Technical Features

    February 2025
    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

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    Figure 1: Two-stage 48 V power architecture for an AI server, showing IBC and downstream point-of-load regulation

    ­1. AI server power delivery raises the density challenge AI accelerators concentrate more computing, and therefore more electrical power, within limited rack and board space. Supplying these loads is not simply a matter of increasing converter output. Every power‑delivery stage must balance conversion ef
    Date:
    08/31/2026
    New Rad Hard MOSFET Technology Drives Higher Power Efficiency and Reliability in Space

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    Figure 1: Half-cell diagrams of the N-Channel SJMOSFET (a) and N-Channel VDMOSFET (b)

    ­When designing a robust and high-density power architecture for space systems like satellites, engineers must grapple with a variety of design complexities, including limited board space, power dissipation requirements, and damaging radiation effects. To address these challenges and reach peak operational per
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    Date:
    02/28/2025
    Welcome to the GaN Era

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    ­Size, weight and performance are three attributes that constantly propel electronics development. Throw in the need for ultra-efficiency driven by market requirements and international regulations, plus the absolute need to address sustainability, and you’ll see why gallium nitride is gaining such huge traction as
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    Date:
    02/01/2025
    Using GaN Technology in Switch-Mode Power Supplies

    Figure 1. Necessary components to consider when using GaN technology as power switches in a power stage of the LTC7800 buck converter.

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    ­GaN switches typically have lower gate voltage ratings than silicon FETs. Most GaN manufacturers recommend a typical gate drive voltage of 5 V. Some have an absolute maximum rating of 6 V, which does not give much headroom between the recommended gate drive voltage and the critical threshold, above which would da
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    Date:
    02/01/2025
    A Combined Approach Simplifies EV On-Board Charger Design

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    Figure 1: Totem-pole PFC demonstration application

    ­An essential component for electric vehicles (EVs) is the On-Board Charger (OBC), which transforms alternating current (AC) into direct current (DC) to replenish the vehicle's high-voltage battery. The efficacy and dependability of OBCs significantly influence the entire performance and user experience of EVs
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    Date:
    02/01/2025
    Optimizing PCB Thermal Design for GaN FETs: A Guide for Power Electronics Engineers

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    Figure 1: Cross-section view of GaN devices mounted on a PCB in a half-bridge configuration without a heatsink and the equivalent thermal circuit

    ­Effective thermal design at the printed circuit board (PCB) level can substantially improve cooling without the need for a heatsink. This article presents simple thermal management guidelines maximizing heat conduction from the GaN FETs to the environment using just the PCB and optimizes thermal performance wi
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    Date:
    02/01/2025
    Powering the Future: Direct Current to Fast-Track Clean Energy Solutions

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    Figure 1: The new DC Authentix charger and modular site design enable rapid deployment of EV charging hubs for rideshare, robotaxis, and truck depots. Pre-configured components ensure fast assembly and operational readiness

    ­Over the past 15 years, working in energy storage and fleet electrification, one thing has become clear: the traditional alternating current (AC) grid, which has served us for over a century, can’t meet the demands of rapid clean energy adoption, especially in power-hungry sectors like electric vehicle (EV) in
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    Date:
    02/01/2025
    A Top-Side Cooled Package to Best Dissipate Heat

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    Figure 1: TOLT (a), PowerPAK 8x8R (b), and CCPAK1212i (c)

    ­In recent years, semiconductor manufacturers have developed power component packages which use a different thermal management approach - instead of placing the thermal pad on the bottom of a device pointing towards the PCB, the exposed metal pad is placed on the top side of the device. It has been shown that to
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    Date:
    02/01/2025
    Why Choose Polymer for Capacitors?

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    Figure 1: Similarities and differences in the construction of polymer capacitors (Source: Kemet)

    ­Aluminum electrolytic capacitors are polarized capacitors in which the anode and cathode are made of aluminum. They can have either a wet electrolyte, a solid conductive polymer, or a hybrid (wet and solid conductive polymer) electrolyte. In aluminum electrolytic capacitors, both electrodes are made of a
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    Date:
    02/01/2025
    Driving the Future of Intelligent Robotics and Smart Home Devices with FPGAs

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    Figure 1: A Field Programmable Gate Array, or FPGA, is a type of integrated circuit (IC) that enables the development of custom logic for rapid prototyping and final system design. FPGAs are different than other custom or semi-custom ICs due to their inherent flexibility....

    ­The global smart homes market is projected to grow at a CAGR of 20.35% from 2023 to 2030 and, the global industrial robotics market is anticipated to expand at a CAGR of 11.65% over the same period according to ABI Analytics. As adoption across both markets accelerates, Field Programmable Gate Arrays (FPGAs) ar
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    Date:
    02/01/2025
    Archive

    Gate Driver Choices for High Power Density Intermediate Bus Converters in AI Servers

    Aug 31,2026
    Jeffrey Cumabig, Product Application Engineer, and Lei Song, Product Definition Engineer, both for gate drivers at Infineon Technologies AG

    Silicon Carbide Semiconductors: Gaining Widespread Adoption

    Jul 30,2026
    Jens Baringhaus, Chief Expert for Wideband Gap Technology and responsible for Bosch's SiC technology roadmap

    Innovation through Lean AI

    Jun 1,2026
    Crystal Chen, Product Marketing & Product Management, Infineon HiRel

    Molded Power Inductors

    May 29,2026
    Efrain Bernal-Alzate, Design Engineer, Würth Elektronik eiSos

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