Technical Features

December 2012
Protect Small Sensors from the Harsh Industrial Environment

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Figure 1. Welding in Automotive Assembly Line

Sensors are ubiquitous in the electrically harsh industrial environment (Figure 1). As they increase in sophistication and shrink in size, they become more complex, requiring on-board switching regulators to deliver power more efficiently for minimal heat generation. How do you safely deliver low-voltage power
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Date:
03/30/2019
Power inductors and peak-current handling capability

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Figure 1: Inductor-current waveform

As high-tech electronic products and their power supplies continue to shrink in size, design engineers should look closely at the peak-current handling capability of power inductors. Design engineers
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Date:
12/23/2012
Thermal design considerations for thin power MOSFETs

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Figure 1: SOA (a) and ZthJC (b) charts for the BSC014N04LS

Thermal challenges accompany almost all advances in power-electronic designs. Load cases not covered under a datasheet's parameters are often particularly problematic. Each new MOSFET generation
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Date:
12/19/2012
String central inverter system

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Planners of photovoltaic power plants are no longer bound to string inverter concepts if multiple MMP(maximum power point)-trackers are required. Central inverter systems are, today, standard for
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Date:
12/18/2012

Designers of solar power—photo-voltaic or PV—generating systems face some of the same problems as their counterparts in any other power-related technology: the need to constantly improve performance, reliability, longevity, and—above all—efficiency. As with any engineering endeavour, improved performance
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Date:
12/12/2012
Designing a DiSEqC-antenna phantom power-supply

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Figure 1: The DiSEqC application circuit

The DiSEqC (digital satellite equipment control) standard is a communication protocol developed by Eutelsat used between a satellite receiver (decoder), defined as the master, and satellite peripheral
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Date:
12/04/2012