Technical Features
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Figure 1: Gate driver circuit diagram with a Bourns transformer
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Figure 1: Key features required for AC-DC SMPS in the latest generation of telecom applications
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Table 1a: Key performance indicators of silicon (Si)-based superjunction technology CoolMOS™ C7 compared to SiC MOSFET CoolSiC™ and GaN HEMT technology CoolGaN™
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Figure 1: Comparison of temperature dependency of the on-state resistance for different semiconductor technologies, such as Infineon’s CoolMOS™, CoolSiC™, and CoolGaN™
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Figure 1: Genesys+ DC programmable power supply
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Figure 1: Medical power system with secondary DC-DC
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Figure 1 – Wind-farm Markbygden 1101 up-North Sweden deploying more than 1100 wind turbines (Picture: PRBX / Courtesy of Svevind AB Markbygden 1101)
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Figure 1. Multi-module Telecom-server Hot-Swap Applications
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Figure 1. LT3033 typical application
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Figure 1: Base station energy consumption rise (adapted from Huawei data)
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Figure 1. Common battery-powered applications that use LDOs
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Figure 1: Infineon Technologies CoolSiC 1200V SiC Trench MOSFETs support higher switching frequencies with reduced heat dissipation in a space-saving package. (Source: Mouser Electronics)
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Figure 1: Circuit diagram of the proposed solution using CoolMOS™ in a half-bridge configuration
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Figure 1. Simplified circuit of the active clamp flyback (ACF) topology
