By: James E. Usack, Division General Manager, Electronic Devices: Semiconductor, Disc Media, Photoconductor and F&B Department, Fuji Electric
Today’s Power Electronic market is driving development of compact, low-loss, and, high-reliability IGBT modules to optimize power conversion systems. In response, Fuji Electric has developed our 7th generation X-Series IGBT technology combining enhanced semiconductor chip characteristics and improved
Figure 1: By using software from ANSYS to predict maximum temperatures and temperature distribution within its new diesel particulate filter under diverse conditions, Cummins engineers can ensure that the manufactured component will have acceptable durability.
The need for forced-air cooling should be assessed at an early stage in system electronics enclosure design. The full range of implications needs to be considered in detail for a successful outcome.
Figure 1: The challenge of dynamic performance vs. current consumption has been addressed by introducing parts that are switchable between low power mode and high performance. A typical example is ON Semiconductor's NCP4587.
Looking at products that are currently sampling, it appears that products with noise in the 10 ?VRMS range and Quiescent current in the 10-15 μA range will be in production by the end of this year, giving cell phone designers the best of both worlds in selecting their LDOs.
Ruggedized, Fast/Gigabit Ethernet rack-mount switches, such as this Hirschmann MACH1000, offer high port density and hundreds of copper/fiber media-mix options, excellent RFI/EMI shielding, and high performance - even in the harshest industrial environments and applications
Fare collection and ticketing systems are an essential part of any public transport network. Systems combine software and hardware elements such as onboard computers and driver interfaces for automated