IoT & Smart Cities
March 2019
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How should you proceed with a switching regulator with an analog ground (AGND) and a power ground (PGND)? This is a question asked by many developers designing a switching power supply. Some developers are accustomed to dealing with a digital GND and an analog GND; however, their experience frequently fails th
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Date:
03/31/2019
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Anup Bhalla, Ph.D., Vice President Engineering, UnitedSiC
SiC applications began in the 2000s with the adoption of SiC JBS diodes into PFC applications. This was followed by the use of SiC diodes and FETs in the PV industry. But the recent surge in applications relating to EV On-board chargers and DC-DC converters is driving SiC growth. The nascent adoption in the EV
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Date:
03/31/2019
Chris Dries, President and CEO at UnitedSiC
March 18, 2019, Princeton, New Jersey and Norwood, Massachusetts: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, today announced a strategic investment and long-term supply agreement from Analog Devices, Inc. (ADI). Terms of the investment and supply agreement were not announced.
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Date:
03/18/2019
Kevin Parmenter, Field Applications Manger, Taiwan Semiconductor
The promise of wide bandgap semiconductors (WBG) are higher switching frequency and higher operating temperatures perhaps smaller sizes, greater efficiencies and perhaps higher reliability, less size, less cooling – no fans for example, smaller heatsinks, smaller capacitors, less weight and overall better pe
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Date:
03/08/2019
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Figure 1. Boost topology for generating a high voltage from a low voltage
If a high voltage needs to be generated from a low voltage, a boost converter can be used. This represents one of the three elementary switching regulator topologies and requires only two switches, an inductor, and input and output capacitors. Besides the boost converter, the other basic topologies are the buck co
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Date:
03/08/2019
San Jose, Calif. – ADLINK Technology has partnered with Google Cloud to integrate ADLINK’s hardware and software solutions with Google Cloud IoT offerings, providing customers with an easy path to added business value by harnessing and analyzing critical operational data.
“Companies are seeking hardware solutions that are pre
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Date:
03/07/2019
The new Han ES Press HMC (High Mating Cycles) connector series from HARTING combines the facility to be installed quickly without tools with extremely robust construction that allows the devices to handle at least 10,000 mating cycles.
The quick connect technology used in the Han ES Press HMC involves the con
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Date:
03/06/2019
Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified.
These logic solutions are the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’
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Date:
03/06/2019
Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal conne
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Date:
03/06/2019
Powerbox announces the introduction of its ENI250A series designed to deliver peak power to motor start or/and high capacitive loads in factory automation applications. The three-phase ENI250A series is housed in an IP54 case, delivers a constant 250W and up to 480W peak power with an efficiency up to 94%. The ENI2
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Date:
03/06/2019
These ICs operate over a very wide frequency range with 50 Ω-match from 24 GHz up to 44 GHz, facilitating ease of design and reducing the costs of building a single platform that can cover all 5G mm Wave frequency bands including 28 GHz and 39 GHz. Additionally, the chipset is capable of flat 1 GHz RF instanta
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Date:
03/06/2019
e-peas has announced the introduction of a new power management IC specifically optimized for energy harvesting from thermal sources in wireless sensors application.
Supplied in a space-saving 28-pin QFN package, the AEM20940 is a highly advanced device based on proprietary technology that is capable of extractin
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Date:
03/06/2019
Dialog Semiconductor unveiled the SmartBond DA1469x family of Bluetooth low energy SoCs, its most advanced, feature-rich range of multi-core microcontroller units (MCUs) for wireless connectivity. The new product family which includes four variants, builds on the successes of Dialog’s SmartBond products addin
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Date:
03/06/2019
Microchip announces the new PolarFire FPGA imaging and video solution to address the challenges of developing complex computer algorithms which enable systems to capture and display information and high-resolution images. The PolarFire FPGA imaging and video solution delivers capabilities superior to alternative te
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Date:
03/06/2019
Artesyn Embedded Technologies today announced the LGA50D dc-dc module, which offers one of the highest current density ratings in the industry. With a footprint of just 1 x 0.5 inches or 25.4 x 12.5mm, this innovative non-isolated unit offers two independent and configurable 25 amp, 50 watt outputs, which can
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Date:
03/06/2019
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Figure 1: Core material performance curves
What do new applications need in order to take advantage of new devices like wide band-gap semiconductors? They need the best inductors. And what is the best inductor for your application? Answering that requires proper characterization of the inductors, which is more than can be conveniently obtained fr
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Date:
03/01/2019
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