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Figure 1: MOSFET channel punch-through showing outputs from previous SPICE simulators vs. QSPICE
Figure 1. SiC cascode configuration
Figure 1: A load current of 40A creates approximately 20W of power losses - a heavy thermally induced stress for power electronics
Figure 1: Linear regulator
Figure 1: Comparison of the normalized area of a chip versus the voltage rating of the best MOSFETs, in blue, with the latest generation of GaN FET (Source Efficient Power Conversion (EPC))
Figure 1: 3D model depicting Dual Cool technology
Figure 1. Structure of the TDMA function
Figure 1. LTC3130 Typical Application Schematic and Features
Figure 1. Advantages of solid-state switching technology
Figure 1. Gen4-uLCD-43DCT-CLB display module from 4D Systems
Figure 1. Circuit schematic
Figure 1. Cross section of a sleeve bearing
Figure 1. Digital Ceiling Ecosystem
Figure 1. The FAN6500XX in a typical application
