Technical Features

May 2018

Figure 1: Power schematic circuit for the bi-directional three-level, two-phase converter

Optimizing Flying Capacitor Multilevel Converters for GaN Technology

Alejandro Pozo Arribas, Senior Applications Engineer, Efficient Power Conversion (EPC)

Introduction Modern power systems demand higher efficiency, increased power density, and reduced electromagnetic interference (EMI)—all while adhering to shrinking size constraints. Among the converter topologies addressing these challenges, the Flying Capacitor Multilevel (FCML) converter stands out for it

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Date:

05/30/2025

Determination of the Ideal Power Inductor for Energy-Efficient Applications

Alexander Gerfer, Ranjith Bramanpalli, Jochen Baier, Würth Elektronik

Energy-efficient devices are important components for saving resources and protecting the environment. The more efficient the electronics, the longer the battery service life for mobile devices - and in large-scale industrial and server installations with thousands of loads, the energy requirement is markedly re

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Date:

05/28/2018

Advanced packaging methods for modern power supplies

Stefan Preimel, Concept and Application Engineer, Infineon Technologies

No matter the technical innovation or application, all modern technologies have one thing in common; they rely on a reliable, small and high performance power supply to be able to function and meet their specification. As end products become more complex, the design parameters for the power supply become more ch

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Date:

05/11/2018

Figure 1: Simplified hardware diagram

1.5kW Digital Totem Pole PFC Design for Air-Conditioner Using iMOTION Digital Controller

Wei Wu, Infineon Technologies

A lot of research focuses on bridgeless PFC in order to achieve higher system efficiency compared to traditional boost PFC. Most of the bridgeless PFC solutions suffer from EMI issues, which cause problems in applications where an inverter stage shares the same ground. In this case, the PFC stage generates

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Date:

05/09/2018