Technical Features
December 2012
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Figure 1: Infineon’s four-step qualification plan for CoolGaN™ devices
Introduction
Silicon semiconductor technology has evolved considerably over the past 50 years, during which time, multiple failure modes affecting device reliability have been discovered, researched, and addressed.
This has led to the development of models and equations for failure modes like time-de
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Date:
02/24/2023
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Figure 1: Inductor-current waveform
As high-tech electronic products and their power supplies continue to shrink in size, design engineers should look closely at the peak-current handling capability of power inductors.
Design engineers
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Date:
12/23/2012
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Figure 1: SOA (a) and ZthJC (b) charts for the BSC014N04LS
Thermal challenges accompany almost all advances in power-electronic designs. Load cases not covered under a datasheet's parameters are often particularly problematic.
Each new MOSFET generation
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Date:
12/19/2012
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Planners of photovoltaic power plants are no longer bound to string inverter concepts if multiple MMP(maximum power point)-trackers are required. Central inverter systems are, today, standard for
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Date:
12/18/2012
Designers of solar power—photo-voltaic or PV—generating systems face some of the same problems as their counterparts in any other power-related technology: the need to constantly improve performance, reliability, longevity, and—above all—efficiency. As with any engineering endeavour, improved performance re
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Date:
12/12/2012
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Figure 1: The DiSEqC application circuit
The DiSEqC (digital satellite equipment control) standard is a communication protocol developed by Eutelsat used between a satellite receiver (decoder), defined as the master, and satellite peripheral
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Date:
12/04/2012
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