Technical Features
June 2010
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Figure 1 Technology positioning – Si, SiC and GaN
The global trends - such as digitalization and energy efficiency - that have emerged and accelerated in the past few years pose new challenges to the manufacturers as well as the semiconductor market. Developing power semiconductor devices that contribute to highly efficient power management systems is on the ag
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Date:
09/03/2020
Taming the heat is one of the biggest design challenges facing system architects and power supply manufactures today. Free air flow through the power supply is critical for improving performance
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Date:
06/01/2010
RS485 networks provide the backbone for communications in applications ranging from industrial control systems to roadside traffic message boards. In environments where high voltages are present,
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Date:
06/01/2010
Customers of power electronics increasingly require new, easy connection and mounting technologies. PressFIT technology creates the possibility of solderless mounting combined with an improved
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Date:
06/01/2010
Despite the best intentions at the outset of an electronic product's design, it is commonplace for the power supply specification to evolve during the process and to only be finalized late on.
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Date:
06/01/2010
Over the past few years, several manufacturers have developed high-power handling general purpose chip resistors covering a wide resistance range. Most of these high-power chip resistors are extensions
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Date:
06/01/2010
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