TDK Launches Low-Power MEMS Microphone with I²S Interface to Worldwide Distribution
Fabian Battaglia, CEO of Mobix Labs
Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
Sieun Chae, assistant professor of electrical engineering and computer science, Oregon State University
New Study Offers a Better Way to Make AI Fairer for Everyone
Researchers use Large Language Models to Help Robots Navigate
From Wearables to Swallowables: USC Engineering Researchers Create GPS-like Smart Pills with AI
Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
Saurabh Daga, Project Manager of Disruptive Tech at GlobalData
Israel Bar, CEO of Maris-Tech
Artificial Intelligence Strategy May Promise More Widespread Use of Portable Robotic Exoskeletons — on Earth and in Space
Mark Chen, Vice President of Smart Sensing Business at Himax
Infineon is expanding its portfolio of CoolSiC MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages.
Figure 1. The impact of position on the appearance, lighting, and camera distance/focal length of an image
Faculty, staff and researchers from higher education and K-12 schools throughout Texas gathered in Arlington for the state’s first “Prompt-a-Thon” hosted by Microsoft and UTA’s offices of Research and Innovation and Information Technology
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Figure 1: DC-DC converter architectures
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Figure 1. The edge data center landscape (HIRO 2023)
