Technical Features

April 2018
Fuji Electric 7th Generation IGBT Technology Powers Today’s High Efficiency Energy Conversion Systems

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Figure 1: IGBT cross sectional structure

Today’s Power Electronic market is driving development of compact, low-loss, and, high-reliability IGBT modules to optimize power conversion systems. In response, Fuji Electric has developed our 7th generation X-Series IGBT technology combining enhanced semiconductor chip characteristics and improved
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Date:
06/16/2019
The pursuit of higher efficiency has been a driving factor in industry progress since electricity was first harnessed.  The introduction of solid state transistors in switching applications enabled the switching power converter and created a step function improvement in power conversion efficiency.  Advances
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Date:
04/25/2018
The introduction of improved semiconductor devices, namely wide bandgap types such as Silicon Carbide(SiC) and Gallium Nitride (GaN) will enable significantly higher performance power switching applications, especially in applications such as automotive traction inverters.    SiC power semiconductor
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Date:
04/24/2018
SiC Cascodes: Fast-Track to Wide-Bandgap Performance and Efficiency

Figure 1. SiC cascode configuration

SiC MOSFETs can deliver impressive performance and efficiency gains in power-conversion circuits, but a clean-sheet design is needed for best results. SiC cascodes offer a drop-in replacement bringing instant access to many of the advantages of wide-bandgap devices. Drop In, Turn On Silicon
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Date:
04/24/2018

Advanced Cooling and Efficient Semiconductor Technology is a Winning Combination

Figure 1: 3D model depicting Dual Cool technology

Power engineers often face seemingly conflicting and almost impossible challenges. As system designers add more features and functionality to newer product generations, so the system requires more power, but has less space available to generate it. While there are many techniques available to manage heat, forced
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Date:
04/23/2018
Powering the Future with Intelligence and Efficiency

Figure 1: Comparison of the normalized area of a chip versus the voltage rating of the best MOSFETs, in blue, with the latest generation of GaN FET (Source Efficient Power Conversion (EPC))

In March 2018, the Applied Power Electronics Conference (APEC) took place in San Antonio (Texas). APEC is the world’s largest convention dedicated to applied power electronics, and the place where research laboratories, universities, market analysts and companies showcase the latest and often ‘industry first’
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Date:
04/23/2018
Fundamentals of Switching Regulators

Figure 1: Linear regulator

Electronic equipment uses ICs in order to function, requiring a DC voltage as the supply input at various voltage levels. The AC power line (utility supply wall outlet) or DC power (batteries, solar panels, etc.), are the main power inputs. DC-DC power conversion technology enables these energy sources to be
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Date:
04/23/2018
Efficient Redundancy for Power Supplies

Figure 1: A load current of 40A creates approximately 20W of power losses - a heavy thermally induced stress for power electronics

N+1 redundant power module connection guarantees reliable system availability even if a power supply fails. However, the common use of decoupling diodes in such modules causes a large voltage drop leading to high power losses generating heat. After a complete design review, PULS is now replacing these
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Date:
04/23/2018
Light Emitting Diodes (LEDs) are semiconductor devices which provide an efficient and reliable source of light and contain no moving parts, making them very reliable in environments with elevated vibration and shock, such as automobiles. Other desirable properties include high efficiency, long life and brightness.
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Date:
04/16/2018
Choosing a Fan Design That Minimizes Trade-Offs

Figure 1. Cross section of a sleeve bearing

In the same way that oxygen and water are essential to human life, cooling fans are critical to many of the devices we rely on every day. From home appliances to industrial-grade machinery, and from laptop computers to the large-scale data centers, the need to remove hot air is essential. If the fan fails, the
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Date:
04/10/2018
A Smart Solution for Smart Meter Power-Path Management

Figure 1. Circuit schematic

Some smart meter applications require an external wireless communication module to be attached to them. The power requirements imposed are that the module should limit its supply current to be within a 100 – 150mA range. There is also a requirement for a super capacitor (supercap) backup supply to continue
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Date:
04/10/2018
Adding a GUI to Control Systems

Figure 1. Gen4-uLCD-43DCT-CLB display module from 4D Systems

Replacing multiple electromechanical and optoelectronic elements with a touch-sensitive LCD can significantly extend a product’s lifetime. It could also reduce the overall size of the product, particularly if the space required for the PCB is much smaller than that used for the electromechanical controls.
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Date:
04/10/2018
How to Prevent Solid State Relay Failure in Power Supplies for Industrial Systems

Figure 1. Advantages of solid-state switching technology

What do large industrial/commercial HVAC and refrigeration systems, heavy duty transportation, conveyor belts, assembly lines, medical, energy and other complex manufacturing systems all have in common? Electrical motors. Big and expensive electrical motors that, if their power supply system overheats, can be
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Date:
04/10/2018
New Ultralow Quiescent Current Buck-Boost Converters Power Industrial Systems & More

Figure 1. LTC3130 Typical Application Schematic and Features

A buck-boost DC/DC converter is one of the most valuable tools in a power supply designer’s toolbox for dealing with a variety of power conversion scenarios. In these situations, input voltages can vary widely due to non-ideal or multi-input power sources, transient disturbances or charging and discharging
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Date:
04/10/2018
TSN With Off-The-Shelf Standard Components

Figure 1. Structure of the TDMA function

Extensions to the IEEE 802.1Q standard for Ethernet switching, listed under the generic term "Time Sensitive Networking" (TSN), allow automation solutions with homogeneous network architecture from sensors to the cloud. In contrast to this, traditional solutions using proprietary network standards
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Date:
04/10/2018
Optimized Buck Regulators with Integrated MOSFETs Raise Power Density to New Levels

Figure 1. The FAN6500XX in a typical application

Integration is fundamental to solid-state electronics — the ability to bring together similar and complementary functions into a single device drives the entire industry. When coupled with developments in packaging, wafer handling and lithography, feature density continues to rise, delivering more efficient
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Date:
04/09/2018
Power-Over-Ethernet: The Missing Link Between Digital Ceilings and a New Breed of Smart Buildings

Figure 1. Digital Ceiling Ecosystem

We are in the digital era when enterprises are embracing innovative technologies to create new experiences and business opportunities. This transformation has given rise to some revolutionary applications, including digital ceilings that have gained immense popularity by connecting everything associated with
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Date:
04/09/2018
In recent years, significance of semiconductor module for photovoltaic power conversion systems is increasing. Especially higher output power with existing housing size of power module is important to realize further downsizing or rating upgrade for its systems. For realizing higher
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Date:
04/03/2018