Technical Features

    January 2017
    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

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    Figure 1: Two-stage 48 V power architecture for an AI server, showing IBC and downstream point-of-load regulation

    ­1. AI server power delivery raises the density challenge AI accelerators concentrate more computing, and therefore more electrical power, within limited rack and board space. Supplying these loads is not simply a matter of increasing converter output. Every power‑delivery stage must balance conversion ef
    Date:
    08/31/2026
    Step-by-step

    The ROHM Arduino-based EVK allows rapid evaluation and prototyping of stepper motor systems

    Combining ultra-precise control with long operating life, stepper motors have become a critical building block in motion-based applications ranging from white goods to factory automation and robotics to printers and point-of-sale equipment. For the designer, the challenge is to ensure the best combination of pe
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    Date:
    01/30/2017
    Piezoelectric elements have traditionally been used primarily in applications in the audio industry, operating in the human audio range (nominally 100 Hz to 18 kHz). However, subsequent improvements in device characteristics have extended their usefulness into markets which demand much-higher performance. For ex
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    Date:
    01/30/2017
    DC-DC converter modules have been around a long time and can be found in most power conversion stages of virtually every application today. As their use evolved to changing application requirements so did the design approach used to construct them. One of these trends meant that in order to preserve conversio
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    Date:
    01/28/2017
    The ability to make consistent measurements of RF or microwave power levels is vital to developing effective radio systems and networks. This article explores how different approaches affect the resultant measurements. The test case compares various approaches to making average power measurements of contin
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    Date:
    01/28/2017
    Lots of things are currently changing: Digital transformation is in full swing, changing our daily lives and demanding new business models. Many countries are facing economic and social challenges. Let’s look at how this effects distribution and what companies like Rutronik are doing to continue to move forward in
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    Date:
    01/28/2017
    Microfabrication operations such as metal lift-off, stripping, etching, plating/coating, cleaning, and de-bonding are typically wet processing procedures. Yet, selecting the equipment to perform those procedures most efficiently and cost-effectively is often not a simple matter (see Figure 1). In most cases, the
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    Date:
    01/28/2017
    Interest in electric vehicles (EVs) and hybrid electric vehicles (HEVs) is growing steadily as battery technologies improve and the driving range of such vehicles increases. Perhaps as important, EVs/HEVs offer a “green” alternative to traditional vehicles powered by internal-combustion gasoline engines. EVs and HEVs r
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    Date:
    01/28/2017
    We are all aware about self-driving cars, and all exciting projects the automotive industry is engaged in, but very few have heard about unmanned ship and projects to operate large fleets of vessels navigating from dock to dock without operational crews (see Figure 1). In early stages, projects such as Maritime Un
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    Date:
    01/28/2017
    Resolution is the most obvious battleground on which rival television and display manufacturers fight. Consumers have been willing to pay a premium for high-definition HD) displays, and, more recently, for 4k displays. Eventually, ultra-high definition 8k displays are expected to supersede the current generation of
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    Date:
    01/28/2017
    Archive

    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

    Aug 31,2026
    Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

    Silicon Carbide Semiconductors: Gaining Widespread Adoption

    Jul 30,2026
    Jens Baringhaus, Chief Expert for Wideband Gap Technology and responsible for Bosch's SiC technology roadmap

    Innovation through Lean AI

    Jun 1,2026
    Crystal Chen, Product Marketing & Product Management, Infineon HiRel

    Molded Power Inductors

    May 29,2026
    Efrain Bernal-Alzate, Design Engineer, Würth Elektronik eiSos

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