Power Semiconductors

Current
Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction

Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction

­Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor Series: the CE0603G, CE0603M, CE1005Q, and CE1608Q Series. These new inductors feature a monolithic structure ac
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Date:
02/24/2026
TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery

TDK Launches Stackable µPOL Modules Providing up to 200 A Combined for Vertical Power Delivery

­TDK Corporation expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A and is engineered to meet the demanding requirements of AI servers, edge computing, and data center systems. By stacking or paralleling se
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Date:
02/05/2026
Important Characteristics of Insulated Gate Drivers

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Figure 1: Simple schematic of the isolated gate driver ADuM4135

­In power electronics, as found, for example, in drive technology, IGBTs are frequently used for high voltage and high current switching. These power transistors are voltage controlled and produce their main losses during switching. To minimize the switching losses, it is desirable to have short switching times. Ho
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Date:
02/01/2026