Technical Features

    November 2025
    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

    Click image to enlarge

    Figure 1: Two-stage 48 V power architecture for an AI server, showing IBC and downstream point-of-load regulation

    ­1. AI server power delivery raises the density challenge AI accelerators concentrate more computing, and therefore more electrical power, within limited rack and board space. Supplying these loads is not simply a matter of increasing converter output. Every power‑delivery stage must balance conversion ef
    Date:
    08/31/2026
    Infineon eFuses for AI Server Power Applications

    Click image to enlarge

    Figure 1: Infineon XDP™ eFuses XDP730 and XDP72x

    ­1. The birth of eFuses AI servers are among the most demanding pieces of modern data-center equipment. Packs of GPUs, TPUs, or NPUs, ultrafast local NVMe storage, high-density memory, and massive switching fabrics push per-server power budgets into the kilowatt range. Those power rails are high-current, transient,
    . . . Learn More
    Date:
    11/28/2025
    SiC JFETs are the Future of Solid-State Circuit Breakers

    Click image to enlarge

    Figure 1: Block diagram of a solid-state circuit breaker

    ­A circuit breaker is a device used to protect electrical circuits from damage caused by overcurrent, overload, and short circuits. An electromechanical breaker (EMB), the de facto standard, consists of two separate triggers: bimetal, which is slow and tripped by overcurrent, and electromagnetic, which is fast an
    . . . Learn More
    Date:
    11/01/2025
    AI PSUs Need Cutting Edge Gate Driver ICs

    Click image to enlarge

    Figure 1: EOS worst case – high-side gate drain short whilst the low-side is on

    ­Achieving a 100 W/inch3 power density in an 8 kW SMPS, with a 97.5% peak efficiency and a compact 1U form factor can be quite the design challenge. But it is now within reach thanks to a smart combination of switching devices: ·       PFC stage: 650 V silicon carbide (SiC) MOSFETs (I
    . . . Learn More
    Date:
    11/01/2025
    Trench-Assisted Planar SiC MOSFET Architecture Overview

    Click image to enlarge

    Figure 1: Cross-sectional views illustrating the cell pitch for different Power MOSFET technologies: double trench, asymmetric trench, traditional planar, and trench-assisted planar technologies

    ­The two established architectures of silicon carbide (SiC) MOSFETs for high-power systems – planar and trench – both present a fundamental unappealing compromise for power engineers. The manufacturing simplicity of the planar gate structure enables increased yields and therefore lower costs. This stru
    . . . Learn More
    Date:
    11/01/2025
    Stacked Ceramic Capacitors’ Impact on Switch Mode Power Supplies

    Click image to enlarge

    Figure 1: Cross-sections of each type of aluminum electrolytic capacitor: wet, polymer, and hybrid

    ­Not all modern electronics require increased power density. But it’s safe to say that getting more power out of power supplies with equivalent or smaller weights and volumes is of near universal interest in the design world, regardless. Switch Mode Power Supplies Switch mode power supplies (SMPS) are on
    . . . Learn More
    Date:
    11/01/2025
    Power Over Ethernet: Driving Simplicity and Intelligence at the Edge

    Click image to enlarge

    Figure 1: A diagram displaying a PoE Switch at the center, distributing both network connectivity and power to various peripheral devices like IP cameras, IP phones, and wireless access points

    ­Ethernet has long been the backbone of digital communication. It is valued for its ability to support high data rates over long distances and its versatility across consumer, commercial, automotive, and industrial sectors. However, as the demand for intelligent edge devices grows, Ethernet is evolving. Power ov
    . . . Learn More
    Date:
    11/01/2025
    Low-Voltage, High-Current Design for Advanced Processing Solutions

    Click image to enlarge

    Figure 1: Thermal at 12VIN, 0.6VOUT, 20A load in room temperature

    ­Power solutions for advanced processing require several low voltage supplies, including 1.1V for DDR, 0.8 V for core, and 3.3 V/1.8 V for I/O devices. Because of the high density of semiconductor integration, the microprocessor is more power-hungry and requires more supply current. There is also a high dema
    . . . Learn More
    Date:
    11/01/2025
    How Wi-Fi HaLow Is Shaping the Future of IoT and Smart Cities

    Click image to enlarge

    ­At the heart of this transformation into digital ecosystems has been the Internet of Things (IoT), where connected sensors, smart meters, and embedded controls work together to optimize how cities consume energy, monitor traffic, reduce emissions, and protect public safety. As the scale and complexity of these
    . . . Learn More
    Date:
    11/01/2025
    Power Relays in HVAC Design

    Click image to enlarge

    Figure 1: Power relays play a critical role in controlling high-power loads in HVAC systems

    ­Power relays act as the essential switching elements that allow a thermostat or controller to direct real power flow. Each time a compressor engages, a fan motor starts, a heating strip energizes, or a heat pump shifts modes, the relay must execute a clean, consistent, and safe state transition (Figure 1). Be
    . . . Learn More
    Date:
    11/01/2025
    Archive

    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

    Aug 31,2026
    Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

    Silicon Carbide Semiconductors: Gaining Widespread Adoption

    Jul 30,2026
    Jens Baringhaus, Chief Expert for Wideband Gap Technology and responsible for Bosch's SiC technology roadmap

    Innovation through Lean AI

    Jun 1,2026
    Crystal Chen, Product Marketing & Product Management, Infineon HiRel

    Molded Power Inductors

    May 29,2026
    Efrain Bernal-Alzate, Design Engineer, Würth Elektronik eiSos

    Power Systems Design

    146 Charles Street
    Annapolis, Maryland 21401 USA

    Power Systems Design

    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

    Published 12× per year across North America and Europe, Power Systems Design is distributed through online and fully digital editions, complemented by eNewsletters, webinars, and multimedia content. The platform covers key areas including power conversion, semiconductors, renewable energy, automotive electrification, AI power systems, and industrial applications—supporting innovation across the global electronics industry.