospace & Hi-Rel

June 2021
A JEDEC Qualification for Rad-Tolerant FPGA in a Plastic Package
Developers of small-satellite constellations and other systems used in new spacemissions must deliver both high reliability and radiation protection while meeting stringent cost and scheduling requirements. Microchip Technology Inc. has now given them a faster, more economical production path with t
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Date:
06/29/2021

6-DoF XYZ-axis MEMS-Based Sensor for Industrial Applications
Murata has announced the availability of its 6-Degrees of Freedom (DoF) MEMS-based XYZ-axis inertial sensor for high-precision machine control and Global Navigation Satellite System (GNSS) positioning. The SCHA63T series features a digital SPI interface to enable engineers to develop industrial equipment wi
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Date:
06/16/2021
Tantalum Nitride Chip Resistors Add 10 ppm/ºC TCR Capability
Stackpole's AEC qualified RTAN series utilizes tantalum nitride technology to provide moisture proof precision chip resistor performance. The RTAN film passes biased humidity testing at 85ºC, 85% relative humidity, and 10% bias with very little shift in resistance.   The materials and design are
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Date:
06/15/2021
Digital Differential Measuring Systems for Broad Applications
The Measuring Division of Kaman Precision Products, Inc., announces that the KD-5600 family of eddy current measurement systems is ideal for use in COTS applications for fast steering mirrors, magnetic bearing active control, shaft vibration, image stabilization, and adaptive optics.   Customers in the s
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Date:
06/14/2021
Rad-Hard eGaN Transistors and ICs for Space Applications
EPC announces the introduction of a new family of radiation-hardened gallium nitride transistors and integrated circuits. With higher breakdown strength, faster switching speed, higher thermal conductivity and lower on-resistance, power devices based on GaN significantly outperform silicon-based devices. Th
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Date:
06/08/2021
PSDcast – Mentoring the Next Generation of Female Engineers

Engineer, entrepreneur, teacher, and U.S. Navy Captain Jenn Donahue

Whenever possible, we like to discuss the gender gap in STEM and engineering on this show and hash out possible solutions. The male-to-female ratio for engineering degrees is still about 4 to 1, but the real problem is that about 40% of women who earn engineering degrees either leave the profession or never en
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Date:
06/07/2021
UnitedSiC announces six new D2PAK-7L SiC FETs
Available in 30, 40, 80 and 150mΩ versions, these latest SiC FETs represent another step forward in accelerating migration to SiC across applications such as server and telecom power supplies, industrial battery chargers and power supplies, EV on-board chargers and DC-DC converters.   The D2PAK-7
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Date:
06/04/2021
Rugged Nicomatic EMM Series rectangular connectors
The connectors reduce space and weight in the most extreme environments, including defence, space, motorsport, civil aviation, UAVs and robotics. The 1.27mm pitch EMM interconnects effect a 40% space reduction over their parent CMM Series and a 20% space saving when compared to standard Micro D connectors. A recen
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Date:
06/04/2021
Aspiring Drone Pilots Can Now Train Remotely at Embry-Riddle
Embry-Riddle Aeronautical University’s Worldwide Campus recently received a first-of-its-kind waiver from the Federal Aviation Administration (FAA) that will allow students to remotely pilot unmanned aerial systems (UAS), or drones, through online video platforms like Zoom.  “This is a big deal,”
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Date:
06/04/2021
IP67-Rated USB Type-A Cable Assemblies
Stewart Connector, a Bel group company, announces a new line of IP67 rated USB Type-A Cable Assemblies. Designed for use in IoT applications where reliability and functionality are necessary and USB connections are needed outside of typical office applications, these cable assemblies can be used in multiple ap
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Date:
06/04/2021
TTI Stocks Molex's OTS Expresslink 2.0 Pico-Clasp Assemblies
TTI, Inc., announces the availability of the full range of Molex Expresslink 2.0 Pico-Clasp Assemblies from stock at TTI. Molex’s Expresslink 2.0 Data Cables reach speeds of up to USB 2.0, to integrate a variety of different Molex connectors and are available for small passable footprints and optimized performance. Th
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Date:
06/04/2021
Low RDS(on) 40 V MOSFETs deliver highest power density
The MOSFETs are intended for automotive (BUK7S0R5-40H) and industrial (PSMNR55-40SSH) applications.   These devices are the lowest RDS(on) 40 V parts that Nexperia has ever produced and more importantly, they deliver power densities more than 50X greater than traditional D2PAK devices. More, the n
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Date:
06/04/2021
8V Gate Withstand Voltage for 150V GaN HEMT
The technology is optimized for power supply circuits in industrial and communication equipment.   In recent years, due to the rising demand for server systems in response to the growing number of IoT devices, improving power conversion efficiency and reducing size have become important social issu
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Date:
06/04/2021
Ultra low IQ power management IC for nRF52/nRF53 Series SoCs
The nPM1100 combines a USB compatible input regulator with overvoltage protection, 400mA battery charger and 150mA DC/DC step-down (“buck”) voltage regulator in a 2.075 x 2.075mm wafer level chip scale package (WLCSP). The PMIC ensures reliable power supply and stable operation for Nordic’s nRF52 and nRF53 S
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Date:
06/04/2021
Power Management Focus for Mouser Campaign
The series’ second episode, available on the Mouser website, Alexa, Apple Podcasts, Google Podcasts, iHeartRadio, Pandora and Spotify, explores power management and the potential behind wide bandgap technology.   Each month, the series brings a closer look to industry-changing technologies shaping modern society, and
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Date:
06/04/2021
Farnell adds Inksmith experiential learning tools
The Climate Action Kit’s project-based learning experiences are designed to teach students how to apply technology to solve real world problems through the lens of the United Nations’ Sustainable Development Goals (UN SDGs). Every project provides a unique hands-on opportunity for cross-curricular learning, with
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Date:
06/04/2021
Renesas Expands Portfolio of World’s Smallest Photocouplers
Measuring a mere 2.5mm x 2.1mm in an LSSO5 package, the world’s smallest optical isolated IGBT drivers and intelligent power module (IPM) driver reduce PCB mounting areas by up to 35 percent compared with other devices on the market.   “Industrial equipment and green energy system manufacturers a
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Date:
06/04/2021
2W-Rated Surface Mount DC-DC Converters with Bipolar Outputs
Comprising 9 different models, the lightweight units in the MGJ2 series each have a 2 W power rating and are supplied in compact, low-profile form factor modules with 19.49 mm x 14.99 mm x 4.39 mm dimensions. They are intended to accompany the IGBT and SiC-based MOSFET high-voltage gate drivers used in industr
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Date:
06/04/2021
High Temperature, Power DC-Link Film Capacitor
The C4AK series joins the C4AU (harsh environment) and C4AQ-P (125°C) family of power DC-Link film capacitors. These series offer higher capacitance density, DC voltage, and DC ripple current capabilities with an extended operational lifetime at high temperatures in harsh environments. Ideal for use in automoti
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Date:
06/04/2021
Mersen relaunches Enlight Energy Cap capacitor series
Since the relaunch, these products feature a new foil structure with much higher rated currents and an optimized price-performance ratio. That makes them the ideal solution for use in frequency converters and DC links in wind energy or photovoltaic technology. “These industries have huge potential”, explains Herw
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Date:
06/04/2021
New Würth Elektronik RJ45-10G-LAN transformers
Three tab-down models join the existing Ethernet connectors with integrated transformer in tab-up design. These models have the recess for the connector tab on the underside. All four new RJ45 integrated transformer connectors feature an extremely low-profile package. One of the models is especially suitable for par
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Date:
06/04/2021
APEC 2021: Infineon solutions from silicon to wide bandgap
With a device portfolio that spans silicon and wide bandgap (WBG) devices, engineers look to Infineon for solutions that balance performance, efficiency, reliability and cost. Infineon’s power solutions set the pace for innovations that make life easier, safer and greener.   Products, demonstrat
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Date:
06/04/2021
Enabling System Upgrades with SiC Technology using Industry-Standard Baseplate-Less Packaging

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Wolfspeed, a Cree company, has introduced the Wolfspeed WolfPACKTM family of power modules, which feature silicon carbide (SiC) devices in a well-known power module package. The modules are built on the years of research and optimization Wolfspeed has dedicated to its SiC material and devices.  Along with critical
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Date:
06/01/2021