Technical Features
December 2012
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Figure 1. WBG and silicon power switch Infineon brands positioning
Introduction
Today’s switch-mode power supplies (SMPS) are smaller, more efficient, and lower-cost than ever. The key to their performance is the power switch technologies at their heart – but how should designers choose the right material for this and find the best component to meet their needs?
While silicon is the most widely-known constituent of semiconductors, a new group of wide bandgap (WBG) materials is increasingly finding its way into applications. One example is gallium nitride (
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Date:
09/01/2021
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Figure 1: Inductor-current waveform
As high-tech electronic products and their power supplies continue to shrink in size, design engineers should look closely at the peak-current handling capability of power inductors.
Design engineers
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Date:
12/23/2012
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Figure 1: SOA (a) and ZthJC (b) charts for the BSC014N04LS
Thermal challenges accompany almost all advances in power-electronic designs. Load cases not covered under a datasheet's parameters are often particularly problematic.
Each new MOSFET generation
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Date:
12/19/2012
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Planners of photovoltaic power plants are no longer bound to string inverter concepts if multiple MMP(maximum power point)-trackers are required. Central inverter systems are, today, standard for
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Date:
12/18/2012
Designers of solar power—photo-voltaic or PV—generating systems face some of the same problems as their counterparts in any other power-related technology: the need to constantly improve performance, reliability, longevity, and—above all—efficiency. As with any engineering endeavour, improved performance re
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Date:
12/12/2012
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Figure 1: The DiSEqC application circuit
The DiSEqC (digital satellite equipment control) standard is a communication protocol developed by Eutelsat used between a satellite receiver (decoder), defined as the master, and satellite peripheral
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Date:
12/04/2012
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