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IoT & Smart Cities

February 2017
TDK's PiezoHapt thin actuator touts low driving voltage

PiezoHapt actuator

TDK's PiezoHapt thin actuator touts low driving voltage
TDK has expanded its portfolio of haptic components with the new ultra-thin PiezoHapt actuator featuring a very short response time of just 4 ms. PiezoHapt has a unimorph design consisting of a multilayer piezo element bonded to one side of a vibration plate. With a thickness of a mere 0.35 mm the new haptic ac
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Date:
02/28/2017
Volkswagen launches program for key future technologies

Peter Schiefer, President of the Automotive division at Infineon Technologies AG and Dr. Volkmar Tanneberger, Head of Electrical and Electronic Development at Volkswagen (from left)

Volkswagen launches program for key future technologies
Volkswagen, securing a position in the field of future vehicle innovations, is partnering with Infineon Technologies, a leading semiconductor supplier. Volkswagen will further intensify the direct dialogue with Infineon in order to define the requirements for future semiconductor solutions and thus pursue new jo
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Date:
02/28/2017
Rosenberger's magnetic connectors serve multiple apps

Rosenberger magnetic connectors

Rosenberger's magnetic connectors serve multiple apps
Rosenberger has developed a product family which offers an intelligent alternative to mechanical connecting. Our magnetic connectors support all standard functions, including a high number of mating cycles and vibration resistance. They are also suitable for power and signal transmission. Furthermore, they come co
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Date:
02/28/2017
Toshiba launches IoT dev kit for Bluetooth wearables

EBTZ1041-SK-A1 ‘starter kit’ supports the prototyping of highly integrated IoT wearable applications

Toshiba launches IoT dev kit for Bluetooth wearables
Toshiba Electronics has announced a comprehensive development kit that provides the hardware and software needed to create wearable devices that handle multiple sensor inputs. The EBTZ1041-SK-A1 ‘starter kit’ supports the prototyping of highly integrated IoT wearable applications featuring the Toshiba TZ1000 Ap
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Date:
02/28/2017
Anritsu collaborates with KDDI on IoT lab tests
Anritsu is partnering with KDDI on connection performance and power consumption tests for Low Power Wide Area (LPWA) used in IoT market. The LTE standards typically used for IoT are standardized by 3GPP as Cat.1, Cat.1+eDRX, and Cat.M1, and globally chip venders are developing and releasing communication ch
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Date:
02/28/2017
Increasing power density
Y. Iwasaki, M. Chounabayashi, M. Nakazawa, S. Iwamoto, Y. Oonishi, M. Hori, H. Kakiki and O. Ikawa

Current market requirements are trending towards further downsizing and increased efficiency of power conversion systems. For this reason, enhanced power density of the power modules will be critical in order to respond to the evolving needs of the market. In order to increase the power density, All-SiC modules wi
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Date:
02/28/2017
What's a wearable?
Alix Paultre, Editorial Director, Power Systems Design

There is an ongoing slow-motion explosion of devices and services for the Internet of Things (IoT), especially in the wearables category. There are a lot of benefits to this as well as a couple of problems, but we will all work it our eventually. The problem, as always, is how do we get there from here? It is obviou
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Date:
02/28/2017
AT&S advances PCB, module and packaging tech

11 key European actors are collaborating on the GaNonCMOS project

AT&S advances PCB, module and packaging tech
 For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy efficiency. In this context, the company is involved in various research and development programmes. One current example is the Horizon 2020 EU
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Date:
02/28/2017
Ericsson, Qualcomm and Vodafone trial 5G new radio for unified 5G
Ericsson and Qualcomm Technologies are working with Vodafone to test 5G interoperability and conduct an over-the-air field trial based on 5G New Radio (NR) specifications being developed in 3GPP. The trial intends to drive the mobile ecosystem towards validation of 5G NR technologies, which will enable operators to
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Date:
02/27/2017
Renesas completes acquisition of Intersil
Renesas Electronics, a premier supplier of advanced semiconductor solutions, and Intersil, a leading provider of innovative power management and precision analog solutions, announced the completion of Renesas’ acquisition of Intersil Corporation. The transaction brings together the advanced technology and de
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Date:
02/27/2017
Ethertronics launches complete LoRa module with active steering antenna

LoRa module for Low-Power Wide Area Network (LPWAN) connectivity

Ethertronics launches complete LoRa module with active steering antenna
Ethertronics, a leader in ultra-high performance smart antenna system solutions, announced the industry first complete plug and play LoRa module for Low-Power Wide Area Network (LPWAN) connectivity. It delivers very long range and unmatched reliable antenna performance using Active Steering for the LoRa ecosystem of
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Date:
02/27/2017
Anritsu Bluetooth test set upgraded to support Bluetooth 5

MT8852B Bluetooth Test Set

Anritsu Bluetooth test set upgraded to support Bluetooth 5
Anritsu announced an upgrade to the MT8852B Bluetooth Test Set to support the latest Bluetooth Core Specification version 5. The MT8852B is the market leading RF measuring instrument for design proving and production test of a wide range of products that integrate Bluetooth technology. It supports Basic Rate (B
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Date:
02/27/2017
PSDcast - Robert Rozario of Dialog Semi on automotive systems

Robert Rozario of Dialog Semiconductor

PSDcast - Robert Rozario of Dialog Semi on automotive systems
In this PSDcast, Robert Rozario of Dialog Semiconductor talks to Alix Paultre about the challenges facing designers of automotive systems. Today the car represents a confluence of multiple streams, from the Internet of Things to Smart Grid to autonomous systems. The company recently formed a partnership wi
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Date:
02/24/2017
Igor and Ellipz to create novel PoE and LED intelligent lighting solution

The integrated technology provides a complete PoE and LED package solution

Igor and Ellipz to create novel PoE and LED intelligent lighting solution
Incorporating Igor technology, Ellipz will provide an intelligent light management solution for the commercial lighting industry. The integrated technology provides a complete PoE and LED package solution to the marketplace. By combining both company’s unique technologies, the Ellipz smart lighting solution ca
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Date:
02/24/2017
Harwin launches new website to inspire the next generation of engineers

Made Here Now website

Harwin launches new website to inspire the next generation of engineers
Made Here Now, the UK-wide initiative to encourage more young people into manufacturing as a career, is celebrating a major milestone with the launch of a new website at MadeHereNow.com, containing inspirational videos, success stories and photography. Backed by 37 sponsors, including leading hi-rel connect
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Date:
02/21/2017
PCIM Europe 2017 to give a view into the future of power electronics
Three months prior to the event, the increased number of exhibitors is a tribute to the positive development of PCIM Europe. Overall, more than 450 exhibitors from 28 nations will be present in Nuremberg from 16 – 18 May 2017. In focus: The entire value chain Numerous new exhibitors and key players in
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Date:
02/21/2017
Microchip's latest PIC MCUs offer more core-independent peripherals

PIC16F15386 block diagram

Microchip's latest PIC MCUs offer more core-independent peripherals
The PIC16F15386 family, a powerful launching point into the 8-bit PIC microcontroller (MCU) portfolio, is now available from Microchip Technology Inc. (NASDAQ:MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. In addition to our current Core Independent Peripherals (CIPs), th
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Date:
02/21/2017
Qualcomm unveils tri-mode system-on-chip for IoT
Qualcomm Technologies announced two new System-on-chips (SoCs), the QCA4020 and QCA4024. Qualcomm Technologies is the first to announce a tri-mode SoC QCA4020, integrating Bluetooth Low Energy 5, Dual-band Wi-Fi, and 802.15.4-based technologies, including ZigBee and Thread, while QCA4024 integrates Bluetooth Lo
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Date:
02/21/2017
STMicro's STM32 LoRaWAN discovery board now at Mouser

STM32 LoRaWAN Discovery Board

STMicro's STM32 LoRaWAN discovery board now at Mouser
Mouser Electronics, with the newest semiconductors and electronic components, is the first to stock the STM32 LoRaWAN Discovery Board from STMicroelectronics (ST). The new Discovery Kit and I-NUCLEO-LRWAN1 STM32 LoRa Arduino-compatible extension board — available to order from Mouser — provide a development pl
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Date:
02/20/2017
New chip may thwart battery charger counterfeiting

Counterfeit chargers for portable electronics are a major problem

New chip may thwart battery charger counterfeiting
Larry Hardesty

Counterfeit chargers for portable electronics are a major problem. At the end of 2016, Apple claimed that of 100 Apple-branded charging accessories it bought on Amazon, 90 were counterfeits. Around the same time, Britain’s Chartered Trading Standards Institute reported that of 400 counterfeit chargers it bought fr
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Date:
02/17/2017
STM32 proto boards from STMicro support long-range low-power IoT

B-L072Z-LRWAN1 Discovery kit and I-NUCLEO-LRWAN1

STM32 proto boards from STMicro support long-range low-power IoT
Two new ready-to-use prototype boards available from STMicroelectronics slash the cost for developers to start evaluating LoRaWAN and other Low-Power Wide Area Network (LPWAN) technologies including WM-Bus and 6LoWPAN. The boards are based on the smallest and lowest-power LoRaWAN modules that exist on the market to
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Date:
02/17/2017
Extreme Tech Challenge 2017 winner announced

Winner Vantage Robotics was selected by a prestigious panel spearheaded by special guest judge Sir Richard Branson

Extreme Tech Challenge 2017 winner announced
The race to Necker Island culminates with an unprecedented, photo-finish judging: Separated by less than half a percent in point total, Vantage Robotics is named of winner of Extreme Tech Challenge 2017! XTC 2017 Champion Vantage Robotics (San Francisco, CA) has created the best flying camera in the world, ma
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Date:
02/17/2017
Analog Devices' smart engineering solutions come to embedded world
At embedded world 2017, we will have working demos on A2B automotive audio, advanced personal healthcare monitoring, TSN, ultralow power ARM microprocessor unit, and 24 GHz radar for automotive and industrial applications, just to name a few. Meet with our analog experts, who can answer your specific design qu
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Date:
02/16/2017
Microsemi claims lowest-power cost-optimized FPGA product family

PolarFire FPGA

Microsemi claims lowest-power cost-optimized FPGA product family
Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new cost-optimized PolarFire field programmable gate array (FPGA) product family, delivering the industry’s lowest power at mid-range densities with 12
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Date:
02/14/2017
PI Databook now available on any web browser

PI Databook contains Power Integrations' complete technical document portfolio

PI Databook now available on any web browser
Power Integrations’ Databook is now available on any web browser for Windows or Mac as well as mobile apps for IOS and Android. PI Databook contains Power Integrations' complete technical document portfolio, as well as video tutorials and product demonstrations. Use the PI Databook to search for products in a f
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Date:
02/14/2017
German flex+ Project ends on positive note for flexible devices

Demonstration objects from the Insect Project

German flex+ Project ends on positive note for flexible devices
The flex+ Project, funded by the German Federal Ministry of Education and Research (BMBF), has successfully come to the end of ist planned two-year duration and will leave its mark on the future as well: flexible electronics as a comprehensive approach. Fraunhofer FEP is one of the leading research and devel
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Date:
02/14/2017
Intersil claims smallest isolated RS-485 transceiver for industrial IoT

ISL32704E isolated RS-485 transceiver

Intersil claims smallest isolated RS-485 transceiver for industrial IoT
Intersil, a leading provider of innovative power management and precision analog solutions, announced the industry’s smallest isolated RS-485 differential bus transceiver designed to provide 4Mbps bidirectional data transmission for Industrial Internet of Things (IIoT) networks. The high-speed ISL32704E delivers in
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Date:
02/13/2017
Novel chip extends sensors’ battery life

Ultra-low power UB20M voltage detector chip

Novel chip extends sensors’ battery life
A low-cost chip that enables batteries in sensors to last longer, in some cases by over ten times, has been developed by engineers from the University of Bristol. Dr Bernard Stark and colleagues in the Bristol Electrical Energy Management Research Group based in the Merchant Venturers School of Engineering, ha
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Date:
02/13/2017
Microchip unveils zigbee PRO green power certified platform

Solution enables cross-functional device support and will be backward-compatible with existing zigbee certified products

Microchip unveils zigbee PRO green power certified platform
The industry’s first zigbee alliance certified zigbee platform with zigbee PRO and Green Power features (formerly known as zigbee 3.0) from a semiconductor company, is now available from Microchip Technology, a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. With greater interoperability an
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Date:
02/13/2017
ITO challenged as a transparent conductor by novel technologies

(Left): An example of the hybrid process for manufacturing metal mesh. (Right) examples of O-Film metal mesh TCFs.

ITO challenged as a transparent conductor by novel technologies
The transparent conductive film (TCF) industry has witnessed upheaval in recent years. On the one hand, multiple technologies have been developed as alternatives to the incumbent solution, whilst the incumbent suppliers slashed their prices to protect their share in sluggish markets. Our report Transparent Conductiv
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Date:
02/13/2017
TE Connectivity to showcase tech to mitigate device design challenges at MD&M West
TE Connectivity (TE), a leader in connectivity and sensor solutions, will showcase technologies designed to mitigate medical device design challenges at MD&M West this month, Booth #3149. Product experts from TE will be on site to discuss how TE’s customized sensing, connectivity and minimally invasive de
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Date:
02/13/2017
PSDcast - Frans Scheper of Nexperia talks discretes, logic, and MOSFETs

Frans Scheper of Nexperia

PSDcast - Frans Scheper of Nexperia talks discretes, logic, and MOSFETs
In this PSDcast, Nexperia CEO Frans Scheper, formerly EVP and GM of NXP's Standard Products Business Unit, talks to Alix Paultre from Power Systems Design about the spinoff of Nexperia from NXP. Nexperia, which will produce around 85 billion devices a year and in 2016 had revenues exceeding US$1.1B, add
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Date:
02/10/2017
PSMA to hold APEC 2017 session on energy harvesting
At APEC 2017, the PSMA's (Power Sources Manufacturers Association’s) Energy Harvesting Committee will host an Industry Session featuring five industry experts who will cover such topics as real-world applications, conditional monitoring, energy harvesting systems, PMICs (Power Management ICs) and low-power IoT
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Date:
02/09/2017
FLINGO project seeks to advance LED performance
Given the growing demands placed on the electrical, optical and thermal functionality of LEDs, engineers are paying more and more attention to the advancement of new material properties. To this end, the FLINGO project (Functional Inorganic Layers for Next Generation Optical Devices) was established to develop ne
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Date:
02/09/2017
Nexperia spins off from NXP
Nexperia, the former Standard Products division of NXP, announced the formal completion of its launch as a separate entity. Headquartered in Nijmegen, Netherlands and backed by a consortium of financial investors consisting of Beijing Jianguang Asset Management and Wise Road Capital, Nexperia is a stand-alone, wo
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Date:
02/08/2017
EnOcean to show low-energy LED controls at Strategies in Light
At Strategies in Light 2017 (Anaheim, February 28 – March 2, 2017), EnOcean, a leader in energy harvesting wireless technology, will present self powered wireless LED control for multiple wireless protocols. At booth #107, the company will be exhibiting their extensive Dolphin portfolio, including self-powered sw
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Date:
02/08/2017
Imec, Holst Centre, and ROHM create a solution for ultra-low-power IoT radios

Sub-mW All-Digital PLL presented by IMEC and ROHM

Imec, Holst Centre, and ROHM create a solution for ultra-low-power IoT radios
At the 2017 International Solid-State Circuits Conference in San Francisco (US), imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, Holst Centre (set up by imec and TNO) and ROHM today presented an all-digital phase-locked loop (ADPLL) for Internet-of-Things (IoT) ra
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Date:
02/08/2017
AT&S helps create worlds's smallest loudspeaker

USound and Fraunhofer Institute's micro-speaker uses MEMS technology

AT&S helps create worlds's smallest loudspeaker
Graz-based start-up USound, in partnership with several Fraunhofer Institutes (IDMT, ISIT, IIS and IZM) and utilizing PCB technology together with system integration expertise from AT&S, has developed what is not only the world’s smallest speaker, but also the first based on micro-electro-mechanical systems (M
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Date:
02/06/2017
Murata to exhibit cutting-edge tech and cheerleaders at CeBIT

Murata booth at CEBIT

Murata to exhibit cutting-edge tech and cheerleaders at CeBIT
Murata will exhibit at CeBIT, the world’s largest trade show for IT solutions from March 20-24 2017. The event, which will take place at the Hannover Exhibition Grounds, Hannover, Germany is expected to see 200,000 visitors through the doors. Booths from 3,300 companies from 70 countries will showcase business fi
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Date:
02/06/2017
Linear's latest PoE chip delivers 123W over 1Gbps CAT5e cable

LTC4279 single port Power over Ethernet (PoE) controller

Linear's latest PoE chip delivers 123W over 1Gbps CAT5e cable
Linear Technology introduced the LTC4279 single port Power over Ethernet (PoE) controller for power sourcing equipment (PSE), delivering up to 123W of power over CAT-5e cable for power-hungry applications. Demand for higher power delivery comes from a widespread set of applications, including LTE picocell base st
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Date:
02/06/2017
Qualcomm and TDK announce joint venture
Qualcomm Incorporated (NASDAQ: QCOM) and TDK Corporation (TSE: 6762) today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules an
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Date:
02/06/2017
Octavo Systems’ OSD3358 SiP of BeagleBone Black wireless, now at Mouser

OSD3358 SiP device

Octavo Systems’ OSD3358 SiP of BeagleBone Black wireless, now at Mouser
Mouser Electronics, a product introducton leader that empowers innovation, is now stocking the OSD3358 system-in-package (SiP) from Octavo Systems. The OSD3358 SiP device makes it easier for designers to quickly create production-ready systems based on the Texas Instruments (TI) Sitara AM3358 processor with an
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Date:
02/06/2017
Qualcomm extends offer for all outstanding shares of NXP
Qualcomm announced that Qualcomm River Holdings, an indirect wholly owned subsidiary of Qualcomm, has extended the offering period of its previously announced cash tender offer to purchase all of the outstanding common shares of NXP Semiconductors. The tender offer is being made pursuant to the Purchase Agreement, da
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Date:
02/03/2017
Measure, Monitor, Monetize - Anritsu at Mobile World Congress
At Mobile World Congress (MWC) 2017 in Barcelona, Anritsu (Hall 6 Stand 6F40) will be showing a range of its test, measurement and monitoring solutions which support the development, deployment and monetization of the latest technologies paving the way for Connected living. In particular they will be focusing on
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Date:
02/02/2017
RS Components makes life easier for engineers with online parts solution
RS Components, the trading brand of Electrocomponents, a distributor for engineers, announced it has extended its relationship with SamacSys, the world’s leading supplier of high-quality PCB schematic symbols and footprints. RS is now offering direct access to schematic symbols and footprints from SamacSys, fo
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Date:
02/02/2017
element14 launches ‘Upcycle it’ design challenge with Intel Edison
element14, a leading electronic design community, has launched a new Design Challenge for designers and engineers called ‘Upcycle it’. Sponsored by Intel, element14 will challenge 15 community members to Upcycle an unwanted or waste product to give it a new or enhanced lease of life. Upcycling is a conc
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Date:
02/02/2017
PSDcast - Ian Lawee of Analog Devices on energy metering and the smart grid

Ian Lawee of Analog Devices

PSDcast - Ian Lawee of Analog Devices on energy metering and the smart grid
In this PSDcast, Ian Lawee of Analog Devices talks to Alix Paultre of Power Systems Design on energy metering and the smart grid. In addition to their many initiatives, Analog Devices is also collaborating with the China Electric Power Research Institute to improve reliability of smart substations. The An
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Date:
02/01/2017
Qorvo claims smallest and most power-efficient family of Wi-Fi front-end modules

Qorvo Wi-Fi FEM family

Qorvo claims smallest and most power-efficient family of Wi-Fi front-end modules
Qorvo, a leading provider of innovative RF solutions to connect the world, has introduced a new family of 5 GHz and 2.4 GHz Wi-Fi Front-End Modules (FEMs) that pave the way for smaller, more energy-efficient wireless routers, gateways and other networked devices in the home. The seven new FEMs support high-bandwidth th
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Date:
02/01/2017
Analog Devices announces changes to Board of Directors

Mark M. Little

Analog Devices announces changes to Board of Directors
Analog Devices, a leader in high-performance semiconductors for signal processing applications, announced that Mark M. Little, former Senior Vice President, GE Global Research and Chief Technology Officer of General Electric Company, has been elected as a Director of the Company, and that the Board of Directors of
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Date:
02/01/2017
Empowering wireless charger design
Eko Lisuwandi, Linear Technology

The use of batteries in everyday devices is getting more ubiquitous.  In many of these products, a charging connector is difficult or impossible to use. For example, some products require sealed enclosures to protect sensitive electronics from harsh environments and to enable for convenient cleaning or st
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Date:
02/01/2017
The design explosion
Alix Paultre, Editorial Director, PSD

Let’s continue the thought we began with at the front of the issue, as simply saying that it’s good to have a lot of product development, even if some of it is on stuff that is a little crazy, leaves a lot to be said. How does a laundry-folding robot help humanity? Will having a toothbrush that sends me em
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Date:
02/01/2017
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