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Technical Features

June 2010
Comm Equip Makers Demand High Power Output & Small Footprint

Figure1. LTM4622(A) Can Be Mounted on the Underside of a PCB

Comm Equip Makers Demand High Power Output & Small Footprint
Tony Armstrong Marketing Director, Power Products Analog Devices, Inc.

Many communications systems are powered via a 48V backplane. This voltage is normally stepped down to a lower intermediate bus voltage, typically to either 12V, 5V or even lower, in order to power the racks of boards within the system. However, most of the sub-circuits or ICs on these boards are required to
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Date:
09/29/2018
Contain the Heat
Contain the Heat
Kory Schroeder, Director of Marketing, Stackpole Electronics Inc

Over the past few years, several manufacturers have developed high-power handling general purpose chip resistors covering a wide resistance range. Most of these high-power chip resistors are extensions
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Date:
06/01/2010
Custom Power
Custom Power
Steve Willis, Deputy UK Managing Director, XP Power

Despite the best intentions at the outset of an electronic product's design, it is commonplace for the power supply specification to evolve during the process and to only be finalized late on.
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Date:
06/01/2010
Maximized Manufacturability
Maximized Manufacturability
Marc Buschkühle and Thilo Stolze, Infineon Technologies AG, Warstein, Germany

Customers of power electronics increasingly require new, easy connection and mounting technologies. PressFIT technology creates the possibility of solderless mounting combined with an improved
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Date:
06/01/2010

Isolate to Communicate
Isolate to Communicate
Jeff Marvin, Design Center Manager and Brian Jadus, Senior Design Engineer, Mixed Signal Products, Linear Technology Corporation

RS485 networks provide the backbone for communications in applications ranging from industrial control systems to roadside traffic message boards. In environments where high voltages are present,
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Date:
06/01/2010
Keeping Systems Running Cooler
Keeping Systems Running Cooler
Michael Bean, Global Product Manager, High Current Power, Molex Incorporated, Lisle, Illinois

Taming the heat is one of the biggest design challenges facing system architects and power supply manufactures today. Free air flow through the power supply is critical for improving performance
. . . Read More
Date:
06/01/2010
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