Military, Aerospace & Hi-Rel

May 2019
Vulnerability of Cloud Service Hardware Uncovered

Field-programmable gate arrays (FPGAs) are more flexible than common specialized computer chips -- and they used to be seen as particularly secure.

Field-programmable gate arrays (FPGAs) are, so to say, a computer manufacturer's "Lego bricks": electronic components that can be employed in a more flexible way than other computer chips. Even large data centers that are dedicated to cloud services, such as those provided by some big technology companies,
. . . Read More
Date:
05/31/2019
Driver Cuts Satellite Command & Telemetry System Size by 50%
TOKYO, Japan – Renesas Electronics Corporation announced a new radiation-hardened 16-channel current driver with integrated 4-bit decoder for reducing the size, weight and power (SWaP) of satellite command and telemetry systems. The ISL72814SEH integrates the decoder, input level shifter,
. . . Read More
Date:
05/30/2019
Mouser stocking Bourns GMOV Hybrid Components
GMOV components present a long-life, reliable protection solution that provides a higher level of performance and safety compared to standard metal oxide varistors (MOVs). The Bourns GMOV series are ideal in AC applications where conditions are less than predictable
. . . Read More
Date:
05/30/2019

CIPOS Tiny complements Infineon’s families of IPMs
The 3-phase inverter module is the newest generation of IPM to offer the highest power density for variable speed motor drives. By using the latest TRENCHSTOP IGBT6, it is possible to realize maximum efficiency with minimum footprint. Applications profiting from
. . . Read More
Date:
05/30/2019
Microchip Carbide (SiC) products for reliable power electronics
Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products. These products meet the need to improve system efficiency, robustness and power density in Electric Vehicles
. . . Read More
Date:
05/30/2019
3 Phase input, 5kW AC-DC power supply is software configurable
The range features both ITE/industrial and medical agency approvals that feature a three-phase, three-wire, 180 to 528VAC input. This drastically simplifies installation as there is no need for a neutral connection, which is often not available in industrial applications.
. . . Read More
Date:
05/30/2019
SiC-Based Hybrid IGBT and Isolated High Current IGBT Gate Driver
The AFGHL50T65SQDC uses the latest field stop IGBT and SiC Schottky diode technology to offer low conduction and switching losses in multiple power applications, including those that will benefit from reduced reverse recovery losses, such as totem pole based bridgeless
. . . Read More
Date:
05/30/2019
Ultra-wide input EN 50155 DC/DC converters
The DC/DC converters serve a wide range of rolling-stock applications, as well as high-voltage battery-powered systems with their ultra-wide 14V-160V DC input-voltage range. The single-output 40W and 60W quarter-brick
. . . Read More
Date:
05/30/2019
HybridPACK power modules enable fast vehicle electrification
The four new HybridPACK Drive modules are optimized for different inverter performance levels between 100 kW and 200 kW. Furthermore, Infineon’s HybridPACK Double Sided Cooling (DSC) S2 is a technology upgrade to the existing HybridPACK DSC. This module targets
. . . Read More
Date:
05/30/2019
Versatile Boost Controller for LED/LCD Applications
The device supplies a constant voltage or constant current to drive displays and backlights with a dimming ratio of 100:1. It is well suited for use as a backlight driver for LCD TVs, LCD monitors, and flat
. . . Read More
Date:
05/30/2019
WiBotic and GaN Systems Bring â€True Autonomy’ to Mobility
The partnership advances capabilities of mobile industrial robots, freeing them from limitations imposed by current restricted charging methods that allow for continuous operation. For mobile robots to work efficiently, flexibly, and without interruption - they need
. . . Read More
Date:
05/30/2019
Exagan Opens Power Solutions Center in Europe
The opening of the best-in-class facility, which is operating in close collaboration with technology partner CEA Tech, follows the launch of Exagan’s first GaN applications center in Taiwan last October. The
. . . Read More
Date:
05/30/2019
LEM introduces AI-PMUL digital integrator for Rogowski coils
AI-PMUL is a versatile digital signal conditioner of Rogowski coils secondary signal which offers a wide range of standard analogue True RMS and instantaneous outputs. The Rogowski coils output voltage is proportional
. . . Read More
Date:
05/30/2019
200A current sense transducer costs 40% less than competition
This enables users to access Danisense’s unique, double-core, balanced flux gate measurement technology, at a very affordable price/performance ratio. The DC200IF boasts excellent linearity (6 ppm) with a
. . . Read More
Date:
05/30/2019
This series is optimized for industrial applications including street lamps, commercial AC systems, and general-purpose AC servos and inverters used in high power equipment. SiC power semiconductors deliver
. . . Read More
Date:
05/30/2019
A Safer Supply Chain with Vincotech’s Multi-sourced Offering
This supplier of module-based solutions for power electronics pointed out that its multiple sourcing strategy goes to protect customers’ business interests by mitigating risks in the supply chain. Vincotech
. . . Read More
Date:
05/30/2019
Extended range of reliable and efficient DC-DC converters
The modules are provided in sealed and encapsulated packaging, to ensure they will work reliably when subjected to dust, moisture, severe vibration and other harsh conditions. The PKE3000 and PKE5000 series
. . . Read More
Date:
05/30/2019
Rugged 2KW RF power LDMOS transistor for ISM applications
The process has been developed to enable the implementation of extremely rugged transistors with operating voltages of up to 65V. The first product to use the process, the ART2K0FE, is a 2KW transistor with
. . . Read More
Date:
05/30/2019
10 Watt DC-DC Converter Range in Compact Package
The new series comprises 14 variants. Targeting a diverse range of applications, including instrumentation, data communication, telecommunication and computer peripheral equipment, industrial automation and
. . . Read More
Date:
05/30/2019
Ultra-thin Open Frame Non-isolated DC-DC Converter
The dimension of K78-JT-500R3 series is 12.50 x 13.50 x 3.50mm, which is 4.75mm lower in height than that of K78-T-500R3 series. Besides, the K78-JT-500R3 series features SMD package, and provides an ultra-wide input voltage range of 4.75 - 36V. This series also
. . . Read More
Date:
05/30/2019
Compact Size SMD Package CAN/RS485/RS232 Transceiver Modules
The transceivers assist fast signal response in industries of power grid, industrial control, and transportation(rail, automotive), etc. The series adopt the SMT process, which enables customers to easily achieve
. . . Read More
Date:
05/30/2019
Graphene to Enable Future Space Exploration

Graphene Flagship researchers during one of the zero-gravity experiments.

Researchers embark on zero-gravity parabolic flights to test novel graphene-based thermal management devices for space applications. Graphene significantly improves the performance of loop heat pipes, which dissipate heat in satellites to avoid equipment failure. The Graphene
. . . Read More
Date:
05/29/2019
Current transducers with measuring range up to 450 Apk
The family consists of three new models: LZSR 100-P, LZSR 150-P and LZSR 200-P.   These new transducers
. . . Read More
Date:
05/22/2019
8 x 8mm LFPAK MOSFET family delivers up to 48x power density
LFPAK88 devices replace larger power packages such as D²PAK and D²PAK-7, and measuring 8 x 8mm offer a footprint reduction of 60 %, and a 64 % lower profile.  
. . . Read More
Date:
05/22/2019
UnitedSiC adds 7 SiC FETs to 650V product portfolio
These new devices provide new levels of high-voltage power performance in the fast growing data center server, 5G base station, and electric vehicle markets, where they will be used in power supplies, telecom rectifiers, and on-board chargers respectively.
. . . Read More
Date:
05/22/2019
New CoolSiC Schottky diode 1200 V G5 portfolio from Infineon
It can easily replace silicon diodes for higher efficiency. The expanded 8.7 mm creepage and clearance distances offer extra safety in high-pollution environments. Forward currents up to 40 A are available to address EV DC charging, solar energy systems,
. . . Read More
Date:
05/22/2019
Samtec’s mPOWER Ultra Micro Power Connectors Now at Mouser
Offering current ratings up to 21 A per blade in a 2 mm pitch, mPOWER connectors provide an ultra-small, high-power solution with exceptional design flexibility for power-only or power-and-signal applications.
. . . Read More
Date:
05/22/2019
Low profile 180W U-channel PSU for space-critical applications
The low-profile devices are just 1.16” high and occupy a small 4.3” x 2.5” footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection)
. . . Read More
Date:
05/22/2019
LTM2810 ÂμModule Isolators, Now Shipping from Mouser
Date:
05/22/2019
High Temperature Micro-D Series connectors available at TTI
Optimised to save space and weight in demanding applications, such as space vehicles, defence systems and oil exploration equipment, Micro Series Connectors are rugged and moisture-sealed. These data, power and signal interconnects combine versatility
. . . Read More
Date:
05/22/2019
High Power Factor LED Driver-Controller with Mixed-Mode Dimming
  The AL1665 is designed to drive an external MOSFET to control LED loads and maintain a high power factor. It provides a compact and efficient solution that helps minimize
. . . Read More
Date:
05/22/2019
Open Frame Power Supplies with UL8750 Safety Approval
    The LU225 family meets EN55015 (EN55032) Class B Conducted EMI, IEC61000-3-2 Class C (LED
. . . Read More
Date:
05/22/2019
MIT and US Air Force Sign Agreement to Launch AI Accelerator
MIT and the U.S. Air Force have signed an agreement to launch a new program designed to make fundamental advances in artificial intelligence that could improve Air Force operations while also addressing broader societal needs. The effort, known as the MIT-Air Force AI Accelerator, will leverage the
. . . Read More
Date:
05/20/2019
Saft Launches new Xcelion 56V Li-ion Battery
Tampa, FL – Saft has recently launched a new product in the Xcelion line, the Xcelion 56V lithium-ion (Li-ion) battery, offering customers a variant on the proven technology behind the Xcelion 6T for applications requiring higher voltage. As the third Xcelion product, the Xcelion
. . . Read More
Date:
05/20/2019
Thermal Gap Filler Reduces Stress on Sensitive Components
CLEVELAND, Ohio. – Laird Performance Materials has developed Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components while also yielding
. . . Read More
Date:
05/09/2019
DC-DC Converter Series Featuring GaN-Based Technology
WASHINGTON -- VPT, Inc. released its SGRB Series of space qualified DC-DC converters at the Satellite 2019 Show. Using advanced GaN technology, the SGRB is capable of very high efficiency, up to 95%, as well as radiation tolerance. A fixed-frequency reduced voltage switching topology results in very low
. . . Read More
Date:
05/06/2019
SiC Devices Enable High-Voltage Power Electronics
CHANDLER, Ariz. — Demand is growing for SiC power products that improve system efficiency, robustness and power density in automotive, industrial and aerospace and defense applications. Microchip Technology Inc., via its Microsemi subsidiary, announced the production release of a family of SiC power devices
. . . Read More
Date:
05/03/2019
Are you SiC of Silicon? - Part 2

Click image to enlarge

Anup Bhalla, Vice President Engineering, UnitedSiC

State of SiC Device and Package Technology It has long been known that packaging technology is key to unleashing the potential of wide-bandgap (WBG) devices. Silicon Carbide device manufacturers have been making rapid improvements in device technology figures of merit such
. . . Read More
Date:
05/01/2019