Technical Features

December 2012
Moving from Electromechanical to Solid-State in Relays and Circuit Breakers
Courtsey Eaton Corporation

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Figure 1: Contact wear in an electromechanical relay

As a mature technology, electromechanical relays and circuit breakers are well established, however they continue to suffer from some inherent weaknesses. Moving to solid-state technology can address these but introduces its own challenges. So, what is the right solution? In the movies, whenever the
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Date:
10/31/2019
Power inductors and peak-current handling capability

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Figure 1: Inductor-current waveform

As high-tech electronic products and their power supplies continue to shrink in size, design engineers should look closely at the peak-current handling capability of power inductors. Design engineers
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Date:
12/23/2012
Thermal design considerations for thin power MOSFETs

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Figure 1: SOA (a) and ZthJC (b) charts for the BSC014N04LS

Thermal challenges accompany almost all advances in power-electronic designs. Load cases not covered under a datasheet's parameters are often particularly problematic. Each new MOSFET generation
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Date:
12/19/2012
String central inverter system

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Planners of photovoltaic power plants are no longer bound to string inverter concepts if multiple MMP(maximum power point)-trackers are required. Central inverter systems are, today, standard for
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Date:
12/18/2012

Designers of solar power—photo-voltaic or PV—generating systems face some of the same problems as their counterparts in any other power-related technology: the need to constantly improve performance, reliability, longevity, and—above all—efficiency. As with any engineering endeavour, improved performance
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Date:
12/12/2012
Designing a DiSEqC-antenna phantom power-supply

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Figure 1: The DiSEqC application circuit

The DiSEqC (digital satellite equipment control) standard is a communication protocol developed by Eutelsat used between a satellite receiver (decoder), defined as the master, and satellite peripheral
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Date:
12/04/2012