Technical Features

February 2020
Combining GaN and Liquid Cooling for Greater Energy Efficiency in AI Data Centers

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Figure 1: Projected electricity consumption of data centers (2015 – 2030) [6]

The data center industry is at a crossroads, facing unprecedented transformation due to the surge in generative AI and other emerging technologies. This surge has massively increased the power consumption on servers, putting a strain on data centers around the world. Data centers already account for about 2 perce
Date:
04/30/2024
All Semiconductor Switch Technologies Lead to Rome

Figure 1: Si superjunction and SiC MOSFETs have a vertical structure; GaN MOSFETs on the other hand have a lateral structure

Much is made of wide bandgap technologies, especially since GaN and SiC often have a superior performance on paper when compared to classic Si switching devices. These improvements include lower on-resistance and higher thermal conductivity, features that enable improvements in efficiency and operation at higher te
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Date:
02/29/2020
Collaborating for Success in Custom Power Magnetics Designs

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Figure 1. Simplistic inductor equivalent circuit

Despite its long history, the theory of magnetics component design still eludes many engineers, and with some justification; a good description of the effect of a magnetic field is the ‘relativistic correction to the force between charged particles when in motion.’ Many understand the behaviour of magnetics co
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Date:
02/28/2020
Designing a PoE-PD for IoT

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Figure 1: Waveforms during Startup Phase

Internet-connected devices rely on two core features, communications backhaul and power. With IoT devices, three core concerns regularly crop up: power, communications and security. Wireless technologies, like WiFi, have held the spotlight in the marketplace for years, but they struggle with these three problems. Wi
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Date:
02/28/2020
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