Technical Features

June 2010
Optimizing Flying Capacitor Multilevel Converters for GaN Technology

Figure 1: Power schematic circuit for the bi-directional three-level, two-phase converter

Introduction Modern power systems demand higher efficiency, increased power density, and reduced electromagnetic interference (EMI)—all while adhering to shrinking size constraints. Among the converter topologies addressing these challenges, the Flying Capacitor Multilevel (FCML) converter stands out for it
Date:
05/30/2025
Keeping Systems Running Cooler
Taming the heat is one of the biggest design challenges facing system architects and power supply manufactures today. Free air flow through the power supply is critical for improving performance
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Date:
06/01/2010

Isolate to Communicate
RS485 networks provide the backbone for communications in applications ranging from industrial control systems to roadside traffic message boards. In environments where high voltages are present,
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Date:
06/01/2010
Maximized Manufacturability
Customers of power electronics increasingly require new, easy connection and mounting technologies. PressFIT technology creates the possibility of solderless mounting combined with an improved
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Date:
06/01/2010
Custom Power
Despite the best intentions at the outset of an electronic product's design, it is commonplace for the power supply specification to evolve during the process and to only be finalized late on.
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Date:
06/01/2010
Contain the Heat
Over the past few years, several manufacturers have developed high-power handling general purpose chip resistors covering a wide resistance range. Most of these high-power chip resistors are extensions
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Date:
06/01/2010
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