IoT & Smart Cities

August 2018
AC-DC Power ICs Offer Highest Power Density in the Industry
IRVINE, Calif. -- Fabless power semiconductor company Helix Semiconductors announced Murata Group represented by Murata Manufacturing Co., Ltd. as the first to co-develop the new MxC 300 transformerless chipset for their AC-DC converter modules. Helix Semiconductors’ MxC 300 is a two-chip solution th
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Date:
08/28/2018

950V CoolMOS P7 Superjunction MOSFET
Infineon Technologies ushers a new member of its CoolMOS™ P7 family, the 950 V CoolMOS P7 Superjunction MOSFET. It meets even the most rigorous design requirements: for lighting, smart meter, mobile charger, notebook adapter, AUX power supply and industrial SMPS applications. This new semiconductor solution de
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Date:
08/22/2018
Maxim 5kVRMS Reinforced Digital Isolator
To better protect industrial systems from the dangers of high-voltage signals, equipment designers can now turn to the new robust and reliable MAX22445 5kVRMS four-channel reinforced digital isolator from Maxim Integrated Products, Inc. (NASDAQ: MXIM). Delivering up to 2x greater throughput at 4x lower power co
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Date:
08/22/2018
Compact 200 Watt metal cased power supplies
It extends the existing TXM series which ranged from 15 to 150 Watt with an additional 200 Watt series. With a compact metal case and screw terminal block connections, they are easy to install in any equipment. There are three models of single output voltages from 12 VDC to 48 VDC. They also feature an universal in
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Date:
08/22/2018
Würth Wireless Connectivity from Digi-Key
The product range encompasses highly efficient wireless transmission solutions in the Bluetooth or Wireless M-Bus standard as well as proprietary wireless modules in the frequency ranges 169, 433, 868, 915 MHz and 2.4 GHz. Thanks to their low power consumption, these high-quality, compact components are ideal so
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Date:
08/22/2018
Simultaneous power supply for mainboard and 24V peripherals
The new industrial PC PSU BEA-750H from Bicker Elektronik, Donauwörth/Germany, offers in addition to the regular ATX outputs for current mainboards a strong 24VDC output, which can be loaded with up to 7 amps and thus provides enough power to ensure the reliable supply of displays, receipt printers, card readers, coi
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Date:
08/22/2018
Power Supplies Designed for Low-Power IoT Applications
PLANO, TX – RECOM's latest 15W and 20W AC/DC power supplies are designed for low-power IoT and household applications. Based on the footprint of the compact RAC10-K modules, these new modules feature high-efficiency over a wide load range and minimal standby power consumption. The RAC15-K and RAC20-K Ser
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Date:
08/15/2018
PSDcast - The Formula E Electric Racing Series

Mitch Van Ochten from ROHM Semiconductor

In this episode of the PSDcast, we're discussing the premier electric racing series, the Formula E championship. In particular, we're exploring ROHM Semiconductor's official technology partnership with the Venturi team.
Date:
08/07/2018
DRQ DC/DC Converters Delivers 1K Watts at 97% Efficiency
Murata has announced the 1 kW DRQ-11.4/88-L48 Series of quarter brick, intermediate bus, DC/DC converter modules that address the growing power requirements of high-reliability networking and telecommunications infrastructure equipment. The fully regulated DRQ-11.4/88-L48xx Series provides 11.4 Vout at 88 A, with a Vin Range
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Date:
08/02/2018
New CMOS op-amp delivers class-leading low-noise
ROHM today announced the availability of a CMOS op-amp featuring the lowest noise in the industry optimized for industrial applications requiring high-accuracy sensing, such as accelerometers used in sonar systems, and optical sensors that handle ultra-small signals. In recent years, in addition to IoT devic
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Date:
08/02/2018
TTI, Inc. Acquires Compona AG of Switzerland
TTI, Inc announced the acquisition of privately held Compona AG of Switzerland and the company’s German subsidiary Cosy Electronics GmbH. Both Compona and Cosy are specialty distributors of interconnect products and provide services such as in-house assembly of specific connector ranges and full support on cu
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Date:
08/02/2018
Technology-Driven Optimization for Power and Thermal Tradeoffs

Figure 1 – Highest optimization potential exists at the system-level

Traditionally the key concerns and optimization targets in chip development have been summarized as “PPA”—performance, power and area. Depending on the application domain, the relative weighting of those three design objectives can vary greatly. In mobile devices, power has been key for quite some time. In
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Date:
08/01/2018
One Giant Leap for the Power Industry
Welcome to the July/August edition of Power Systems Design. Traditionally, things quieten down a bit over the summer period and we get a chance to take some well deserved rest and relaxation. This year that rest is even more welcome as things seemed to increase in intensity as the year went on. Things came to a
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Date:
08/01/2018
The Many Flavors of Automotive Electronics
Our automotive/infotainment issue just might be the most diverse offering of the year – most of us drive cars, so OEMs have a wide variety of avenues to approach one of the industry’s most universal topics. Thus, the July/August issue covers such varied themes as audio amplifiers, MLCCs, and SiC MOSFETs, all
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Date:
08/01/2018
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