Technical Features

February 2020
Molded Inductors

Figure 1: Reference schematic of a buck converter Vin = 24 V; Vout = 5 V

Increasing current densities and short switching times in MOSFETs are placing ever greater stress on the dielectric strength of inductors. Molded inductors with a distributed air gap based on iron powder enable high inductance values in the smallest of spaces and thus increase the power density. A new test con
Date:
03/31/2025
All Semiconductor Switch Technologies Lead to Rome

Figure 1: Si superjunction and SiC MOSFETs have a vertical structure; GaN MOSFETs on the other hand have a lateral structure

Much is made of wide bandgap technologies, especially since GaN and SiC often have a superior performance on paper when compared to classic Si switching devices. These improvements include lower on-resistance and higher thermal conductivity, features that enable improvements in efficiency and operation at higher te
. . . Learn More
Date:
02/29/2020
Collaborating for Success in Custom Power Magnetics Designs

Click image to enlarge

Figure 1. Simplistic inductor equivalent circuit

Despite its long history, the theory of magnetics component design still eludes many engineers, and with some justification; a good description of the effect of a magnetic field is the ‘relativistic correction to the force between charged particles when in motion.’ Many understand the behaviour of magnetics co
. . . Learn More
Date:
02/28/2020
Designing a PoE-PD for IoT

Click image to enlarge

Figure 1: Waveforms during Startup Phase

Internet-connected devices rely on two core features, communications backhaul and power. With IoT devices, three core concerns regularly crop up: power, communications and security. Wireless technologies, like WiFi, have held the spotlight in the marketplace for years, but they struggle with these three problems. Wi
. . . Learn More
Date:
02/28/2020
Archives