Power Semiconductors

November 2022
Optimizing Drive-Cycle Simulations for Automotive Applications

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Figure 1. EAB450M12XM3 automotive qualified 1200 V, 450 A all-Silicon Carbide conduction-optimized, half-bridge module by Wolfspeed®

­Silicon Carbide (SiC) has transformed power delivery and management in a number of industries, especially electric vehicle (EV) charging and on-board power conversion. This is due to its superior thermal characteristics, low losses, and power density, which result in higher efficiency and reliability when com
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Date:
11/30/2022
Infineon Austria Cooperates with University of Zagreb on Energy-Saving Microelectronics for Decarbonization

f.l.t.r.: Prof. Željko Jakopović (Project Management University of Zagreb), Vice Rector Prof. Tomislav Josip Mlinarić, Dean Vedran Bilas (both University of Zagreb), Sabine Herlitschka (CEO Infineon Austria), Hrvoje Bujanović, Josef Markus Wuketich, Oliver Heinrich

­Infineon Austria and the Faculty of Electrical Engineering and Computing (FER) at the University of Zagreb have launched an academic cooperation in power electronics. The collaboration will advance the further development of energy-efficient technologies for decarbonization as well as strengthen one of the ke
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Date:
11/03/2022
Bring Your Next Battery Charger Project to Life with Minimum Design Risks

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Figure 1. Infineon offering cover key components in chargers (colored in green)

­Every day more and more of the devices and equipment used in our daily life are powered by batteries. For example, we can find electronic equipment with batteries around the house, such as cordless power tools, drones, and other domestic robots (e.g., robotic vacuum cleaners, lawnmowers, etc.). At the same time, due to rising fuel prices, government incentives, and rising awareness about air pollution, common modes of transportation such as bicycles, scooters, and mopeds have now also turned into electrical vehicles. All of these applications are
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Date:
11/01/2022
System-Level Approach Enables the Design of Precision, High Density, Isolated Analog Output Module for Process Control

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Figure 1. AD5758 and ADP1031 8-channel board

­When designing channel-to-channel isolated analog output modules for process control applications, such as programmable logic controller (PLC) or distributed control system (DCS) modules, the main trade-off is usually between power dissipation and channel density. As module sizes shrink and channel densities in
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Date:
11/01/2022
Who Needs Avalanche?

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Figure 1. Silicon MOSFET avalanche breakdown effect

­Traditional Silicon high voltage power MOSFETs have maximum voltage ratings that include maximum allowable avalanche energy levels. Avalanche breakdown limits the robustness and reliability of the power MOSFET due to the rapid and uncontrolled increase in current and the absorption of the transient or surge en
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Date:
11/01/2022
High-Density Power Modules Boost Performance for a New Generation of Mobile Robots

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Figure 1: Dusty eliminates the conventional, labor-intensive process of physically transferring building plans onto the floor with a robot programmed at the job site to automate the same task.

­Innovations in power conversion technology are enabling a transformation in robotics design. Today’s integrated power modules address the demanding size, weight, power budgets and cost efficiencies required to move robots from factory, residential and commercial applications into a vast new landscape bounded onl
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Date:
11/01/2022