Technical Features

February 2020
Smart Consideration of Inductor Thermal Performance for DC-DC Converter Performance and Reliability

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Figure1: Inductor Self-heating in the core vs the winding

The efficiency and the thermal properties of key components have very real implications for the success of any converter design. Switching FETs and inductors are generally the two most considered choices determining size and performance of any converter. Though made of vastly different materials of course, and with dif
Date:
02/28/2026
All Semiconductor Switch Technologies Lead to Rome

Figure 1: Si superjunction and SiC MOSFETs have a vertical structure; GaN MOSFETs on the other hand have a lateral structure

Much is made of wide bandgap technologies, especially since GaN and SiC often have a superior performance on paper when compared to classic Si switching devices. These improvements include lower on-resistance and higher thermal conductivity, features that enable improvements in efficiency and operation at higher te
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Date:
02/29/2020
Collaborating for Success in Custom Power Magnetics Designs

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Figure 1. Simplistic inductor equivalent circuit

Despite its long history, the theory of magnetics component design still eludes many engineers, and with some justification; a good description of the effect of a magnetic field is the ‘relativistic correction to the force between charged particles when in motion.’ Many understand the behaviour of magnetics co
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Date:
02/28/2020
Designing a PoE-PD for IoT

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Figure 1: Waveforms during Startup Phase

Internet-connected devices rely on two core features, communications backhaul and power. With IoT devices, three core concerns regularly crop up: power, communications and security. Wireless technologies, like WiFi, have held the spotlight in the marketplace for years, but they struggle with these three problems. Wi
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Date:
02/28/2020
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