Giovanbattista Mattiussi, Product Marketing and Dr. Diogo Varajao, Senior System Application Engineer, Infineon Technologies
The global trends - such as digitalization and energy efficiency - that have emerged and accelerated in the past few years pose new challenges to the manufacturers as well as the semiconductor market. Developing power semiconductor devices that contribute to highly efficient power management systems is on the ag
The need for forced-air cooling should be assessed at an early stage in system electronics enclosure design. The full range of implications needs to be considered in detail for a successful outcome.
Figure 1: By using software from ANSYS to predict maximum temperatures and temperature distribution within its new diesel particulate filter under diverse conditions, Cummins engineers can ensure that the manufactured component will have acceptable durability.
Ruggedized, Fast/Gigabit Ethernet rack-mount switches, such as this Hirschmann MACH1000, offer high port density and hundreds of copper/fiber media-mix options, excellent RFI/EMI shielding, and high performance - even in the harshest industrial environments and applications
Figure 1: The challenge of dynamic performance vs. current consumption has been addressed by introducing parts that are switchable between low power mode and high performance. A typical example is ON Semiconductor's NCP4587.
Looking at products that are currently sampling, it appears that products with noise in the 10 ?VRMS range and Quiescent current in the 10-15 μA range will be in production by the end of this year, giving cell phone designers the best of both worlds in selecting their LDOs.
Fare collection and ticketing systems are an essential part of any public transport network. Systems combine software and hardware elements such as onboard computers and driver interfaces for automated