Technical Features

February 2017

Click image to enlarge

Figure 1: MOSFET channel punch-through showing outputs from previous SPICE simulators vs. QSPICE

QSPICE: A Mission to Get SPICE Right

Siddharth Mohan, design engineer, Qorvo

Qorvo’s QSPICE™ simulator for analog and mixed-signal simulation provides power designers with the tools to confidently evaluate their designs. Free to use, QSPICE improves SPICE basics, supports large amounts of digital logic without performance penalties, and delivers the speed and accuracy needed for rel

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Date:

11/29/2024

Increasing power density

Y. Iwasaki, M. Chounabayashi, M. Nakazawa, S. Iwamoto, Y. Oonishi, M. Hori, H. Kakiki and O. Ikawa

Current market requirements are trending towards further downsizing and increased efficiency of power conversion systems. For this reason, enhanced power density of the power modules will be critical in order to respond to the evolving needs of the market. In order to increase the power density, All-SiC modules wi

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Date:

02/28/2017

Empowering wireless charger design

Eko Lisuwandi, Linear Technology

The use of batteries in everyday devices is getting more ubiquitous. In many of these products, a charging connector is difficult or impossible to use. For example, some products require sealed enclosures to protect sensitive electronics from harsh environments and to enable for convenient cleaning or st

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Date:

02/01/2017