Microchip subsidiary Microsemi has released of a family of SiC power devices that offer ruggedness, as well as the performance benefits of wide-bandgap technology.
Complemented by Microchip’s broad range of microcontrollers (MCUs) and analogue solutions, the SiC devices join a growing family of reliable SiC products. These products meet the need to improve system efficiency, robustness and power density in Electric Vehicles (EVs) and other high-power applications in the industrial, aerospace and defence markets.
Microchip’s 700V SiC MOSFETs and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC power modules. The over 35 discrete products that have been added to Microchip’s portfolio are available in volume, supported by comprehensive development services, tools and reference designs, and offer outstanding ruggedness proven through rigorous testing. The broad family of SiC die, discretes and power modules are offered across a range of voltage, current ratings and package types.
Microchip’s SiC MOSFETs and SBDs offer more efficient switching at higher frequencies and pass ruggedness tests at levels considered critical for guaranteeing long-term reliability. The company’s SiC SBDs perform approximately 20 percent better than other SiC diodes in these Unclamped Inductive Switching (UIS) ruggedness tests that measure how well devices withstand degradation or premature failure under avalanche conditions, which occur when a voltage spike exceeds the device’s breakdown voltage. Microchip’s SiC MOSFETs also outperform alternatives in these ruggedness tests, demonstrating excellent gate oxide shielding and channel integrity with little lifetime degradation in parameters even after 100,000 cycles of Repetitive UIS (RUIS) testing.
Microchip is one of the few suppliers to provide a range of both silicon and SiC discrete and module solutions. The company’s products are ideally suited for the growing number of EV systems including external charging stations, onboard chargers, DC-DC converters and powertrain/traction control solutions. The new SiC devices are backed by Microchip’s customer-driven obsolescence practice, which ensures devices will continue to be produced for as long as customers need them.
The expanded SiC portfolio is supported by a range of SiC SPICE models, SiC driver board reference designs and a Power Factor Correction (PFC) Vienna reference design. All the company’s SiC products are available in production volumes along with their associated support offerings. A variety of die and package options are available for the SiC MOSFETs and SiC diodes.
