Military, Aerospace & Hi-Rel
January 2019
Laird Thermal Systems has established a series of thermoelectric assemblies (TEAs) designed for use in outdoor environments. The Outdoor Cooler Series are compact, more efficient air-to-air TEAs for cooling and heating vital electronics in outdoor environments. The Outdoor Cooler Series TEAs provide a lower total
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Date:
01/31/2019
TOKYO, Japan – Renesas Electronics Corporation introduced two plastic packaged, radiation-tolerant digital isolators that provide the highest isolation protection (2,500VRMS) from high voltage spikes in power supply stages and serial communications interfaces used in low Earth orbit (LEO) Small Satellites (S
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Date:
01/30/2019
Lowell, Massachusetts – MACOM Technology Solutions Inc. (“MACOM”) has expanded its GaN-on-Si power amplifier portfolio with the introduction of its new MAMG-100227-010 broadband PA module optimized for use in land mobile radio (LMR) systems, wireless public safety communications and military tactical communicat
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Date:
01/22/2019
The LTC4012 is a very popular multichemistry battery charger used in a variety of applications. This controller provides the user with gate drivers, current sense inputs, temperature qualified charging and multiple signal outputs. There is also a range of useful functions detailed in the datasheet. One of
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Date:
01/18/2019
Click image to enlarge
Figure 1 Cross section of a 600 V CoolGaN™ ™ power transistor [1]
Today’s demand for high-performance, low-cost power conversion products is driven by consumer expectation for longer battery life, faster charging for their phones, electric vehicles (EVs) or power tools. And consumers want faster data communication along with powerful artificial intelligence (AI) capabilities, de
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Date:
01/15/2019
FOUNTAIN INN, S.C. – AVX Corporation introduced a new line of ultraminiature, thin-film transmission line capacitors for high-frequency links, DC blocking in the UHF range (300MHz – 3GHz), and other high-performance microwave and RF applications. The new capacitors have a novel metal-insulator-metal (MIM) st
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Date:
01/02/2019
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